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    Intel Skylake-E, LGA 3647 socket, 6-channel DDR4

    Discussion in 'Desktop Hardware' started by hmscott, Jun 5, 2016.

  1. hmscott

    hmscott Notebook Nobel Laureate

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    hmscott, Jun 5, 2016
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  2. hmscott

    hmscott Notebook Nobel Laureate

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    hmscott, Jun 5, 2016
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  3. Ethrem

    Ethrem Notebook Prophet

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    That is one monster socket... :eek:
     
    Ethrem, Jun 5, 2016
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  4. hmscott

    hmscott Notebook Nobel Laureate

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    Some of the articles on Reddit about this have been tagged "Debunked" - but no further explanation.

    I looked around and found this page copyright 2009-2010 with a LGA 3647 heatsink solution... I don't recall a CPU with that pin-out before this, but it may be so, or the heatsink site hasn't updated their product page template since 2009-2010 :)

    I will update if I find anything new, or old :)

    http://www.cooljagusa.com/index.php?m=content&a=index&classid=95&id=430

    Photograph [​IMG]
    Application Intel Socket 3647
    Dimension 108Lx78Wx25.5H(mm)
    Weight 257.6g
    Heatsink Material AL fin stack + D6 PIPE+CU base
    Fastener Screw+Spring
     
    Last edited: Jun 5, 2016
    hmscott, Jun 5, 2016
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  5. hmscott

    hmscott Notebook Nobel Laureate

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    The "debunked" may be a confusion around the naming or pedigree of the socket, whether it's Skylake Purley Xeon or Skylake-E, or Intel Phi and how it all relates.

    From 1 year ago:

    Massive Intel Xeon E5 and Xeon E7 Leak – Skylake Purley to be the Biggest Advancement Since Nehalem

    But, that chart shows Skylake Purley coming out in Q3 2017. Quite a bump up in delivery date if it is Skylake Purley. Also, it's supposed to have new memory technology, no DDR4.

    So Skylake-E fits the picture a bit better...
     
    Last edited: Jun 6, 2016
    hmscott, Jun 5, 2016
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  6. Ethrem

    Ethrem Notebook Prophet

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    Hard to say with no EXIF data.

    The filename would seem to suggest December of 2015 though.
     
    Ethrem, Jun 5, 2016
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  7. hmscott

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    Last edited: Jun 5, 2016
    hmscott, Jun 5, 2016
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  8. hmscott

    hmscott Notebook Nobel Laureate

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    Intel’s 28-core Xeon ‘Skylake’ CPUs to support 6TB of DRAM, LGA-3467 form-factor
    June 20th, 2015 at 7:33 pm
    AuthorAnton Shilov
    ...
    The “Purley” platform will be Intel’s biggest server platform advancement in many years, when the world’s largest chipmaker rolls it out in 2017. Intel’s “Purley” will be a highly-configurable platform designed for enterprise, cloud, HPC [high-performance computing], storage and network applications. Intel “Purley”-based supercomputers are expected to finally hit ExaFLOPS performance late this decade.
    ....
    • Intel Xeon “Skylake-F” will be aimed at high-performance computing applications (which use 2S platforms) and will incorporate one link of the first-generation OmniPath fabric with 100Gb/s bandwidth. The latter will be supported by the code-named “Storm Lake” chip, which will be incorporated into the Xeon’s multi-chip-module (MCM) package. Among other things, Omni-Path Fabric will be used to connect to next-gen Xeon Phi co-processors.
    ....
    The upcoming Xeon “Skylake” processors will use the new socket P0 and will feature flip-chip land-grid array packaging (FC-LGA) with up to 3467 contacts. The final amount of pins to be used is unclear today, but according to unofficial information, it will exceed 3000 balls
    ....
     
    Last edited: Jun 6, 2016
    hmscott, Jun 6, 2016
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  9. hmscott

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    Xeon Phi - A REAL 64 Core CPU - For SCIENCE!
     
    hmscott, Oct 31, 2017
    #9