Custom heatsink mod

Hello. A separate topic dedicated to the user fashion heatsink (radiators) laptops. Add here links to posts with mods for better navigation. Thx

 

You can't just add thermal mass, you need to think about airflow and surface area for that airflow.

 

1. Cooling will be due to high edges and may have to use the fan GPU.
I Make a hole so that the air gets on the edges of the processor radiator. I will make such an experiment.

2. The problem of the base heatsink is a curved plane and poor pressure on the processor (CPU).

3. The protrusion of my prototype is larger by 1 mm for more pressure on the processor (CPU).
Example of how to increase the pressure on the processor (base heatsink) using: liquid metal, 1 mm plate and high-temperature sealant

P.S. Need to know technical information what is the capacity of the installed heat pipes on the basic heatsink.

 

A small high surface heatsink that had airflow will outperform that. Look at the radiators on the heatsink, add the third fan if you want that would make a difference.

Modify the mounting, modify your IHS or sand thr base.

 

@ole!!! something like this CNC made with the soldered VC?

 

his with the pre TM so no 2nd CPU fan. for low fan noise, a bigger capacity will do wonders they handle burst loads quite nicely without having to see temp go up to 85-90C before fan starts to spin. theres lack of over all dissipation, surface contact on CPU as well as heatsink capacity, everything is lacking in TM with 6-8 cores.

 

They also cool down a lot slower and raise in case temperatures, watch out you don't cook the VRMs.

 

What heatpipes / fins are you going to go with? I might suggest thinning the center section, making thicker heatpipes possible could be interesting.
From China, there is an AIO Heatpipe / Waterblock option for some Sager models.

 

Bending the heatpipes so that they cover the whole IHS area would be a given with this mod to maximize the efficiency.

 

Concentrating on die contact is most important and the coverage of the heatpipes as lateral thermal transfer is slower than the vertical up from the die.