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    Vaio FW cooling modification?

    Discussion in 'Hardware Components and Aftermarket Upgrades' started by andrewliu6294, Apr 4, 2010.

  1. andrewliu6294

    andrewliu6294 Notebook Consultant

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    I disassembled mine again yesterday to reapply the thermal paste, as I did a pretty shoddy job the time before. :eek:

    While taking the heatspreader off, I noticed it was made of extremely low density cast aluminum. Since that area is not reached by the fan, it serves to passively cool the chipset and video ram, which it probably doesn't do very effectively.

    The only actual purpose it serves then, is to put pressure on the copper heatpipe attached to the gpu (with little springy tabs, so it doesn't actual contact the heatpipe at all)

    Now this shouldn't even be necessary, as the gpu heatpipe is connected to the same heatsink/fan as the cpu heatpipe, and won't fall off or anything of there's no pressure on it. As long as the thermal paste is applied properly, that alone should be able to hold the thing in place. Is the pressure actually needed?

    This brings me to my next thought. Wouldn't passive cooling be vastly improved if the giant aluminum heatspreader was replaced by individual copper ramsinks (for the video ram), and a small chipset heatsink?

    Here's a picture of the motherboard for reference. Areas circled are the chipset and vram
    [​IMG]
     
    andrewliu6294, Apr 4, 2010
    #1