P6831 Frying!- TZS0 reading over 200 Deg. F- Help!

I have notice while playing that, after a certain amount of time, I get terrible stuttering. Well, I installed CPUID and I'm pretty sure I've found the cause.

My TZSO reading (the first line under temperatures) is almost 100 Celsius.

I installed an x7800 a while ago- could I have failed to apply the thermal compound? Or maybe I knocked one of the compound pads off the motherboard?

Again, I don't really know what TZSO refers to, nor how to go about resolving the problem.

THANKS!

 

Playing COD4 online, my gpu hits 92-95C

 

Did the thermal pad fall off the northbridge? cause it sounds like you have nothing there making contact. When you replaced the CPU to the left of that there was another chip that had a blue pad on it , did you put it back ?.

 

Thermal Zone S0. I'm guessing it hit 98C. It sometimes causes cpu throttling. It is NOT related to GPU temp. Some 7811s are afflicted with this as well, usually during overclocking. First I've heard of it on a 6831. Search the forums for TZS0.

 

Where do I get a new pad? Or can I just apply AS5?

oh- and my gpu is fine while playing

 

You can try AS5, the problem is that its going to be hard for the Chipset to make good contact without glopping on AS5, which can cause other problems, but if you have nothing there right now id say yes toss some AS5 on it for the time being and find a replacement pad. There are places to get the pads but other members will have to chime in to tell you where .

 

Make sure your pad is applied correctly and just add AS5.

 

See this thread http://forum.notebookreview.com/showthread.php?t=315248
for info on pads.

 

Here's a pic of it: it looks pretty crappy.

http://www.kodakgallery.com/BrowseP...97431894107.425324474307.1225843335274&page=1

 

Your pic didnt work for me .

 

at what freq. you running the x7800 ?

 

x7800 is running at 3ghz

i applied the as5 and will post results

 

the 6831 can't handle 3ghz on the x7800 without undervolting.

 

okay - still got 208F after running 3dmark06

any help?

I don't believe it can't run at 3ghz - I have read about lots of guys who've done it without problems.

Maybe I applied the AS5 incorrectly? Or do I have to use a thermal pad?

 

they have done it with undervolting the cpu.... thats really the only way to safely do it on a 6831 or 6860...

 

you dont just o/c to 3.0ghz and say many people done it.
you start 2.6 run stress test go to 2.8 run some more then go to 3.0ghz.
in my case i decided not to go 3.0ghz, because it run too hot.
btw start with gpu@stock.

well disregard everything in this post if you want it to catch fire asap.

 

Actually most with the x7800 tend to run it at 2.8gHz. Its the x9000's that people go to 3.0gHz with out any problems. (usually)

And almost as a fault, all of us with the extreme CPU's(even us with the x9000), under volt our CPU's due to the stock cooling system isn't really set up to handle high temp CPU's with out problems.

So don't go talking about things you "believe" because you say you've read it, and start believing them truth. Listen to what the people here are saying because they are trying to help. Your CPU might very well be able to handle 3.0gHz, but as currently your TZ0 is frying, you might want to consider slowly stepping the CPU up a multiplier at a time to see what happens at each step.

Also uninstall the CPU and reinstall it from scratch and take care to reapply the thermal compound. Remember that to much is as bad as to little in a lot of cases. Ans make sure none gets transferred from the CPU to the surrounding areas as AS5 is mildly electrically conductive and can really bugger things up if it starts conducting electricity where its not supposed to. go

 

better make sure that thermal pad isnt ripped..

 

ok, so i'm testing an undervolt now at 2.6ghz.
Using Rightmark, I have the 13x running at the next lowest volt (originally 1.35, now running Orthos at 1.3375). after 5 minutes, I'm around 83C.

Does this seem right? I have now replaced the thermal pad with carefully applied AS5.

