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    Nvidia contract makers in Taiwan low-key over defective chip reports

    Discussion in 'Dell XPS and Studio XPS' started by d1anec3, Jul 10, 2008.

  1. d1anec3

    d1anec3 Notebook Geek

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    http://www.cpu3d.com/content/view/5332/67/

    Posted by Winston Chim on Friday, 04 July 2008. 11:00 GMT


    Detective chips fron Nvidia? Oh dear ... but only relates to Nvidia Geforce 8500M-series graphics chips launched in 2007. Phew ... got you worried there, didn't we?

    Digitimes

    "Nvidia's Taiwan-based graphics chip contract makers are being low-key after the US chip designer informed investors on July 3 that will take a charge of US$150-$200 million related to expenses stemming from issues discovered with die/packaging materials used in previous generation notebook products.

    With Nvidia indicating that the problem is due to the packaging material used with some of its chips, which was compounded by the thermal design of some notebooks, industry sources in Taiwan believe the problem is most likely related to either the solder bumping process used by one (or more) of Nvidia's manufacturing partners or the company's PCB substrate supplier(s).

    Sources at foreign institutional investors in Taiwan indicated that the defective products were Nvidia Geforce 8500M-series graphics chips launched in 2007, and that the problem was caused by related bump processing. Taiwan Semiconductor Manufacturing Company (TSMC), Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industrial (SPIL) all provide bump processing services to Nvidia."
     
    d1anec3, Jul 10, 2008
    #1