Hi,
I'm assuming to combine a cooling pad (with metal grille) with a semiconductor cooling system.
The principle is based on bringing cold air to the laptop and inside it to ensure more effective heat exchange.
And whether to add thermal pads on the heatsinks (Where the heat passes to the dissipative fins) to transfer heat to the lower body? [example ] ( https://drive.google.com/file/d/1F7lVGqyPBa-MY3p7fbGe8PybDN9-lxaH/view?usp=drivesdk)
The question is... Could there be condensation in case the temperature difference is high enough?
The idea would be to use a KLIM ULTIMATE as pad.
In the pictures I indicate the possible position of the cooler.![]()
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Cooling pad combined with a semiconductor cooling system used on gaming phones.
Discussion in 'Asus' started by Raid0ss, Nov 4, 2021.