I removed the bottom cover on my CF-29 to upgrade the wireless card and see that they use the cover as a heat sink for several chips which I think one is the CPU. It has has some heat sink compound on the chips, should I clean and reapply some compound? If yes what should I use to clean the chips and what type of compund should I use?
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If the compound is flexible at all smoosh (tech term) it carefully to the center and re-use. Make a square of both thumbs and forefingers and just try to thicken it a skosh. If it crumbles to pieces you went too fast. Then...
1. Read the FAQ.
2. Use this:
TEST site:forum.notebookreview.com/panasonic - Google Search
Replace TEST with thermal pad CF-29
Personally I use 1.5mm thermal pads cut from sheets from FrozenCPU. It's been written up several times. No sense me repeating it here. Search as above.
Caution: thermal paste is not enough by itself for the CF-29.
Jeff -
I like to eat paste.
Paste is good food!
CPU heat sink compound question CF-29
Discussion in 'Panasonic' started by rdsmt, Jan 31, 2011.