So, next year around the middle of 2008 we are expecting all of these things!!!
And yeah, Intel will be brand new with CSI (Common System Interface) instead of FSB and it will be 45nm on High-K metal gate. Also, with USB signed off by HP, IBM, etc..... when are we expecting this? Same with DDR3 memory??
Anyway, what will this all do for us and any specific realease dates? So, please post your views and info here ?![]()
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Nehalem will probably be launched for servers at first ,id say 4Q,but given intel is ahead of schedule,id not be surprised by a 3Q launch,Desktops late 2008..
DDR3 come to notebooks with montevina,again it might follow santa rosa like schedule.. -
Regarding USB 3.0 what I can add is that Intel plans to release the specifications for USB 3.0 only in mid 2008.... So you can expect USB 3.0 compatible devices probably only in 2009 or 2010
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And as for CSI - single socket solutions for home market wont benefit much.... Intel has now been focussing on CSI to gain the multiprocessor market share which is around 50 % now compared to the overall share of around 75 to 80 % for the overall processor market intel is holding.... AMD's new Barcleona release has impressed many Enterprise customers and so AMD has a lead here.... And Intel wants to win back that market again.... THat too CSI implementations will take some time to be actually released because the fab technology should be altered to a large extent for having the on-die MCH..... Also the GPU was on the MCH for integrated solutions and giving a better boost on the integrated GPU side and which wont be the case if the MCH goes on-die.....
DDR3 Memory, USB 3.0, Nehalem, CSI
Discussion in 'Hardware Components and Aftermarket Upgrades' started by spikester_05, Sep 30, 2007.