Is replacing the IGP's stock thermal pads causing this issue?

Here is the issue. Nearly one month ago I had opened up my laptop to upgrade the processor. While I was in there, I went ahead and replaced the thermal pads for the IGPs with some AS5. Making sure that everything met up perfectly, it seemed as though it all went well. Sadly however, something went wrong.

When I game(i.e. Torchlight), the framerates are perfect, untill the laptop gets hot.... BUT it is a very strange sort of hot. HWmonitor reads CPU temp is only 57c while gaming, but I have no way of knowing how hot my IGP chips are getting. The bottom of the laptop doesn't feel hot(just slighty warm to the touch), but when I elevate the back of the laptop slighty, the frame rates return to normal.

*I didn't over apply the AS5 and the heatsink did meet up flush with both IGP chips.
*I prep'd all surfaces with AS5 cleaning solution before adding any of the thermal compound.
*I made some custom vent holes for extra cooling (No, it doesn't look like complete sh*t).

Is this a user error issue? Are the stock thermal pads really that good?

Any help will be appreciated.

 

The pads add thickness giving get better contact with the heatsink. Without good contact there can not be heat transfer. I had a similar problem with AS5 with my CPU so switched to the thicker Shin-Etsu thermal compound. Have had no issues since.

 

I was aware that there is a gap, since this isn't the first laptop that i have taken apart. This laptop however didn't look like there would be a gap. The thermal pad looked to be pressed very thin where the die met the metal(aluminium?).

Well alright then,

Does anyone know if there is any brand of thermal pads that will offer the same heat transfer ability as AS5?

 

I think the AS5 might be too thin to use as a replacement for the thermal pads.
Also it might start to spread out when heated up. D;

I recommend IC Diamond, its much thicker and because of that its great to use as a thermal pad replacement.

 

I second what Deagleson said.