Keyboard warmer after g73JH repaste?

Hi all,

Finally got around to repasting my g73JH, temps were ok before but wanted to fix the damn touchpad so repasted at the same time as I cleaned off the tape on that and removed the silver foil.

All went fine on repaste, avoided destroying speaker plug or any other internals, and went back fine. Tuchpad is finally reliable it seems.

Temps are better than before, pretty much like new. 49-53C idle across 3 sensors, and 79C on furmark on highest sensor (TSS1). Ambeint is about 22C.

One thing I have noticed is that the keyboard seems to get a little hotter than before. I am pretty sure that even under gaming it was cool all across the board, now it gets a little warm (not hot, just warm) pretty much centred on "jkl;". Numpad and further right is cool, and everything left og "H".

Although I checked the thermal pad on the bottom of the service panel was in place when taken off I was wondering if this could have shifted/slipped on reattaching it, and if so would that cause more heat to reach the keyboard?

The only other thing I can think of is that on the heatsink/fan I loosened the tape to get it out, and it wasn't super sticky to reattach. So if the tape connecting the two came off would there be more heat leakage inside?

Not a big thing, but am curious as to whether it's likely to be either.

 

I would still be thinking the north bridge, or at least what replaced the north bridge on the new motherboards but I cannot remember its new name haha even so its the chip under the grey square thermal pad you mention in your post and as you say you have checked it and it all seemed ok.

As that thing is stuck on pretty well it should be fine but an easy way to check this is when the keyboard is warm fire up HWINFO sensors and take a peak at your PCH temperature which should really be below the 70oC region. If it is high then might be an idea to go back in and check it may not be thermal pad related if the top cover is not reseated properly over it there may be no contact.

The tape you mention does act as a bond between the heatsink and fan and allows cleaner air flow when you reassemble these will be pushed quite firm together the tape acts as an added extra and on my Clevo the heatsinks dont really line up and have no tape on them and it makes no difference.



If your temps are fine on the HWINFO sensors I really dont think you need to worry sometimes shifting components around can make some changes in the way it acts after reassembly and it will take sometime to settle I did mine 12 or 13 times and each time I did it was different.

I miss mine so much I may be returning in time for the G75

 

Thanks for the info. Strangely on HWinfo I don't get a report on PCH temperature.. it has PCH wattage, but no temperature (just cpu/gpu/hd temp). Everything seems cool enough so will wait till I upgrade to a 920xm (once my warranty is up) and check the pad then.

The pads on the video card memory were like jelly/rubber.. is this normal? When I removed the heatsink they flopped off, but managed to reseat them ok. Totally different to the ones on my Dell XPS m170 which were solid... as long as they work I guess!

After my initial worries about opening it wasn't too bad, though I reckon you might have a record with 13 openings! Bet your time to repaste was sub-30 minutes by the final one

 

Mine sometimes did not register the PCH either must be something that makes it kick into effect try a restart and check HWINFO again.

The pads you refer to are the thermal pads that cover the Vram as long as they have been replaced you dont really need to worry, I think there were a couple of other smaller pads covering the controllers as well but they were not very well positioned that heatsink is a knightmare shape.

I would repaste and immedietely after be unhappy with it and go back in haha I love a challenge, one thing the clevo does not have as it is completely accessible.