Also, as I proceed, what should be my target for 2.8ghz? Undervolt to... ? Temps reaching...?

thanks

 

nooo don't replace thermal pad with as5, doesn't work. don't remember who it was but somebody on here tried it (narsnail maybe?) and it turned out horribly.

 

yes, see my post (#8) earlier in this thread for a link to that discussion.

 

LOL NOOOOO YOUR DONE FOR!!!!\


Put the pad back on or buy some and do it yourself.

 

And he wrote it in red so you know its true

 

fiz - which thickness would be ideal? I already asked in my thread, but you must have overseen it...! Im in need of your expertise!

 

I appreciate the humor, but I would love a straight answer.

I am idling right now around 110F and am questioning whether to continue testing. I'm not some kid, I'm a grown man looking for input from other grown men.

So- Do I need to use a thermal pad or is AS5 sufficient?
In using RightMark, do I need to select that I have a Mobile CPU when undervolting (this makes a big difference in determining the current voltage and hence how to undervolt)?
If I need a thermal pad, where can I find one and what specs should I look for?

Again, I appreciate the help and advice.

 

I dont think AS5 is sufficient, at least - thats what I was told when the exact same thing happened to me.. I figured I could just replace the pad with AS5 and think it was all good... That was 2 months ago - Im still looking for the right thermal pad... Ive tried 2 kinds, neither of which have helped me with my temps.

UV guide: http://forum.notebookreview.com/showthread.php?t=235824

 

I use humor as a deflection method... i watch too much House for my own good it seems

That's about where it should be. My normal operation temps on my TZ's are between 20 deg and 52 deg (84F and 125F, we use Deg C in computers because that's what the manufacturer supplied thermal limits are generally given as... and smaller numbers make people happy with temps)

I'm pretty much a grown man too, but you would be surprised how much you can learn from the 13-18 year age group when it comes to computers

Yes, if you've destroyed/damaged/removed your thermal pad you need a new one. They are quite important in the cooling of computers (especially laptops)

For undervolting follow Flipfire's guide to a tee and you will have Zero problems Phasio conveniently gave you the needed link.

As to where to get a thermal pad... i haven't the foggiest. I believe there are a few links floating around with different thermal pads... but i honestly don't know which are the best/correct. i took great care removing everything when i upgraded so i wouldn't run into this exact problem.

no worries, that's why we're here

But you'll have to get used to humor...its all we have going for us
Oh yeah and welcome to the cool kid club with your XCPU

 

First, lets get our temps straight. When you post a temp, please indicate GPU, CPU1, CPU2, TZS0 or TZS1. You can post in F if you want, but most of us around here use C. HWMonitor will give you all these temps and your HD temps if you haven't RAIDed.

Second, removing the thermal pad from your northbridge is bad (but does not cause the GPU temp to spike, but may cause TZS0 to spike). On the 7811, a .06" or 1.5mm thermal pad seems to fill the gap between the northbridge and the heatpipe assembly (HPA) quite nicely. Remember, the pad will compress, and this compression both holds it inplace and allows it to fill in the little imperfections on the surface of the chip and the mating surface of the HPA. When E-wrecked created his copper shim, he figured he had it around .7mm when he was finished, so the gap between the chip surface and the HPA mating surface was actually only about .7mm on the 7811. The 7811 and 6831/6860 have different northbridges (PM45 vs PM965). According to Intel data sheets, the package height is 1.608mm for the PM45 and 2.019mm for the PM965. That's a difference of roughly .4mm and would put the gap around .3mm for 6860 and 6831, so you'd want a .5 or .6mm thermal pad. You could get some varying thicknesses of cardboard and try them to see what thickness works.

Third, replacing the stock processor with a X7800, X9000 or X9100 will increase the likelyhood of you seeing a TZS0 spike with or without the appropriate thermal component between your northbridge and the HPA. That's another reason to undervolt (NOTE: if the TZS0 spike to 98C is a real temp spike and not just some current fluctuations, you run the risk of frying your northbridge if you use RMClock to prevent downthrottling. The Intel Thermal Management section of the data sheet suggests throttling prior to 110C to avoid reaching 110C. 130C is considered catastrophic.)

