I have a general question. The GPU in the C90s is an MXM II card with a heat sink affixed to the board on one side. It makes contact with the processor and has these "pads" that contact the memory chips. There is thermal compound on the processor but not the pads, is this normal or should it be on the pads as well. Is it ok to add some to those pads?
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It is quite common for the memory modules to use gaps pad since the RAM doesn't always contact the heatsink like the GPU core does. I've seen this same exact thing on my 8800GTX in fact. -
Good to know, thanks.
C90s and Arctic compound
Discussion in 'Asus' started by Zenica, Apr 13, 2008.