Clevo P177SM-A Overheating - Thermal pad help?

Hey guys! could use a bit of help. My laptops GPU has been overheating quite a bit ( reaching up to 93c when running something GPU intensive) and was wondering if you could lend me some advice? I tried repasting my GPU and CPU using Thermal Grizzly Kryonaut, and my GPU is still over heating (reaching 94c now!). Followed the instructions on the package using a thin layer of thermal compound. I'm assuming the issue might have to do with the thermal pads. and my GPU memory overheating...in which case, does anyone have a guide so i know what thicknesses to use and where to place them?

I also purchased new fans just in case, but barring that is there anything else i can do to increase airflow and decrease my thermals? Is thermal grizzly conductonaut compatible with the heatsinks for this machine?

Also what sort of applications should i be running to get average temps? What should my GPU temps be ? Thanks for any help in advance !

I have a GTX 880m
i7-4910MQ CPU @ 2.97ghz
running windows 8.1 pro
Clevo P177SM-A Chassis aka SAGER NP8298 (Via Mythlogic)

 

<pls delete>

 

Dont pre spread, you introduce aur bubbles. Use the pressure of the heatsink on a pea sized blob to spread it.

 

Thanks, I'll try that out next time I repaste. Off hand you wouldn't happen to know what sort of thicknesses and where i should place new thermal pads at ? Could i use a liquid metal paste without damaging my heat sink ?

 

It sounds like you are new to this so perhaps best to avoid liquid metal. Not off the top of my head on thickness but you can measure the original pads to get an idea to the nearest 0.5mm.

 

Thank you for the suggestion, and prompt response. I have over a decade of experience using standard thermal compounds while building and servicing fleets of desktops. Wasn't able to find a definitive answer for whether or not the heat sink would be damaged using liquid metal compounds during my research. Heating pads are new to me as most components in desktops typically don't need them unless you're doing extreme overclocking. I've seen some diagrams for other clevo models, and they seem to have a variety of different thicknesses in various locations. I was able to determine the thicknesses of a few, but given the fact mythlogic was kinda slipping the last time i sent my machine in for repair I suspect they may not have placed enough / used the right thermal pads, as a few seem to be missing judging by other models. it looks like 1.5 might fit for some of them, and I was going to purchase Fujipoly thermal pads, just wanted to make sure i get it right, since that brand is quite expensive.

 

Liquid metal can be used on copper heatsinks, it must not touch aluminium. To use it there must be pretty much perfect and close contact to the die.

Thermal pads need to be touching:

VRM chips (the very little little black squares)

and

Memory chips (the big black squares around the core)

 

Right, avoid LM on aluminum cooling systems (unless you want a fun science experiment) - https://www.gamersnexus.net/guides/...cts-copper-nickel-and-aluminum-corrosion-test

 

It can feel fun to crush aluminium with your bare hands.

 

Yea I knew that, i just wasn't;'t sure if the heat sink or the GPU die was made of aluminum or was a copper plated aluminum alloy. Is there a way to test it ? Anyone know off hand?

As far as thermal pads go, should i just go for 1.5 all around? would that be enough for the gtx 880m? If i go too thick would that cause issues ?

edit: w/pics
https://imgur.com/a/tDcz9vr

 

LM is safe on the heatsink (copper) and on the CPU IHS (nickel plated copper). If I recall correctly, the GPU die is also nickel-plated copper (but it would be great if someone can confirm).

Thermal pads being too thick can result in poor contact - yes, that will cause issues (with cooling).

 

The GPU die is silicon, there are no commercial dies with metal tops. That only really exists with some VRMs where the top is also electrically live.

 

So i made a diagram just to be sure. Does this seem alright? Do i need more thermal pads especially on i and j ?

Also i have no idea how to resize an image on here ._."

 

Look at the heatsink, are all the parts with the same height in your picture also the same height? Normally the inductors have a thinner pad and the memory is around 0.5-1mm.

Take the card and lay it o the heatsink and check if it's flat.

 

1. disassemble the cooling
2. place small plasticine balls, on the most-important components
3. mount the cooling (stick the tape on the core to not damage it)
4. disassemble the cooling
5. measure the thickness of the balls = the thickness of the thermopads