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    Compal IFL90 cpu selection

    Discussion in 'Other Manufacturers' started by GUnsm0k3, Feb 7, 2008.

  1. GUnsm0k3

    GUnsm0k3 Newbie

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    GUnsm0k3, Feb 7, 2008
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  2. Donald@Paladin44

    Donald@Paladin44 Retired

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    Yes, that processor should work just fine in your IFL90
     
    Donald@Paladin44, Feb 7, 2008
    #2
  3. GUnsm0k3

    GUnsm0k3 Newbie

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    Just got it and ran into a problem.

    On the bottom right corner of the CPU there are 2 missing Horizontal Pins.

    Where as on the MB of the IFL 90 there are 2 pin holes missing vertically. That's also on the bottom right corner.

    Could it be on the off chance a manufacturing mistake. Or would it be my mistake?
     
    GUnsm0k3, Feb 7, 2008
    #3
  4. enricosax

    enricosax Newbie

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    Hi, i'm sorry for my english

    Intel T5500 is socket 478, compal ifl90 mb is socket P

    T5500 is FSB667 and dont have a good price

    you can see socket P family (T7250, T7300, T7500, T7700, T8100, T8300, T8500)

    The 8xxx family have a good price/performance
     
    enricosax, Feb 8, 2008
    #4
  5. RePaRaQu

    RePaRaQu One name. One legend.

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    Intel T5500 is socket 479

    Are you sure, look at this.
    http://processorfinder.intel.com/List.aspx?ProcFam=2643&sSpec=&OrdCode=
     
    RePaRaQu, Feb 8, 2008
    #5
  6. RePaRaQu

    RePaRaQu One name. One legend.

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    :confused:

    Check this out.
    -------------------------------------------------------------------------
    Micro-FCPGA
    The micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.


    -------------------------------------------------------------------------
    Micro-FCBGA
    Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls, which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top side.
    -------------------------------------------------------------------------

    Look at the bottom picture of both CPU and then at the pin(s) it doesn't look the ide........
     
    RePaRaQu, Feb 8, 2008
    #6