So what is supposed to be the right amount and way to apply thermal paste?

I've heard and seen so many different views of this that I have no idea anymore.

Whenever I see a laptop CPU/GPU, it's basically covered all over with the thermal paste like these:
http://macdevcenter.com/mac/2006/05/23/graphics/inside7.jpg
http://imageshack.us/photo/my-images/24/p1050822p.jpg/sr=1

But from what I hear, you should only put a grain of rice of the paste in there. Does it just spread like that anyway? And is it supposed to look like that?

Then there's the whole spread or don't spread issue. I've heard to not spread it on desktop CPU, but you should spread it on laptop cpu. Is this true? Why doesn't laptop CPU get air bubbles? it doesn't make sense. And how about laptop GPU then?

I want more grounds on your answer than that it's how you put it on. I want actual tests or real experiences or reasons or something that explains what is the right way to apply it.

 

Go by manufacturer recommendations. Usually it's a small grain even on laptop CPU/GPU. The reason some people recommend spread on a laptop is because there is no IHS or integrated heat spreader, you are applying it directly to the die so you really should have the entire surface covered. On a desktop, the die is under the IHS, so as long as you get a circular pattern over the die you're ok.

I've personally always used the grain method and never had an issue.

 

cover all chip, then squeeze tight to make thin layer. Better to have extra than to have uncovered areas, trust me on that part.

if you insist on the drop in the middle, then make sure you put drop big enough.

usually, when you put a drop it goes in circular form, so it will spread in circular form as well when squeezed by the heat sink. And I'm almost sure the chip you're trying to cover will not have circular contact area, so make your own conclusions.

also, better use compound that will not get hard over time. Now I'm going to get some arguing on this but there are vibrations that will appear over the life of your laptop, so it's possible hard compound to crack and/or separate from either surface area (chip/heatsink), thus loosen the thermal conductivity, and that would be bad.

now if you're trying to make a record in overclocking though, then we'd have different talk about this issue, and it's likely you wont even use thermal compound.

P.S. I've always covered all chip and also never had issue.

 

If you use something like ICD7 though it doesn't ever harden.

 

what about rotating the heatsink on the cpu a couple of mm left and right to remove air pockets, anybody heard of that one?

John.

 

heavily depends on the TIM used. there isn't a solution that fits all.

 

I've done it, works well. As long as you keep the heatsink down all the time until you put the bolts to hold it.

 

Are air pockets a real problem, or something invented here on NBR? I'm serious. I have been in the overclocking scene and following it for about a decade. I never heard of it being a problem until someone posted a bogus youtube video here about a month ago.

 

Has anybody ever practised using a piece of glass to simulate the heatsink, so you can see though it and check how well the paste spreads.

John.

 

I've used a piece of glass before, yes. I usually do squish it and wiggle it, just never pull up on it because that will create air bubbles. Maybe I should video it next time with a piece of glass ..

 

I too would like some actual video or photo evidence on how the resident forum members here have applied thermal paste. I'm looking to get thermal paste to use on my future laptop soon, so I want to be ready to apply it.

 

Those photos look exactly like every laptop I've ever seen has had thermal compound applied. I'm pretty sure its done by machine, and their thinking is better too much than not enough. The second photo is a patty of thermal compound that is pre-applied to the heatsink assembly, which is then applied to the component.

All high performance thermal compound manufacturers should have instructions on their site for the proper installation of their products. I've never used IC7, so aren't sure about them, but Arctic Silver definitely does. You can find the instructions here at Arctic Silver: Arctic Silver, Inc. - Instructions The Instructions at Arctic Silver's site DO vary by CPU type.

They perform extensive testing to determine how these compounds work, and what is the best way to apply them depending on the type of CPU they are being applied on. Why would you want to use instructions from any other source than the manufacturer of the compound you are using?

 

The technical definition of "best" would be just enough to create proper contact and not a molecule more.