IC Diamond 24 Giveaway/ Reliability Survey

These are my results:
Before running Orthos @ 22 C Room Temps

Value Min Max
Core 0 44 42 47
Core 1 48 47 52

After 30mins Orthos

Core 0 76 42 81
Core 1 76 47 81

There's no major difference.
Happy New Year to All.

 

Time for an update for those that still in the game.

BTW for those that have an interest in the Contact and Pressure paper we were using in the tests here to trouble shoot thermal problems it is now available in a user cost friendly form

I seeded 4 sites in the USA to sell the contact and pressure paper on a marketing test basis. If it sells they will buy directly from the manufacturer.

I am not selling it personally I just set them up to keep the price reasonable and because I think it is a great product for trouble shooting.

FrozenCPU has a nice presentation

Fujifilm Prescale Pressure Indicating Film - Heatsink Contact Test Kit (3 Tests Included) - FrozenCPU.com

Also

platinummicro.com
Sidewinders.com
xoxide.com

also have it in stock

 

I thought I had my 18 months, but I got a late update from early 2013 as well on my G73, so I could always put it up when I get the time.

 

Speaking of updates, it was about 22.7c in the basement, but these seem lower than normal to me..

 

I plan on getting a new A10 Kaveri laptop during the winter break, and it will be OC'ed before the thermal paste replacement.

I am wondering if the experiment will continue to run into 2014?

 

We would like to keep it as an ongoing process as there is a high attrition rate on laptop replacement after a year or two although free tubes are available as the posted requirement in the beginning of the thread with the added provisional requirement of a Contact and Pressure test at the beginning of the test.

Fujifilm Prescale Pressure Indicating Film - Heatsink Contact Test Kit (3 Tests Included) - FrozenCPU.com

It is pretty much a given that not only is the long term quality/reliability of the compound important but but also the quality of the contact/pressure in determining the overall life of an installation.

What we would like to be able to do is draw a curve of the watt density vs the contact and pressure data to predict MTBF at the end of the execise.

We are also in discussion with some assemblers to do C/P tests on returned to be repaired systems for additional correlation.

I was replacing the compound on my daughters Playstation and ran some C/P tests and found both the sink and IHS to be very flat but light on pressure due to the high surface area, The heat sink was machined very nicely flat, in any event it stimulated the idea that perhaps there is an aftermarket marketing potential for a high C/P heat sink.

A good C/P sink would provide uniformly low temps and perhaps with the right compound extend the functional use of a laptop till retirement obviating need for compound replacement and reducing the number of repairs required. I do not know the market well enough to determine that the opportunity exists and is worth exploiting but something to think about.

 

I haven't joined the IC Diamond experiment yet. I was just wondering if this experiment/give-away will continue into 2014?

If so, then I'll join the survey.


EDIT: I do plan on using an i7-720qm 17" (stationary/gaming) and Core 2 Duo P8600 13" (mobile) laptop for college. The 17" needs a thermal paste replacement since the operating temperature has been going up, and the 13" laptop is still using the same 5 year old stock paste.

The only issue is that I plan on replacing both of them with an A10 Kaveri laptop during the winter break. The 17" will be used by my mom, but I won't have regular access in order to take temperature measurements during college. The 13" laptop, I'm not sure what my dad will do with it.

However, I do plan on replacing the new laptop's thermal paste next summer just in case if I need to RMA the laptop during the six months. Then I'll be able to regularly report thermal results for 3-5 years (until I get a new laptop).


Will I have to buy the pressure paper? Or will it be delivered with the thermal paste?


IN THIS THREAD "ON MY HONOR IN EXCHANGE FOR FREE COMPOUND I DO SOLEMNLY SWEAR TO TEST AND POST MY RESULTS AND TO UPDATE THOSE RESULTS EVERY 3 MONTHS"

 

just thought i would do one last final update as i sold my p7805u.

my temps from last time were literally one degree higher on all tests really honestly surprised me. (yeah i made sure ambient temps were equal to last time as much as possible)
heres a link to my previous test

http://img221.imageshack.us/img221/2231/resfx.jpg

get the last bit of data in just for the heck of it

p.s. this paste amazes me still lol

 

The Q9550 was retired in early 2013. Last readings didn't changed much

 

By the way, I suspect my current N61Jq laptop is having a thermal paste failure (not an IC Diamond). It was applied less than six months ago, and the idle and gaming temperature has increased by about 10 C, which is reaching close to the replaced stock thermal paste's performance.

Perhaps it was because my dad tightened each screw at the max, one at a time, instead of all four a little at a time. Or that he couldn't remove the traces of stock thermal paste that was stained onto the heatsink with rubbing alcohol.

I'll let you know how the thermal paste failed when I have to time to replace it again with the same thermal paste or IC Diamond.


EDIT: This is an interesting thread: http://www.overclock.net/t/1385275/thermal-nightmare-i-ran-across

Here's one of the pictures:

 

C/P test kit comes with the paste along with instructions ships on Friday

 

Typical failure of what you see in the liquid compounds - It's nice and runny so easily fills the surface imperfections and so performance is initially good due to the low contact resistance.

But now with heat and thermal cycling the liquid is dissipated in in a short time and the lost liquid leaves voids in the compound/contact initiating failure with the lost contact resistance.

Hard to tell without seeing the negative impression on the sink, but contact/Pressure (C/P) seems light on the right side with the thicker coating of paste with a little better pressure on the left side.

Compound coating should ideally be an even, across the chip, light almost see through glaze

The uneven C/P distribution would cause uneven heat dissipation or hot spot areas that would accelerate compound failure.

These notebook sinks are rough on the C/P side of things and exacerbate an already challenging thermal situation.

