Did you fall into the rabbit hole of trying out lots of thermal pastes? Just buy Hydronaut.

I've tried like 8 pastes on my MSI GE65 already. All of them would pump out or whatever after a few days and become useless.

Just buy Hydronaut.

Krynaout is **** for laptops, it has super good thermal conductivity but that doesn't matter because it lasts like one day before the temps start degrading fast. Hydronaut will not perform as well as Kryonaut during the first hour after applying, but it will continue to have the same exact performance even months after applying it.

Seriously. Just use Hydronaut. Der8auer himself has recommended it for direct die cooling. Stop looking at thermal conductivity and just use a paste that is designed for direct die cooling and for high sustained temperatures.

Or just go liquid metal, but this is for people who want the best non-conductive option.

 

@Reonu how many degrees difference will I be looking at, switching from Kryonaut?

 

This is a good suggestion, however it also depends on the laptop. On mine, Kryonaut and Phobya Nanogrease Extreme work very well, but the contact plate on the heatsink is also perfectly flat (perfect as in no warping).

Problems arise when you have a warped heatsink, which causes thermal paste to pump out extremely quickly. Hydronaut is really good at resisting thermal pump out, and so is IC Diamond.

In short, look at your heatsink first, then you can decide what paste is best for you. If you have a warped heatsink, definitely go for Hydronaut or IC Diamond. If you have a flat heatsink, go for Kryonaut or Phobya Nanogrease.

 

I just use NT-H1 for everything dont really have any issues.

 

Of course the shareholders will recommend own products. Wouldn’t you do the same?

There is better options out there for warped/uneven heatsink.

 

Which ones?

 

ICD, Phobya Nanogrease Extreme and Thermalright TFX

 

Apparently what thermal compound does it completely unknown. Start with specification numbers. Direct contact is hundreds of W/K-m. Thermal compound it ten to 100 times less conductive. Thermal compound is applied only to fill microscopic air gaps. Those are less thermally conductive than thermal compound.

Meanwhile heatsinks are not flat. Heatsink is slightly warpped to squeeze thermal compound out - everywhere except those microscopic air gaps. To put maximum pressure in the tiny spot in the center where all heat is generated.

All that and more explained here: https://www.reddit.com/r/GamingLapt...ndation_for_thermal_paste_zephyrus_g/g6kzgz6/

 

Come on, man. What I mean is that out of all of Thermal Grizzly's products, they recommend Hydronaut specifically for direct die cooling. People seem obsessed with Kryonaut when the manufacturer itself has said that you should be using Hydronaut instead for direct die cooling. That's obviously what I mean.

I haven't tried the other two, but Phobya Nanogrease Extreme performed horribly for me. I don't doubt that there are other options that are as good or maybe even better, but my personal experience is that out of the ones I've tried Hydronaut was the best. And I'm tired of trying pastes over and over again, I want to forget about the stupid paste for at least a year.

My next step if this didn't work was to try either Carbonaut or the IC Diamond thermal pad. But I'm happy with Hydronaut atm (finally)

 

Personal Experience = Anecdote

Relevant, but important to not forget what it is.

 

I have tried Phobya one and it loses its effectivity pretty fast, faster than gelid extreme.
I can't find ICD with a decent price, and I would try TFX, but didnt find many opinions about it here

 

The initial temps, as in the temps right after applying, will be a bit higher than with Kryonaut (let's say 2ºC higher or so) BUT it won't degrade nearly as fast. Kryonaut, in my experience, becomes useless after less than a week.

Well yeah, I can only talk from my personal experience, obviously.

 

@Reonu for me, Kryonaut lasts about a year, sometimes more.

 

Which means some other factor is at play. Thermal compound never degrades even decades later. Why do we not use mayonnaise or butter? It can degrade in a year.

 

If it has high thermal transfer, I would use it.

 

False. The filler material, usually silicone, dries out eventually. The longest lasting TIM, when used properly, is actually galinstan liquid metal.

