GE's DCJ technology is an advanced cooling solution for the next generation of thinner, quieter and more powerful tablets, laptops

very interesting...

Advanced Electronics Cooling Technology: GE's Dual Piezoelectric Cooling Jets (DCJ) - YouTube

 

GE develops ultra-thin, almost-silent cooler for next-gen laptops and tablets | ExtremeTech

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I love it, I just keep thinking on the other hand the stress on the metal

 

I wonder if this technology could potentially be applied elsewhere...

Given how the GTX 680 and HD 7970 would actually be fairly compact if not for the gigantic heatsink and fan assembly strapped to them, this could potentially allow for M17x/M18x-level (or even desktop-level) graphics in a 12" Ultrabook - just slap one of these on the GPU core and another on the GDDR5

 

About time, one of the most annoying issues with many notebooks is the damn fan

 

HOT DAMN! i could put one of these under my gfx card's heat sink my laptop (thin empty space).

 

lol funny about that movie i heared after 1 second that guy was dutch

I love to see some statistics on how much air flow there is vs a conventional fan. I think when you want some air flow to cool a 680 you end up with a pretty big package

 

Interesting technology, but several things I see problematic:

- cool air, where does it come from? From that video the air exits and then is sucked back in. Won't it be recycling hot air and not getting a cool source of air? It's not like a fan that draws from one location and exhausts out another so you can control the source of the air.

- dust build up. We all know what that does to fans, and those tiny intakes aren't immune to it either. As a matter of fact it will likely get clogged a lot more easily because the opening is so small. I know the opening and closing effect out of the same opening should minimize that, but it will still happen. Dust has a nasty habit of sticking to anything.

- flex cycles of the "fan"? Seems that the constant movement of that material like that would lead to wear pretty quickly.

I don't see that fan working with a laptop with a large TDP like most gaming laptops though. It seems the overall surface area of the fan would need to be huge, or many stacked on top of each other. Not sure of maximum thickness of the fan either.

In any case, hope we do see some advancements. I guess we will see in a couple years, lol.

 

They said it works well in dusty environments.

You owuld tink it would wear out quickly but, we have had piezeos for a long time now, i'm betting they have the materials requirements and treatment/production od said materials nailed down some what well by now.

 

Considering they didn't show temp results from that laptop makes me wonder...

 

makes me wonder if I can climb mount kilimanjaro, while twitting about my poop, and watching all seasons of lost. I call that hardly a challenge.

I still think that from the IR readings we can have some ideas, and engadget saw it. Still their efficiency is up to debate, afterall we didnt see a real temp reading nor how it handles load, and the cpu is 17w

 

Assuming everything works perfectly on the engineering side, when do these actually make it to the market? Since this is proprietary, licensed tech, I would expect market adoption to be reluctant at best. And on the engineering side, are they really suggesting these little jets are efficient enough to replace a heatsink assembly in real-life usage? Sounds way too good to be true. Kind've like this stuff. I want to believe that we're on the dawn of a golden age in electronics cooling efficiency, but as long as the chip's producing that much heat I kind've think it's gonna be a problem.

 

very interesting technology! But the limiting factor in my mind will still be the size of the "lung."

 

This Looks amazing. I hope we're able to get these Dual Piezoelectric Cooling Jets in notebooks soon. 2 years maybe?




Imagine a thin ultrabook, with a top of the line mobile graphic graphics card, and running totally silent while playing games.

I also posted this in the Lenovo forum, where I normally hang out. I thought this was worthy of double posting thought as it is so cool.

Credit to The Verge, where I first saw this story.

 

Yeah, before you double post - search to see if it's already on this forum (it is).

 

Here is the paper that Peter de Bock (the GE researcher from the video still above) published in Electronics Cooling:

Evaluation and Opportunities for Use of Thin Form Factor Synthetic Jets to Low Profile Electronics Cooling Applications « Electronics Cooling Magazine – Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

 

I still have a hard time envisioning how it's not going to be ingesting and exhausting the same hot air over and over again. At least fans can pull cool air from a different source. This sucks in and blows air from the same point.

 

All it needs is a subtle shaping of the 'lung' and/or pre-creased (more flexible) sections to mimic and create a traditional airflow pattern.

Not hard to envision for me. Did this help you?

 

Why so condescending? The point is that it is pulling in warm air from the same source it's blowing it into. This is the first no-no in cooling system design. Fans pull it in from an outside, typically cooler, source.

 

Sorry, wasn't trying to be 'condescending' - what stops these from pulling in cooler air too?

 

Sorry, just your comment about it not being hard to envision for me how about you sounded that way...

From that article linked above



It draws in air from the same source that it blows it into is all I'm saying. The inlet and outlet are the same opening. It's moving surrounding air is all it's doing, not drawing in cooler air directly and moving it across the surface to be cooled. For smaller lower TDP items I guess this will likely work because it doesn't need a lot of surface area to dissipate heat. It's like cupping your hands over your mouth tightly and breathing in and out rapidly. You'll eventually pass out because you're likely inhaling all the CO2 that you expelled, it has no place to go.

If it drew air in from the back and blew it out the front then you could possibly supply a cooler air source.

 

From the document on the previous page:

Looks like TI came on board. Hopefully they'll come-up with something before the end of the year.

One thing that bothers me is how it's going to operate? Would it be always on at constant speed, or it's going to change the intensity according to the load?

 

It still doesn't change the fact that inside the laptop case is mostly a closed system, so the ambient air around it will heat to a steady state which will be significantly warmer than the outside air (unless you're in 100F heat in the summer). Obviously they're not idiots and considering these things, but unless they can manage to get a really significant airflow, more than any fan could offer, or a way to feed it with much cooler air, it will be quite limited to lower TDP components. Airflow over a heat conducting body can dissipate heat through convection even if the air flowing is at the same temperature, but it requires a significant airflow to match a much lower airflow with cooler air.

 

An easy way to direct the airflow in the way you want would be to use some sort of check valve, all you need afterwards is to get the right airflow and static pressure in a convenient form factor.