Questions about MXM 3.0 B VGA cooling systems

I’m curious about rear part of MXM 3.0 B elements cooling like back plates

and other cooling elements attached to rear side of VGA boards (mainly, vDDR chips are covered with metal shims attached to x-bracket).

In some laptops such elements are used and in some systems – not.

How important mentioned addition elements are and how it works?
What’s the efficiency of those add-ons to cooling system?
It’s easy to make L-shaped cover for vDDR rear chips but first I need your opinion, observation experience and thoughts about this. Does it worth of the efforts?

 

In my experience, the backplate or X-bracket seems like a tacked-on gimmick that just makes it more annoying to upgrade.
My laptop doesn't use or need either one. My 7970m is a champ and quite cool even without those. The previous GTX-460m was the same way.

 

GDDR5 does not really need it.

 

Thanks for your opinion. Actualy my system also work without that things.
It means that it's useless. But does anybody know the reason for those elements were created?

 

might offer a little heat diapason even help reduce thermal stress.

 

It's suggested if you're OCing. I know someone burnt out their DDR3 VRAM when they pushed the clock rate from 800 mhz to around 1200 mhz, without a heatsink (because the existing heatpipes were blocking it).

 

THX!
Good warning about OC!

 

As far as OC I don't think anything unique DD3 vs DDR5. What I am saying as monitoring thermal stress (heat) and artifacting should prevent you from frying. If you do the same stress on GDDR5 same will happen..

Might post back getting called away but OC is a different ballgame.

 

Those plates wont have much of an impact.

DDR3 != GDDR5

8ghz GDDR5 does not need a heatsink even.