G-Series Thermal Compound Benchmark Thread

I today conducted a total dissassembly and Thermal Compound repaste and would like to log my results on a weekly basis, this repaste is so far prooving to be my best. I would like anyone who is interested with any model of G-Series to compare Thermal Compound results in this thread using the diagram below.

(PLEASE KEEP THIS THREAD FOR THERMAL BENCHMARKS NOT FOR RANDOM DISCUSSION OR ARGUMENTS THIS IS FOR COMPARISON ONLY)
(YOU REPASTE, BENCHMARK AND STRESS AT YOUR OWN RISK)
(PLEASE RUN ALL TESTS AT STOCK)

Feel free to post any G-Series Repaste result using any thermal compound but completing My Diagram below to show exactly what you are using so that others can compare different types of thermal compound against different setups.

Programs To Use: Furmark 1.9.0 - HWINFO - Prime95 - Imageshack

VERY IMPORTANT: please use the Forum Thumbnail code when uploading your image to abide by forum rules and not spam the thread.

Please run both tests for 10 mins and with this setting for your GPU burn in test and with this setting for your CPU torture test.

Feel free to add any other information in your post with your Benchmark.

Diagram

Model: G73 JH
CPU/GPU: 720QM/5870M
Thermal Compound: Innovation Cooling Diamond (Others: Arctic Silver, Shin Etsu, Arctic Cooling -MX-, Tuniq, Antec)
Method: Pea Method (Others: Line, credit card or finger, cross)
Week/Date: Week 1 / June 2011
Ambient Temperature: 20oC
GPU: Maximum Temperature: 80oC

CPU: Maximum Temperature: 69oC

 

Here's mine. Kind of did a rush job in my repaste and put on more than what was needed. What's good about ICD is that if you put too much your temps don't suffer as much as some of the other compounds. Test done with laptop flat on my desk which has a black finish so that probably retains some of the heat.


G73JH, Ambient 27C, ICD, Pea GPU, Line CPU

CPU


GPU