The Notebook Review forums were hosted by TechTarget, who shut down them down on January 31, 2022. This static read-only archive was pulled by NBR forum users between January 20 and January 31, 2022, in an effort to make sure that the valuable technical information that had been posted on the forums is preserved. For current discussions, many NBR forum users moved over to NotebookTalk.net after the shutdown.
Problems? See this thread at archive.org.

    Thermal transfer, What to use?

    Discussion in 'Dell' started by zanthros, Oct 2, 2012.

  1. zanthros

    zanthros Notebook Enthusiast

    Reputations:
    0
    Messages:
    15
    Likes Received:
    0
    Trophy Points:
    5
    Hello all! I have disassembled my 1720 for cleaning and I would like to replace all of the thermal pads and thermal compounds that are currently on it with a better type. Can I use copper shims to replace the thermal pads found on the chipset and on the GPU memory? If so what thicknesses on each? I plan on using AS5 on the processor and the GPU unless there is a better product for the job. I do realize that the use of thermal pads was implemented due to the manufacturing inconsistencies of the assembled height of the final product but can you use the copper shims and what would be the difficulties of implementation of this plan? I'm looking for some good advice from someone who has been down this road before. Thanks
     
  2. djjonastybe

    djjonastybe Notebook Consultant

    Reputations:
    13
    Messages:
    183
    Likes Received:
    11
    Trophy Points:
    31
    I tried Arctic Silver 5 which is supposed be be very good. Didn't make a difference. It's the cooling itself that's not very good. in notebooks. Or maybe I did it wrong :D