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    If you re-applied your M1330 cpu, gpu, or chipset thermal paste/pad, share here

    Discussion in 'Dell' started by KevinN206, Apr 5, 2008.

  1. KevinN206

    KevinN206 Notebook Enthusiast

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    I know we have discussed this topic spread across a few posts. It would seem better to consolidate them into one. If you re-applied your CPU, GPU, and/or Chipset with a new thermal paste/pad, please share your experience.
    1. Before and after temperatures.
    2. Did you use thermal paste/pad for all three cores or selectively? (i.e. you used thermal paste such as AS5 for CPU but used pads for the other two or kept the other two unchanged, etc...)

    I heard the problem with reapplying thermal paste is due to a gap between the heatsink and the GPU. Is that correct? So thermal pad is recommended for GPU instead?
     
    KevinN206, Apr 5, 2008
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  2. ACHlLLES

    ACHlLLES Notebook Virtuoso

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    I did apply AS5 for CPU area, but kind of hard to get around the thermal pad on GPU, so didn't mess w/ GPU pads.
     
    ACHlLLES, Apr 5, 2008
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  3. KevinN206

    KevinN206 Notebook Enthusiast

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    ACHlLLES, did you pull off the heatsink when the laptop was at room temperature or after using it for awhile?

    I am debating whether I should redo the CPU, although I am more concerned about the 8400M. Gaming brings the temperature to about 90C, so I haven't played any game for awhile.

    Does anyone know (or a good estimate) the thickness of the GPU pad?

    I found a few pads here: Artic Cooling Thermal Pads. The 0.5mm thickness seems good enough. I am wondering what's the 8400M die dimension.
     
    KevinN206, Apr 12, 2008
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