Recommed Thermal Compound for Chipset on P-7815u FX

Hey All,

So i am upgrading my P-7815u FX laptop to a Intel x9100 CPU.
I brought a IC 24K Diamond Thermal Compound to replace the current thermal compound.

I noticed when I took the heat sink I saw the NB chip-set had a Thermal Pad.

Does anyone recommend a good quality Thermal Pad or I can use the IC 24k Diamond Thermal Paste that I brought for th Intel x9100.

Thanks,

 

as long as there's no gap between the heatsink and gpu then you could definitely use the IC diamond.

however if there's even a 2mm gap you'd need to get a 2mm thermal pad

 

Actually wrong here. Use a larger than normal drop of ICD so that it will form the pad once the HS is attached. Many have done this with no issue at all..................

 

I am actually going to undertake redoing my P-7805u next week... got me some copper shims, some PK-1 thermal paste, and plenty o time ta bring it to eeets knees...

On a serious note however, I am contemplating between using some sort of heat resistant superglue or using some Thermal Adhesive around the edges of the copper shims to keep them in place and yet still transfer maximum heat...


I dont recommend using only thermal paste, even ICD... but it works for some, GL-HF

 

I agree with TANWare on this. I've done this with ICD and it works fine because ICD is very thick, electrically non-conductive and has better thermal conductivity than thermal pads.

 

Thanks for the correction guys, I guess I was just used to having the heatsink as close to the chipset as I could

 

Use the copper shims. People blob stuff on because their lazy or in a hurry. Would you pay someone to do that?

 

If it were ICD, yes......................

 

Don't use copper shims. ICD is made of diamond, which has several times better thermal conductivity than copper. The Wikipedia article "Material properties of diamond" has this to say:

 

Hey, thanks for the link, I read that too. Do you have any posted temps shims vs no shims?

The problems with these forums is that people tend to read posts as the "word", we all know like how AS5 will conduct electricity, dude it's got silver in it! How many times have we read that?

But my main concern would be any sagging, if that were to happen. LOL, I guess the manufactures just don't get it.. blob that stuf on there!

Don't get me wrong, from what I'm reading you can blob it on in a pinch?

Cheers

 

I've never used shims. Because ICD is so thick, I routinely replace thermal pads with it when I repaste and never had problems. I've not seen a situation where the gap was more than a millimeter, and with the thickness of ICD I doubt it will be sagging out. My method of application is to apply a blob onto the chip and let the heatsink squeeze the blob to fit.

I recently ran out of ICD and had to switch to MX-4 since I don't know of any local stores that carry ICD and couldn't wait for an ebay purchase to arrive. MX-4 is much thinner than ICD, which makes MX-4 much easier to apply but also makes it useless if there is any gap.

The next time I do a repaste, for the CPU and GPU I would use MX-4 since these chips usually fit quite tightly against the heatsink, but for anything with a gap I'll be looking for more ICD.

 

OK, I'm going to order ICD for my Tosh repaste later in the year, I like what I'm readring.

My son took over my 6831 so I will have to wait on repaste for that..or just do a MB swap when/if the 8800 falls off.

Thx!

 

My 2 cents.

I am using Antec 7. I wanted to use ICD7 but didn't want to wait. I had experience with Antec 6 and did not think it was amazing. But the Antec 7 has worked a treat. Very cool temps. Nice and thick compound.

 

Thanks all of the help on this questions. Sorry I was late in thanking all you guys. As always great place to get questions answered and always great knowledgeable people and as an update im up and running and my machine is running COOL as hell. Looks like my laptop is ready for Diablo III.