Thanks for posting the pic

 

Would it be possible to stop or at least delay the pump out failure by using somewhat adhesive thermal paste (not the ones with super-glue mixed in)?

 

?? Well you could try IC Diamond

In the formulation of IC Diamond we use so little liquid and in combination with the polymeric binders there is virtually no shrinkage of the compound to produce voids with the liquid loss.

OEM's suggest bulk loadings above 90% to minimize the void formation while ICD has 92% diamond along with a few % of carbon black total bulk loading ends up around 96% with only about 4% liquid. The difficult part of this though is to get the bulk loading without losing performance.

With optimal C/P and IC Diamond the mount could last for years, non optimally something less - some of the effort here is to try and quantify it.

IC diamond is more like an adhesive in that an adhesive will eventually fail by delaminating due to the high thermal stresses and thermal cycling. The effect then is extended life/reliability with out the issues associated with an adhesive.

 

Still no mail package. It's already summer temperature season in the midwest.

 

I have it


Delivered On:
Monday, 05/06/2013 at 11:08 A.M.

Left At:
Porch

 

I'll be doing the thermal paste replacement over the weekends.

 

Here are the pictures. I don't have any thermal results for after the application of the IC 24, since the room temperature has increased a bit, so I'm going wait until it's night. I did a dot application on the GPU, and an X application on the CPU.

I noticed one of the delivered pressure papers had a pink fingerprint on upper side, so I cut it off and used it on the smaller GPU. I kept the third one saved for my future laptop.

Also, am I supposed to mail the pressure papers?






EDIT: The previous thermal paste was an Arctic MX-4, apparently it did not fare well with the shoddy heatsink.

EDIT2: Yes, I cleaned off the heatsink before putting it back on.


EDIT3: I thought of something, a thermal paste for desktops, and a separate one for laptops. The one for laptops should be very vicious and adhesive (not enough to glue the CPU though) since many laptops have sub-par heatsinks like mine.

The one for desktops should be thinner since it's easier to maintain a higher pressure on the CPU, especially with quality aftermarket coolers.

However, there are a few desktop heatsinks that look like they were smoothed with a stone grinder, thus low-viscosity paste will bleed out faster.

 

Furmark and Prime95 testing after IC 24 application:




EDIT: How do I delete the unwanted attachment?

 

You should have gotten a self addressed envelope in the package - If not, if you would place the test results in one of the plastic bags and mail it back to us at

Innovation Cooling LLC
350 east Main street
Ansonia CT. 06401

Would be much appreciated

Contact is terrible - test results mirror your paste results pretty closely - Temperature is likely taking significant hit of perhaps 10 to 20 C due to the poor contact.

 

I think the main cause of the pressure imbalance is because when I fitted the cooling assembly back into the laptop (without screwing it down), the heatpipes were about 2-4mm above the GPU and CPU. When the assembly is screwed down, naturally the side that is facing away from the fan and heatsink is easier to push down.

Thus, the only solution is to either file down the higher pressure contacts (quite difficult due to copper's hardness), or figure out how to reduce the thickness of the cooling assembly so there isn't that much gap.

Also, only one heatpipe is welded to the GPU contact, the other two weren't welded onto the GPU contact.

 

Well it's been about 3 years overall, last time I checked there was a big drop off of participants due to exchanging their notebooks for new ones.

In any event I thought I would check and see if anybody still had the original installation installed?

 

Double posting is bad

I still have the original application in my HDX 18 (mainly because I think losing anymore screws from more dis-assemblies will make the laptop physically weaker, I haven't taken it apart), though the laptop is now with my little sister since I did upgrade to a newer laptop finally, I noticed no higher temperatures when I dropped it off and set it up this weekend with updates. I still maintain it though!

You weren't expecting me to chuck a laptop I paid $1150 for now were you?

 

Sorry for the 2X post- 16- 17 months and still holding, pretty good

Many sell to buy new

 

Yeah two years is tough around these boards. I probably repaste two to three times a year just because I'm always fussing with my machines and then upgrade every 12-18 months, so I'm not a good candidate, but I do use and even promote the use of IC Diamond. See here: https://www.youtube.com/watch?v=CFztLNvjchA

 

X post has been taken care of. The G73 is still technically mine, but I am definitely not in a position where I can have access to it for now.

 

I actually repasted my Q501LA when I got a nice working model with the same tube of IC Diamond from the start, but it being a i5 4200u, it doesn't create that much heat by itself, I've gotten it to 65c but no formal stress tests as of yet.

 

Nice video, short concise and to the point well done

 

This is interesting. I have not used ICD before, but if longevity is a strong point I will use it in other people's machines. I repaste my own machine frequently so it doesn't matter much on mime.

I grow tired of replacing other peoples TIM (family members), and if I could get an extra year out of a repaste, it would be great. This is a very interesting selling point.

 

Hi, been absent form this thread for a while. I haven't used the P79xx in quite a while. I had used it for a bit and from it being dormant for 12+ months there were no issues. With the new system I have no found the need to repaste.

I guess I should though as I never did it and I've had it for quite a while now.

 

I´ve never used the Diamond 24 thermal paste before. As a matter of fact, I didn´t knew it even existed. Arctic Silver 5 was my first choice since this paste is known and I´ve never had any bad experience with it.

However, I cannot say the same about this "liquid metal" stuff. This kind of paste is not reliable at all, it hardens and looks like some sort of stone. It is a pain in the a** to remove it and it can be only managed by using some sort of sanding paper, alkohol and lots of patience. I will never use this stuff ever again, I´m cured for life.

However, this Diamond 24 paste has some nice reviews on the web, it seems to be quite pricy though which is the only reason why I´m holding back ( since I´m not a rich person either as a student of electrical engineering ).