HP Envy 14 (& Beats) sandy Bridge is real & POSSIBLE ordering

Wow you are desperate resorting to personal attacks.

1. Please tell me how stamping would produce a Envy 17 chassis. I mentioned already milling would be more efficient because of the nature of many of the parts of computers.
Stamping cannot produce multiple holes for a keyboard, without requiring changes in machinery, meaning additional machine.
Stamping cannot produce complex shapes that are required in the chassis.
You have yet to respond to how the aluminum trim can be stamped, I don't see how squishing and object will produce a vertically aligned trim.
Lastly have you ever been to a milling operation? Most of the excess produce can be utilized to make smaller pieces, lastly many large scale milling operations or even stamping or even casting typically have an on-site recycling center. Or at least most of the manufacturers of steel products do.
2. How would stamping create the little lips/and little clippings that are found in LCD covers, palm rests, and the aluminum trim? Like I said you really need to disassemble a few dozen laptops before you speak. Seriously kid, just drop it. A pan =/= a laptop.
3. What about the routings that are often integrated into the LCD panel?
4. I know 100% some of the XPS Dell's aluminum LCD covers I've worked with weren't stamped as they had clippings/screw holes. How did those get there if not by casting or milling?

Is stamping cheaper? Heck yes it is, there is no arguing however answer me this: How do you create the chassis, hinges, and other parts of the laptop?
Where is your proof that HP does indeed stamp out the parts as you say they do? With Dell I've no doubt they probably do stamp out the aluminum bits, but the majority of their metal materials are magnesium alloy which I know are cast.

So tell me how does it make sense economically to have certain smaller parts stamped, shipped to Shanghai (Probably Foxconn) to have them laser etched then painted when they can have the very same stamped parts milled or cast out right there on the spot, just as Foxconn is doing for the MBP's.

I am well aware of P4 HT/Core 2 Duo's undervolting as well as cores now being able to shut off in even Core 2 Duo's through manual configuration, however what I meant to say was most of their practices for power savings and performance were tested in one way or another not that they never were developed further. It's very rare for a computer running windows 7 to shut cores down without being 100% idle with many services turned off, however it is very very common for cores to operate at nearly the lowest multiplier. Adding undervolting was a far better power management tool then "turning off" a core. I say that in quote because it's more like in stand by mode.

Cores being shut down has been a part of processors for a very long time, cores CAN be manually shut down for whatever reason. I remember doing so on my previous Gateway m6862 for power saving reasons (albeit there were very little power savings due to the POS chipset/processor/gpu combination).
The only thing the latest generations of processors have done is do it automatically.

Lastly as I said if Intel's trend continues as it has:
1. Produce new architecture. (Nehalem)
2. Produce refresh (Sandy Bridge)
1. Produce New architecture
2. Produce new refresh.

Then yes the next step is Ivy Bridge, and as already known will be a new architecture change.

If we take a look at new archtectures/old architectures, we will see a trend of power savings/losses.
1. Intel Pentium 4 to Core Duo produce no real significant power changes only performance changes.
2. Core to Core 2 refresh brought significant power changes and even further performance changes.
3. Core 2 to Nehalem brought considerable power increases however it vastly suffered in the power savings department. This can be seeing in older laptops with Core 2 Duo's and later laptops with i3-i5- and i7 dual cores.
4. Nehalem to Sandy bridge brought massive performance boosts, and massive power savings.

IF the trend continues. 5. will be Sandy bridge to Ivy bridge which will bring out performance boosts, but little to no powers savings at best.
That is IF THE TREND CONTINUES, not that it's written in stone.

 

Oh god.

here is the deal, stamping can produce fairly complex shapes. If not is your car completely milled? its quite easy to make a stamping machine that makes multiple holes. Since you dont know for fairly good amount of time bending machines have been a common sight, cut the aluminum, bend it, and you are done.

Was there power leakages in those cpus? I bet there was. Oh sorry there was. So the current still passed and the core didnt enter a S3 state, thus still consuming power, and thus still liberating heat, now you know how turbo boost works, welcome to the club that understand this, we are few and courageous people that read white papers and the tech docs.

 

1. Actually most car parts in terms of chassis are cast. Not sure if you knew that. Some parts in the motor/chassis/and interior and exterior are milled. Which parts I can't say without having a good look at the car and having the parts on hand or better yet just buying them, but I can assure you most cars are cast or milled with some stamping going on.
2. Fasteners - Small Parts for Automotive, Concrete, Steel Bldg, Mining, Rail Car
There are examples of stamped products, keep in mind many of them are multiple pieces and likely were welded together. Yeah can see the limitations in stamping pretty easily in even other stamped produces..

Lastly you keep ignoring my request to show me how a chassis could be made from stamping.

Well good job you courageous Sparthan, you can read. Hell I read tech docs as well.
You've yet to refute my claim that most features in SB have been tested by previous processors in one degree or another, then of course developed.
It's call research and development, you should learn how they work.

Now excuse me as I have better things to do, please don't waste my time unless you can address the points above. Thanks.

 

This is my last comment on stamping.

Lindy Manufacturing Company Gallery

Look through their gallery everything they make is stamped. Theres a lot of complicated shapes. The more complicated the shape the more stamps it takes. It's usually done in multiple stamps to slowly ease the metal into the desired shape without fracturing or wrinkling the metal.

I'm pretty sure that everything on the envy is stamped. The cutouts are easily done on a CNC after they're stamped out.

