The Notebook Review forums were hosted by TechTarget, who shut down them down on January 31, 2022. This static read-only archive was pulled by NBR forum users between January 20 and January 31, 2022, in an effort to make sure that the valuable technical information that had been posted on the forums is preserved. For current discussions, many NBR forum users moved over to NotebookTalk.net after the shutdown.
Problems? See this thread at archive.org.

    Gateway MX6124 Heat Sink Questions

    Discussion in 'Gateway and eMachines' started by neumannu47, Dec 28, 2010.

  1. neumannu47

    neumannu47 Newbie

    Reputations:
    0
    Messages:
    4
    Likes Received:
    0
    Trophy Points:
    5
    Below is a picture of the heat sink from a Gateway MX6124 notebook. Notice that there is a piece of silver foil stuck to the heat sink with thermal compound. When the assembly is locked into place, the foil contacts the CPU. There is no thermal compound between the CPU and the foil.

    Should I remove and discard the foil, clean up the assembly, and apply new thermal compound? The computer may be experiencing heat-related problems. (It locks up randomly even though CPU Thermometer show the temperature constantly below 65C.) The fins are not clogged, so the air flow is sufficient. The fan turns normally.

    [​IMG]​
     
    neumannu47, Dec 28, 2010
    #1