Fourth, while being a bit sarcastic in reccomending a gap tool, one could very easily be used to determine the distance between the northbridge and HPA mating surface. A gap tool (or feeler gauge) is a collection of thin wires or pieces of metal of varying thicknesses and can usually be found in an automotive store near spark plugs, among other places -> http://en.wikipedia.org/wiki/Feeler_gauge However, be very careful as the surface on the northbridge die chips very easily. One could also use varying thicknesses of cardboard or stack pieces of paper and then measure the stack of paper with a caliper. That would be your gap. The thickness of the thermal pad would then be 20% to 100% thicker depending on the thermal pad. NOTE: DO NOT TURN YOUR LAPTOP on with cardboard or paper in the space between the northbridge and the HPA mating surface. Cardboard and paper are insulators, not conductors. Or, since thermal pad are relatively cheap, you could get several thicknesses and see what works best in your system.

I'm also told some people have had success with thermal pads from mxm-upgrade.com. I haven't tried them.

Finally, use the above information AT YOUR OWN RISK. I have only my 7811 as a reference. I DO NOT have a 6860 or 6831 for reference. I am simply providing a guideline based on my and others experiences with the 7811 and the Intel Chipset reference material. Unlike some other people on this forum, I cannot afford to own several laptops or upgrade as each new model comes out.

 

TZS0 spikes to 98c.

 

E-Wrecked has posted quite a bit on TZS0 spikes with X9100. You can run RMClock and supress the cpu downthrottle if you think the TZS0 temp is in error.

 

I did give you a straight answer, put the thermal pad back on.

 

If you have a spare thermal pad, yes use that. But as I've stated in many other threads, I ripped my thermal pad back in March and I used AS5 for the gap since I didn't have a spare pad around. My northbridge/chipset/whatever you call it temps have been sitting at 49-51C since. No blue screen or overheating for me. Just don't apply it like a cpu because that's too little, but don't dump half your AS5 tube into it either. I'm thinking more along the lines of 2-3x the normal application for cpu and you'll be fine. It worked for me so there's no excuse it would ONLY work for me and nobody else.

 

True, if you put on enough AS5 to bridge the gap it will be better than nothing (air). Is 49-51C what you see idle or under load? And is that the TZS0? I can hit 50C TZS0 only under extreme load, like running Furmark and something else at the same time.

AS5 is designed as for contact applications, not gap applications. As we all know, things expand and contract as they heat and cool. For contact applications, this is not a big problem since clips are in place to ensure contact is not broken. For gap applications, ideally, you should use a compound that will maintain flexibility so that it can compress and expand and maintain constant contact with both surfaces through repeated cycles of they heating up and cooling down. I understand AS5 has a curing period. After it cures, it may be much more like a solid and therefore prone to fracture under repeated stress cycles. So while AS5 may work in the short term, I'd keep an eye on my temps because it may not work long term (on the other hand, you may be just fine).

 

the temp is for tzs0 and 1, and temps are idles temps. heck, right now it's at 47C. As for load, I don't ever recall it ever passing 55, ever.

 

Man thanks for the hardwork and research. You just made my day.

 

lol.. fiziks, you went all out with that explanation. Very thorough, I'm impressed with just the amount of time taken to type that one. Also, very detailed and accurate. One thing to keep in mind, the thermal pad is very maleable. The perfect size thermal pad for the 7811Fx would be the .06"(you figure out mm conversion). After my hours of lapping and such with the copper mod, I removed enough to make it perfect for the gap.. However, a same sized thermal pad wouldn't work. It would need to be, as you said, roughly 20% thicker. A 1mm thermal pad would be ideal. or, 1.25 if you can find em like that. The copper shim was somewhere around .7mm to .9 mm after I finished.

anyhow, +rep to you fiziks.