Next Level Lapping

Lapping the CPU die, didn't think it would improve temps. @Mr. Fox maybe you wanna try this and do the test how long it can last?

 

I think lapping the die (which is made of silicon) is a bad idea. Good way to kill a CPU or GPU. The act of lapping might not hurt it, but it will make it thinner and if it cracks... game over.

 

You tend to be a risk taker so idk, derbauer also stated that it is risky and likely will degrade your CPU but he wasn't 100% sure himself. Overall maybe you would try this once the 8700K gets old and cheap?

 

And you remove the protection film barriers on top of the silicon if lapping it. Hence you may destroy the chips if use of Liquid metal (decrease its lifespan). See chemical reaction.

 

I do take risks, but generally only when I have a back-up plan and right now I do not have one. Yes, I would try it under those circumstances. Especially with the ordinary 8700K in the P870DM-G. It would be no great loss with that CPU unless I did not have a better one to replace it. If the 8-core i7 that is coming soon is Z370 compatible, I might get that for my desktop, move the 8700K from the desktop to the P870DM-G and use the one in it now for the guinea pig. If lapping it creates a gap between the IHS and core, the temps will likely worsen rather than improve.

 

A whole lot for nothing. What I see is problems coming down the line and will happen at the worse time. The difference is a minus with thermal paste which was made for a purpose to prevent thermal death of the CPU. The video make and take no responsibility if users do that a their CPU fails that is the troubling part. If your going to make such a obvious problem video and thinking it will improve your definitely not thinking straight. Those differences in the overall CPU running is better spent putting the right amount of thermal paste to insure your CPU is running in peak performance not trying think your DIY is better then the CPU manufacture whom down far more stress testing then a one hour video can do.

 

I've done this, but you definitely have to be careful. That means using a diamond compound in excess of .5 micron or lower to lightly take off the silicon, and match the same level with the heatsink. That way the amount of paste is at a small enough level to help transfer heat. Oddly enough, if you want to actually see improvement, finishing sanding in one direction (up and down) on the CPU/GPU, and the other direction onthe heatsink will be better because of the micro-gaps being much smaller. This means more surface area for the die to contact the heatsink, the TIM improving the transfer where it does not. Simply sanding both to a mirror sheen to match won't work considering you'll just have a layer of TIM and very little metal to metal contact.