So I just received my Intel Core 2 Duo T9300 (2.5GHz/6MB/800MHz) in the mail today and I'm actually really excited because I have been using the T5250 (1.5GHz/2MB/667MHz) ever since I ordered my laptop, while most people would recommend not upgrading processors with the advent of SSDs on the market but believe it or not buying a new processor ($135) is actually cheaper in my situation, especially since I require size and a 500GB SSD is well into the thousands and well I may consider the the Seagate Momentus XT but that's for a different thread entirely...
Now comes the most important part, what thermal compound should I use? I googled "best thermal compound" and it seems like a wrestling match between Arctic Silver 5 and Innovation Cooling Diamond. I have no idea what the difference is between the two and this it he first time I will upgrading a processor, so if anyone can tell me how much I am supposed to put and where, it would be really helpful (I have my theories, but am not willing to test it out because contrary to popular belief, money does NOT grow on trees for me.)?
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Tsunade_Hime such bacon. wow
All of them will be within 1-3 C of each other. The most important factor is applying it correctly. You will only need a raindrop sized glob and spread it evenly.
I personally recommend IC Diamond 7 (~7 dollars) or Shin Etsu. AS5 is overrated and overpriced. -
Unless cost is of no concern, most people's decision is based on where they live. Some pastes cost a fortune in certain locations, while in others it may be relatively cheap. There are several threads around and most of the pastes suggested (TX4, MX4, Shin Etsus, ICD7, etc.) fall within the same temperature bracket, so just get the cheapest.
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I always use MX3 or MX4. I simply place a line across the CPU die and then fix the heatsink back on. I have always had excellent temperatures with this method for both CPU and GPU.
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I've been wanting to try Coolabratory Ultra Liquid
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The dollop and mash method is the one described by LaptopNut above, you place either a line or a pea/rice-sized "dollop" of thermal paste on the CPU, and then simply "drop" the heatsink on top and push down to spread the thermal paste out. If the thermal paste is "runny" enough, this isn't a bad method (so for something like AS5, which isn't very thick, it works reasonably well).
For thicker pastes, like ICD7, for example, this generally won't put enough pressure to spread the paste out sufficiently (when dealing with notebook CPUs... desktop CPUs generally have larger heat spreaders and can apply more force, making the dollop and mash method more effective there). For these, put the same dollop on the CPU, and then use either your finger in a plastic bag, or take a credit card or piece of cardboard and gently scrape and spread the thermal paste across the entire CPU in a thin layer.
Personally, I use AS Ceramique (got a big 22 gram syringe of it a few years back... still have most of it) with sort of a combination of the two methods. I dollop, spread it out until it covers the entire surface, and then carefully mash down. Of course, most of the reason I pasted was for the GPU in my old Gateway; although I ended up having to paste both CPU and GPU because removing the heatsink on the GPU also required pulling it off the CPU, since it was the same assembly.
Oh, and the Arctic Silver site has instructions on application techniques ( here). If you look at them, you'll notice they're largely variations on what I've mentioned here.Last edited by a moderator: Jan 29, 2015 -
Tsunade_Hime such bacon. wow
Judicator has it right, but I wouldn't use my finger (finger oils, dirt, grime on your finger). Plus you got TIM on your finger. I personally have like a spreader that came with my old Cooler Master thermal paste, or you can use business cards.
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tilleroftheearth Wisdom listens quietly...
"Use finger in plastic bag".
That's what he, (Judicator), said. -
I have used the line method on about 3 laptops and during times where I upgraded the CPU and had to remove the heatsink for cleaning, I observed the thermal paste had always spread out to cover the area perfectly. This was always from using thick pastes too. The resultant good temperatures also confirmed this.
With a paste like ICD7, perhaps that method would not be as good because it is much thicker as Judicator mentioned. I think I remember hearing that MX3 was changed to be easier to spread out. -
I'd get ICD7 or ICD24 which are pretty much the same thing. I have 24 and its excellent for the job
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Thanks very much, guys, it went just like I thought it would. I plopped a few drops stretched it out a little bit and then just smashed the heatsink in and voila, here I am.
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I prefer shin-etsu. Also I spread it evenly and very thin with a razor blade.
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On a laptop I usually use a little finger pressure on the heatsink before I secure it to make sure the goop is spread across the chip. Laptops typically don't have as much force applied to the heatsink as desktops do.
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I ordered another T9300 for my sisters laptop, who uses basically an Inspiron 1520 and I'll be sure to use spread it out a bit more evenly with hers than mine. I just put mine together well, at the moment I have 45*C, which I don't think is bad for this processor. I'll be properly undervolting and running stress tests within the night or so...
New Processor Arrived, What Thermal Compound?
Discussion in 'Hardware Components and Aftermarket Upgrades' started by Mihael Keehl, Apr 4, 2011.