Processor upgrade... repaste ??

Hello all

I am upgrading the processor on my g73jw and had a few questions...

I was going to repaste my CPU obviously and the GPU also while i'm in there.

I have read and gathered to simply place about a 5 mm size ball on the GPU and allow the heatsink to spread it around.

CPU side, should it be spread around and evenly applied before attaching the heatsink? I never heard of applying a ball of paste without spreading so figured I better ask about input on the CPU just to be safe.

ALSO... what about thermal pads? is it a good idea and common practice to replace with say .5 mm with 12.0 w/mK? that was the highest w/mK I found and figured the higher the better?

EDIT: Probably the wrong place to post a question like this but figured could get more specific answer for the G73 such as the ball of paste on the GPU

 

Everyone has a different theory (and youtube video) of which method works best. I prefer to go with the small dot and let the plate do the spreading.

Regarding thermal pads, it can never hurt to replace them when you repaste. It's often skipped just because it is more tedious and harder to see a big benefit, but it's not a bad idea. The 0.5mm should most likely work as it seems the G73 doesn't cram them in too tight. The only thing you want to be wary of is that most people agree the heatsinks need all the pressure they can get, and if your pads are too thick then you'll be removing that much needed pressure from the heatsink. Make sure you get things put back together tight.

Don't forget to give those heatsinks a good cleaning while you have it open.