Theres tooo many feathered angles on the envy to reliably mill them out in the required time. Thats why the MBP has more sharp edges and less roundness.

 

CNC=Milling FYI


Also keep an eye on the forms that stamping produces then go through the service manual for the Envy 17 and take a look at the parts. Figure out the limitations of stamping by that companies gallery, it's not very tough. Also keep in mind how stamping is made, which is basically pressing and object into a mold or some type typically remaining fairly flat.
Then let me know if you think they are stamped or not.

Actually here's a guide for the Dell E6500 I posted on ifixit for disassembly.
http://www.ifixit.com/Teardown/Dell-Latitude-E6500-Teardown/4398/1

 

Since you edited the post, I have to punch another holes in here.

SB is an arch change, the tick was arrandale and lynnfield, the new tick is ivy bridge.

The p4 to core duo, brought so many power related saving features that I shall direct you to the ars technica for quick reading, use the search function. Mostly delve into what was offered in from the p4 to centrino to core duo. There was a major change in thinking.

There was no mobile chip using nehalem. only arrandale and lynnfield were made. The lynnfield ones are basically the quads, which due to it being a mere transplant they were hot, and very downclocked.

You cant really compare nehalem to SB, due to them being apart by one tick. The latter is going to have more performance clearly.

btw not all cnc is milling.

The choice for what process is used is basically, defined by this:

-material used
-resistance needed
-durability


The engine was entirely milled, due to the aluminum being a not so good material to be used, although lighter it had lower resistance. With the advance of aluminum alloys they started to only cast, which gives a lower strength material, thus was not used, although a cheaper process. Most of the car parts are stamped.

Stamping is by far the largest used manufacturing process. And mold injection being for plastics in general.

Im starting to wonder if you do have any connections, since you dont know what you are usually talking about.

Im going to stop posting here since Im only feeding the troll.

 

Apologies Intel does indeed consider SB to be the "tock", meaning a new architecture. Sorry, got confused as both architectures are quite similar.

Also you made a few errors in your post in reference to the tick (westmere) and Lynnsfield being a mobile processor when it actually is a desktop processor. Clarksdale is what you were referring to. Also all mobile arrandale/clarksdale are of nehalem architecture, just to let you know. There's no such thing as an actual processor code named Nehalem, it's always Lynnsfield, Bloomsfield, Gufltown, clarksdale, arrandale etc etc... All of the mentioned codenames all utilize the nehalem architecture.

Here are some processors using the Nehalem architecture:
i7-720QM
i7-740QM
i7-920XM
i7-840QM
i7-940xm
(I think I am missing a couple quad cores, not sure).
All dual core i3/i5 processor in exemption of SB dual cores.

I won't argue with you in terms of manufacturing just because there's more pans being manufactured with stamping, doesn't mean that's how laptop manufacturers do it. I advise you to please get some experience in mobile laptop's construction before you talk.

 

Yes. I think we should wait for official HP news. Who knows, maybe they'll surprise us. Probably not, but maybe!

 

Got plenty of notebook construction, worked for IBM.

BTW all those quads that you put, are lynnfield based, they are basically simple transplants as I said, and due to this they are hot. And yes you missed the 820qm.

Nehalem is LGA 1366, they were made for servers. They are going to be replaced by LGA 2011

btw lynnfield was a tick. die shrink

 

What? Nehalem is the architecture code name not processor code name.
Bloomfield is 1366.
Dude go back and read up on Nehalem and the processor codenames.

All processor code names you have mentioned are using the Nehalem architecture. There is in fact absolutely no actual processor with the codename Nehalem, none. Nehalem is the architecture the actual processors are named differently depending if it's mobile/desktop and dual or quad core or hexa core plus die size.
Arrandale=Nehalem architecture
Clarksdale=Nehalem architecture
Lynnfield=Nehalem architecture
Clarksfield=Nehalem architecture
Etc etc

Not sure what you were working for with IBM, but it must have not been construction. Care to mention what you did for IBM?

Wrong Westmere was the Tick. Nehalem was the Tock.

Lynnsfield is a 45nm lithorgraphy, not 32nm as Westmere (or Clarkdale/Clarksfield).

Please re-do your research, you keep spewing nonsense now.

 

Ughhh.. so tired of this bickering. There hasn't been anything of note on this thread for at least 5 pages, maybe even all of them. Can an admin spare us this blather and close this thread?

 

I was a senior analyst in the laptop construction sector.

Never said that the Nehalem wasnt a tock.

And yes we, per usual, refer to the name of the total arch, in this case nehalem, to first series of chip that it provides, in this case Bloomfield. Just like Sandy bridge is part of the Huron River, but strangely enough everyone is making the distinction, guess we well see how this holds up with the upcoming processors.

And yes you were right, the tick wasnt a die shrink for Lynnfield, but some improvements done, and some stripping to the chip. But it was a tick nonetheless.

 

Hey I don't mind having this thread closed.
Anyways, this is last time I give any info to the NBR community, I will just keep my all information I get to my self and let you guys keep going with your prediction thread and cry over a radiance display, as if HP can bully the LCD manufacturer to start making it again...

Im outs/OP removed.

 

Huron River is the platform codename... not even related to the architecture just the way the chipset/wireless card/processor/ram will be set to create the "platform". Usually to differentiate between new/old.

Anyways OP edited.

 

Thread closed, it is obviously going nowhere.