 

Then one read datasheets. Wet or dry - it remains just as thermally conductive.

If thermal compound went bad (as scam advertising hypes), then we use toothpaste or mayonnaise. Just as thermally conductive. And less expensive.

Most all heat transfers in direct contact. Thermal compound is only filling microscopic air gaps. Does not matter if thermal compound goes bad. Always read numbers in datasheets. Thermal compound is ten to 100 times less thermally conductive.

Why are heatsinks tapered? To squeeze out thermal compound where all heat is generated. In a millimeters area in the center. Squeeze out less thermally conductive compound so that most all heat transfers in direct 'semiconductor to heatsink' contact.

Three reasons why thermal compound is hyped. Facts change once we include science and specification numbers.

Where does anyone, who hypes thermal compound, discuss W/K-m numbers? Those educated only by hearsay, fear, myths, and subjective speculation cannot and do not post relevant numbers.

Thermal compound does not degrade even decades later. Most heat transfers in direct contact. Not through ten to 100 times less thermally conductive thermal compound. Compound has low thermal transfer numbers.

 

Then feel free to go commando and forgo TIM altogether.

 

The heat is not generated only on the center of the die, its all over the die, any active zone will generate heat, if all the heat came from just a tiny point you would have W/mm^2 number reaching to infinity, and you would have a laser cavity, not a CPU or GPU.

 

No, I didn't. I just fell into the Kryonaut hole once, then I used the search function on this forum and discovered that most people recommend Phobya Nanogrease Extreme: better thermal conductivity than Kryo and higher viscosity so it doesn't pump out. Applied once and has been working ever since.

 

Entire silicon die (the compute chip that generates heat) is only in a millimeters area in the center of that IC. Rest is just connections from that tiny chip to a massive array of connecting pins.

All heat is only generated in that center area.

Go to datasheets in any decades. IR pictures demonstrated this. Unfortunately, too many only learn from hearsay or speculation. Do not (maybe do not know why) only reliable sources have credibility.

If you know otherwise, then tell us how large those semiconductor chips really are. A denial without citing those numbers is always best ignored as a lie. Until you provide reasons why and numbers, then the educated know your denials are best assumed to be wild speculation.

Your denials are disingenuous. Never give one reason. Therefore has no credibility. Prove your belief. Say why and list numbers. No number in any denial tell educated consumers that your denial is best ignored.

Most all heat is generated by a silicon die that is only in millimeters in the center.

Little hint. I worked in a semiconductor fab. Bunny suits and all those extremely hazardous chemicals.

 

Apparently everything was not carefully read (comprehended). Well, anything that is new is not appreciated until as least three rereads. Numbers are never seen until at least a second read. Plenty new stuff was posted - with reasons why and numbers. And all was ignored.

Why would thermal compound, that is somewhere between 10 and 100 times less thermally conductive, do anything useful? Why ignore (not even quote) relevant facts such as W/K-m? Simply posted is a denial based only in an emotional outburst. Not one justification provided. Somehow you order us what to believe. And we should automatically believe? Show me the numbers!

Where is one fact that says thermal compound is critical? Never posted. For an obvious reason. Only denials. And not one manufacturer specification number cited.

Why are heatsinks tapered and hard pressed onto a semiconductor.? Putting maximum pressure where all heat is generated? To squeeze out thermal compound, except in microscopic air gaps. Because direct contact does most all heat transfer. A reality that is not even denied.

That is the power of propaganda. Once someone is manipulated by wild speculation, then it takes hurricane force winds to get that one to move from his mistake.

How does thermal compound, that is ten to one hundreds times less conductive, do so much more? It doesn't. Same challenge reposted. Show me the numbers. State why or why not. Denials mean nothing without supporting facts and numbers.

 

There is the capability of multi-quote, instead of double posting...

 

Liquid metal or bust is what I’ve come to learn over the years, especially in today’s ultra thin gaming laptops

 

Took the words right out of my mouth.