Hi,
Have CF-C1 mk2 that was running hot and throttling under load so I decided to change heatsink thermal paste.
Same heatshink goes over both cpu and chipset but there's huge gap between chipset die and heatsink and there was nothing in there but huge blob of paste. Measured gap with feeler gauge and it's ~0.5mm.
Filling this big gap with paste feels just wrong, is it supposed to be like that? I've now ghettoed 0.4mm copper shim and paste in there, made a small notch on shim so it'll lock into one of the groves on heatsink preventing it to slide out but I still feel bad about it. Didn't go with 0.5 shim since heatsink is not exactly parallel with die and if it gets lifted on one side maybe it won't make good contact with cpu die.
So what should I do, use blob of paste, copper shim or maybe thermal pad? How "squishy" thermal pads are? Guess pad should be a little thicker than gap itself?
Thanks!
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Just a little update for anyone that may run into this problem. Instead of thermal pads which where hard to get in required thickness I ended up using thick paste which is advertised as pad replacement and sold under name "K5 PRO" on ebay.
Repaste with arctic mx-4 did nothing for cpu temps on CF-C1 in the end. (has nothing to do with k5 paste, which is only used for chipset). Still can't sustain turbo boost for longer than 20-30sec before throttling. Honestly just looking at heatsink assembly it looks severely undersized for 35w tdp cpu.
CF-C1 mk2 heatsink/cooling
Discussion in 'Panasonic' started by Kerozin, May 4, 2018.