Asus is going to use liquid metal paste out of the box in gaming laptops

Interesting development, I wonder how good their safeguards against dripping LM etc is.

Also if other follow suit because it definitely improves cooling greatly.

https://www.overclock3d.net/news/sy...TkwSolndseiD_NB9kLuw7f66Klv0pPea7urtA2n9WtEzI

 

This is actually sad and just proves ASUS can't be bothered to design their cooling solutions properly.

My example, a G703GX with stock paste would heat up to throttle levels very quickly and jet engine noise levels. Only after I switched to liquid metal and tweaked voltages it runs good, no throttling and stays relatively quiet even under load.

 

Would have to see it to speculate no how good it is really, but if it's built in during the manufacturing process that's a good sign IMO.

 

Liquid metal escape risk can be greatly reduced by having an even heatsink with a flat fit, and there's barrier methods as well for insurance

Loss of liquid metal volume (or. "drying out") by alloying into a new copper heatsink will be a bigger problem. Every install I've done has needed to be checked within 3-6 months and has required more to be added.

Maybe they will be nickel plating their heatsinks? But that, and better heatsink fit QC, and barriers, will all add to cost.

 

Interesting. I do not think it's a good solution because it may leak over time more easily - yes, yes, you can put some silicone barriers around it but as many people know the manufacturers aren't able to reliably apply even regular thermal paste, resulting in one person seeing 98C on his laptop and another one seeing 89C when playing same exact game on same exact model at same ambient temp so there would definitely be issues with quality of LM application and the quality of barrier around it. Plus as people have pointed out LM does react with copper over time so this will require extra coating on top of copper or aluminum heatsinks. Plus an application of a clear coat paint all around GPU and CPU in case if it does leak so it would not short out anything.

I think more reliable solution would be to use a slightly thicker Carbonaut pad, something that would last long and would be more consistent (it will be easier to apply and can compensate for small variations in heatsink mounting pressure if it is thick enough) and cost cheaper to use.

 

Quote: "The problem with Liquid Metal thermal compounds is the risk of spillage, misapplication of leaking over time, as by its very nature liquid metal thermal compounds are conductive. To tackle this problem, ASUS has created precision machinery to apply the right amount of liquid metal to each system and a unique internal frame that prevents liquid metal leakage over time. Thanks to these changes, ASUS is now able to produce systems with liquid metal thermal interfaces without decreasing the reliability of their systems."

well well, looking at their measures one might think they scoured the web for potential solutions and stumbled upon several NBR threads
a.k.a. how to apply LM properly and foam dam barrier

 

That's awesome, let Asus and the other makers work out the manufacturing details to successfully use LM, and let them be responsible for the warranty support.

I wonder if this LM option will bring about the 30 / 90 day warranty?

I'd recommend getting the vendors extended warranty at purchase.

 

yep, be sure to expect a price bump when keeping the same warranty length on these new machines...

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The chapo way. They just eat from the small remaining cooling headroom they gave this laptop models. Why not instead offer better cooling? As it is now, there is not much left an end user can do now to improve the cooling.

 

This brings me to another problem as well, what if the cooling needs to be maintained because its filled with dust...

 

remove LM with isopropanol, clean dust, reapply LM, reinstall heatsink...

but yeah @Papusan this would give them the perfect excuse to make their heatsinks even MORE anemic due to the improved LM cooling... do "more" with less, right??

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This can be done with proper internal chassis design. Easy dismantling of the fans without need to touch the heatsink/heatsink grille. The big question... Have they taken account for this.

And the engineers must be sure they developed the cooling correct so the customers don’t blow away the liquid metal if they open up the bottom lid and use canned air inside the chassis.

 

Guessing the first one they didn't bother with, but if they've got a dam of some sort around the chip, probably can't easily get a solid airflow into it unless you're really trying.

 

Well, I know it's a foreign idea to you, but what if the vendor delivers the laptop with fully optimized cooling out of the box, so the end user doesn't need to open it up and play like they know what they are doing mucking around with the guts of their brand new $5k laptop?

Maybe the next step is the tuning software will optimize the voltage, frequency, fan curve, and power as needed on the fly to give the optimal gaming and application performance as needed, otherwise detune for lower power usage for longer battery life?

Amazing how far we've come in such a short 40 year time span...

 

Now that I think of it, never actually saw a laptop where I just oculd pull out the fans without removing the heatsink They always had the heatsink with shroud covering the fan assembly.

 

I will wait for the results And Liquid metal from what I thinks is only offered for the model with unlocked 8 core i9 Mobile. I think the chips will tank the cooling

All my laptops is equal easy work with as this one. I have this Clevo also but with the i7-920xm

 

I hope they do to improve the terrible thermals and not to cheap on cooling system, but maybe im too naive

 

That laptop is extremely old tho

 

Not as old as this

 

olden but golden. id take one of those over any current bga turdbook anytime!

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it performs exactly the same as clu, actually also got myself a bottle of gallinstan, been using it for quite a while now.

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What link did you order it from?

 

same as with any LM: ensure flush heatsink fit, apply as thin a layer as possible in order to cover the cpu ihs (qtips come highly recommended here, lintfree preferably), and also apply a thin layer on the respective heatsink side (as opposed to regular pastes, LM needs to cover both matching surfaces to make a proper connection).
for removal / reapply im using 100% isopropanol, cleans up quite nicely

@Falkentyne just ordered it off ebay, nothing special. if you like i could check and see if that particular seller still has offers for gallinstan.



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Most of the old Clevo models had independent fans where you could take them out without touching the heatsink. Others, not as much, though I think the MSI GT series has also had quite a few models like that.