AS5 and Copper GPU mod results.

I applied AS5 to my notebook yesterday. Today i decided to pull it apart and do even further cooling. It was quite a pain doing it all over again but it seems to have payed off

I decided to do the copper gpu mod as seen here. I bought myself a sheet of 0.65mm copper sheet for $15 from a hobbystore and only used about 1.5x1.5cm of it.

If youve seen the stock thermal pad, it is very very horrible. Mine was soft and soggy for some reason. Basically the copper is sandwiched by AS5 for better contact.

Results:
(OC'd 600/1200/800mhz)

GPU temps before:
Idle: 48c
Load: 80c

GPU temps after copper/AS5 mod:
Idle: 45c
Load: 72c so far

CPU temps before: (UV'd)
Idle: 33c
Load: 67c

CPU temps after AS5:
Idle: 35c
Load: 62c

The results are good, very happy. Hoping for it to improve over the 200hour break-in period.

The CPU idle is slightly higher because the GPU now puts more heat into the same heatpipe the CPU/GPU share

 

I have a M1530 and I did the mod also but I didn't change the thermal pad just the paste.

UV'd and new thermal paste the load doesn't get over 60C for the cpu and 70C for the gpu.

I agree that the thermal pad sucks, it actually starts to flake apart after awhile.

 

Hey flipfire,

I don't get it..if your GPU makes flat contact without pad, why the copper shim? I see the compound now makes twice the interface heat transfers instead of one. Was the "before" the AS5 only temps? What am I missing?

Thx

 

Hey flipfire, question, you can manually control your fans?

And about the results, you already know you have to wait 200 hours, so I can only say kudos to you for doing it

 

He changed the thermal pad to copper since it is a better conductor of heat.

 

So is silver My question is why is it more efficient to add a copper layer between heat source and heat pipe? What is the copper shim doing that the Silver AS-5 is not assuming the surfaces are flat? In my case I removed pad and used the heat compound and lost a couple of C as well. The copper pad may help IF you have a gap problem over, say, the chip set.

 

That`s because copper has a better heat conductivity and absorbtion, so AS5 serves as direct liaison between the parts, being 98% pure silver if I got my percentages right and fills the gaps,basically creating something like a pipe for the heat to go from the cpu to the copper layer and from that to the heatsink.

I`m if not right , I would`be surprised.It makes sense

 

I did this mod myself recently.

FYI, I've got a big writeup on this here:
http://forum.notebookreview.com/showthread.php?p=3357081#post3357081

 

So you used an aluminum plate in place of the thermal pad? I used AS5, only, on my 1705 and ran cooler.

Did you try just AS5 or did you have a gap problem? What were your AS5 only temps?

Still trying to figure out what you guys are trying to accomplish by substituting metal plate and compound VS just compound.

If the plate is acting as a heat spreader, why not use the best; silver plate?

 

You guys realize that all of your efforts and time are spent for little or no benefit to the system. If you wanted to lower the temperature of your system, you would find a decent 5v power source like the USB hub, and connect the cpu fan directly to there. I guarantee that you can do this in like 10 minutes and it will drop your temperatures much more than some shim's.

K-TRON

 

The thermal pad is really terrible. I am satisfied with my mod, and besides, it's about the adventure of working it out!

 

It doesnt make full contact. Theres about -1mm gap, AS5 itself isnt enough to cover it. The stock thermal pad is really horrible, it looks like its made out of chewing gum.

I used copper instead of aluminium or silver is because the heatsink itself is made out of copper. They used copper for a reason right?.. might aswell use the same material for whatever reason

hehe thanks..Unfortunately no but my fan algorithm is perfect, i wouldnt wanna change it

Id have to disagree, the results speak for itself. It is running more efficiently and cooler without any drawbacks under the same conditions as before.

I dont see using a USB hub to power the cpu fan a better idea. I dont see it possible with my notebook either.. A bigger fan would be better though..

 

Ah, a gap, well then this could solve a problem with P6831 owners who tore chipset pads while changing out CPU which was all on same copper heat pipe spreader.

Yes, copper is only beat by silver but is much cheaper, no? There are silver plated coolers out there for desk tops.

Thanks

 

i wonder how this would work on a heatpipe with no way to mount the shim..

anyone have any experience with using any type of epoxy like JB WELD to permantly affix a shim to a heatpipe??

i've used it to hold heatsinks to old pentium 1 cpus,,, but i don't see why it wouldn't work as a better transfer medium than that thermal pad.... then i can use AS5 between the shim and the GPU/chipset

i think i'm gonna buy a replacement heatpipe and test this out...
i'll post a thread with pics and results after i'm done

later,
big O

 

Innovative waits to reduce temps.Good job.

 

I recently opened up the cover over my heatpipe on my notebook and noticed ASUS had a big piece of yellow tape on the hottest section of the heatpipe to hold the fan wire down/out of the way. I noticed there was a small crevasse between the heat plate and a plastic bolt holder I could stick the wire down in, so I removed the tape, trimmed back the extra black coating off the wire, so the four tiny fan wires were more exposed and could fit in the crack, and pushed the wires down, and out of the way of the airflow. Then I put everything back together and noticed my idle gpu temp. dropped about 10C (Nice: 49C-52C idle temps. on an ASUS G' series is unheard of). The odd thing is, my temps are now hotter or the same under load, and I'm wondering if its possible I broke some sort of compound seal by pushing on the heatpipe while in there? I think ASUS uses thermal pads, so is there even a seal in the thermal compound that could be broken? Do ASUS or other manufacturers even use thermal compound or grease with thermal pads? Someone please let me know. If the G1's have thermal pads, I'm guessing there should be no issue in pushing down on the heatpipe a little, especially if it was only very slightly by accident (rested my palm on the heatpipe). Please let me know if I'm wrong and should consider doing this mod, since I was already debating it anyways, and would have to open this sucker completely up to check, and therefore have to change it anyways.

 

lol i now know why my laptop was overheating like crazy, i removed the thermal pad....aha...so If i say put a copper sheet in between the AS5 and the cpu, it should help more? I will try it.