CLU application issues

So maybe I'm just applying it incorrectly, but I've done it two times, and both times it worked great at first. But after a day or so, temps have gone back up to around what they used to be. I was thinking that maybe I'm just not applying enough, but the second time I used more and screwed the heatsink back on to check, then removed it immediately and found that a small drop had squeezed out from between the die and the sink. So am I just being way too conservative about how much to apply? Also, is there some sort of sealant I can use around the die in case of drops coming out? I was thinking silicone caulk or something, but I'm not sure how easy that would be to remove in the future.

 

It would help if you posted your CPU model and laptop model and what program you are using to monitor your temps.

As far as the paste, less is more, and you need to do a couple of steps to make sure you have just enough but not too much.

1- Clean the die and heatsink plate with rubbing alcohol and a cotton swab. Make sure they are dry before applying the paste.
2- Apply a small drop of paste to the center of the die. Depending on the surface area of the die, a small drop can be about half the size of a grain of rice or more for dies with bigger surface areas.
3- Attach your heatsink completely with all screws tightened.
4- Remove your heatsink and make sure the paste has spread evenly over the entire surface area of the die. If it has not, apply a bit more until it does. Do not worry if some has spilled over the edges of the die (read below).
5- Re-clean and reapply the paste based on the right amount needed from step 4.

You should not be using any "sealant" around the cpu die. With a few exceptions, most thermal pastes are not conductive or capacitive and will not harm components around the cpu. Sometimes Kapton tape is used around processors, but unless your laptop came with this type of tape around the die from the factory I wouldn't worry about it. Reply with the paste you are using and someone will tell you if it is potentially conductive or capacitive.

 

Isn't it in the topic title? I assume CLU is coollaboratory liquid ultra (which I think IS conductive)?


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Quite conductive, which is why I asked about some way to keep it from escaping the interface and getting over other components. My guess is that the issue is caused by a combination of not applying enough and the paste redistributing itself over time from adherence. I have to err on the safe side when it comes to applying the right amount since the CPU has an exposed die, not a heat spreader, so it has to cover the entire surface perfectly, but still avoid spillage.

 

I see...thought the op meant to type CPU

You can cover the area with kapton tape like I suggested. I personally would not be using conductive thermal paste. Not worth the risk for a couple of degrees in cooling.

 

Agreed, it is really not worth the extra hassle. I have found Gelid GC Extreme to be pretty easy to apply and gives you pretty much a similar reduction in temps.. Use that IMO..

 

Always use Clu on die and heatsink. Maybe the gap between die and heatsink is to big. Or the heatsink is warped. If so use Icd as other with the similar problems using. A thicker paste can do the job.