Intel's next-gen 3D chip

Intel will build next-generation chips with revolutionary 3D structures | VentureBeat

Man, I hope I can get my hands on this baby soon.

 

50% reduction in power in atom class chips. Less so for SB style chips, still nice though.

 

I would be happy if Intel could fix the problems with this generation of graphics chipsets instead of just starting afresh.

My Intel HD graphics keeps resetting to Win7 colour defaults every time i use sleep/standby and then open certain programs, ccleaner and others.

 

better article:
Transistors go 3D as Intel re-invents the microchip

 

This sounds interesting.

 

Another good article
Intel Announces first 22nm 3D Tri-Gate Transistors, Shipping in 2H 2011 - AnandTech :: Your Source for Hardware Analysis and News

 

22-nanometer
"In the move to Tri-Gate transistors, Intel will be able to reduce power consumption by more than 50 percent in a single generation, Bohr said. It will also provide a 37 percent leap in performance."

Impressive, can't wait for them to announce 4D architecture next year after the release of IVY

 

A chip that changes its shape over time, thats trippy.

Reprogrammable 3d chip could be considered 4d I guess.

 

Bye AMD. You will be missed!


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Stale competition ultimately screws the consumer, so yeah you could say you'll miss them.

 

Most chip makers have had their own 3D transistor designs for as long as Intel has. Intel gets the prize for being first to bring theirs to market in a CPU, but, until the news of Ivy Bridge, when tech sites reported on 3D circuits they were more often mentioning IBM than they were Intel.

Global Foundries has also been working on 3D chip designs for as long as Intel has, and are in a development partnership with IBM, and Samsung so they all share the benefits of each others research. GloFo's official line is that they currently don't need to move to a 3D design, and they do have some reason to make that claim.

Currently GloFo manufactures AMD's CPU using a silicon-on-insulator design to keep from falling to far behind Intel's better HKMG silicon and smaller die node. SOI, much like HKMG, and 3D transistors, benefits CPU design by cutting power leakage, and with Llano and Bulldozer AMD will be combining SOI with HKMG, cutting into Intel's lead. In response Intel will roll out Tri-Gate to stay ahead.

If it's going to be a fight of Intel's HKMG+3D vs. AMD's HKMG+SOI what will continue to be Intel's largest advantage is their lead in die size....but all in all AMD won't lag any further behind than they do now.

In the end what it comes down to is that Intel's 3D chips aren't a real menace to AMD but more a move against ARM, since, as was previously mentioned, the biggest boost will be had by Atom, and Intel wants desperately to get x86 into cellphones....which they'll need to do before ARM moves to 3D circuits.

 

there is no way that intel will make a better IGP than nvidia or ATI.
So why "Bye AMD. You'll be missed?"

Intel CPU + intel IGP has always been behind and will always be behind in graphic intensive applications

 

i guess he ment amd, the CPU manufacturer.

 

That's right.

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post deleted

 

This is not about IGP The 3D mentioned here is the structure of the transistors on the microchip.

 

My bad

Question:
Does anyone the benefit of using 3D structure compared to how things are done now?

 

just read the linked articles

 

AMD's chips use PD-SOI, which stands for Partially Depleted SOI. The 22nm Tri-gate transistors have Fully Depleted channels, which has better leakage and performance characteristics than PD-SOI.