CF-28 Motherboard Question

I have a CF-28 800MHz motherboard i am re-installing. On the underside of the board there is a substance that kind of looks like thermal paste (TIM) but more rubbery.

Anyone know what this is?

I've checked the service manual and it doesn't 'seem' to show it in the exploded parts view.

As I said it looks like thermal compound but it's in an odd place given it is on the motherboard not on a chip. It's at the back of the board right in front of the docking station port - but on the underside of the board. There is what looks like a heatsink on the upper casing which lines up with the unknown compound.

If it is thermal compound then no problems i'll just throw on some new stuff and job done - if it isn't thermal compound any suggestions what I can use in it's place?

 

Aha, after taking another look through the service manual I think the rubber compound might be part no DFMY0275ZA with description RUBBER, HEAT CPU 1.

This makes sense - so has anyone used ordinary thermal compound here (silver based for instance) or does it have to be a rubber based thermal compound?

Could be fun finding a rubber thermal compound in UK.

 

Its definitely thermal transfer compound.. It goes between the heat-emitting chips on the mobo and heatsinks mounted in the housing. Did you totally obliterate yours? I've had pretty good luck saving the rubber pieces when removing/replacing the mobo.

 

Just like gravitar said. A lot of the units have a pad instead of paste (less messy) but if you destroy yours, paste will work in its place.

 

Unfortunately the rubber compound just broke into pieces as soon as I lifted the mb out.

I think i will try this http://www.maplin.co.uk/Module.aspx?ModuleNo=221326 as a replacement.

Although i'm a little worried about the thickness of the tape and the gap between the mb and the case heatsink - might be able to trim it if needed

I'll post the results.

 

It's normal for that to break up but as long as at least half of it is still there (even if in pieces) you're still fine. 28s just don't generate that much heat.

 

OH GAWD NO!

Sorry for the alarm - but this product is what we OC-ers refer to as "Frag tape"; it's used to hold heat sinks to chips on the mainboard & memory. This stuff is UBER-STICKY - I've seen people peel chips off of RAM trying to get the heatsink off after using this stuff.

Obviously, you'll play h#ll trying to get your MB back apart if you glue your processors/heatsink down with it...

mnem
*Well, I guess that concludes the mechanical stress-testing testing phase of our memory review...*

 

yer, kinda came to the same conclusion - bought some this afternoon - it's good stuff (damn sticky) but wrong application point.

I think i'll stick to good old thermal compound. that way i can always clean it off the next time i have to take the motherboard out - without having to use a crowbar.