What type of solder is Intel Haswell using?

Intel decided to change from fluxless solder with 22nm technology. Does anyone know whether the new Haswell CPU is using fluxless solder again?

 

You mean this? http://www.makeuseof.com/tag/two-ways-to-cool-down-your-defective-overheating-intel-cpu/

I don't know if that was corrected after that though.

 

afaik, they still use whatever they used for Ivy Bridge with Haswell. This counts only for desktop CPUs though, laptop chips are still bare die.

 

I did some more research, seems they are still using thermal paste for the Haswell. But the issue doesn't seem to be the paste, instead they seem to put it on too thick. If you use the same paste, but thinner, you get lower temps.

 

I dunno, the thermal transfers are so bad watercooling actually doesn't yield much of a headroom. I remembered the engineers mentioned something about expansion and contraction as the reason they went with thermal paste again.

 

I read a paper on it. With the solder, it would develope micro cracks from the heat causing expansion, and then contraction as it cooled. My point was that many people have gotten better performance by putting what they thought was better thermal paste between the heat spreader and the die/chip. Others found it wasn't better paste, just that they had put it on thinner than Intel did. This was with Ivy Bridge, and was not fixed with Haswell.

But if you think about de-lidding your desktop, keep in mind about 25% who tried broke the chip. Broke as in totally dead.

 

Yeah de-lidding is not that easy, definitely not for the faint of heart.

 

The vice method is definitely better than the razor method.

 

Thank you for your answers.

I will wait for 14nm before considering my next upgrade.

It would be great if AMD could deliver a good alternative. They have a good concept with the APU, but they need to deliver more graphics peformance than Playstation 4 (Radeon 7870) with eight-core Streamroller/Excavator and integrated 8GB memory. Sure, they would have to substancially raise TDP but this is why liquid cooling exists and could become more mainstream.