D900F Overclocking or not?

Does the D900F have overclocking or not? I know its not in the bios but can you use SETFSB or Clockgen to overclock it? someone update me on this?

 

I really hope so...As of right now i don't think so

 

i asked justin and he said the 975 extreme will but he didnt say anything about 950 or 920.

 

If so that should be unlock multi, so only 965 975 can take advantage of that.
Problem is even ES 956/975 are also very expensive......

 

i did ask him about the 920 and 950 but he hasnt responded... no offense to him but kinda frustrating when your anxious to know this information lol

 

correct me if i am wrong but doesn't oc voids warranty?

 

No it doesn't. Although I wouldn't ship it back under warranty with overclocks in place.

 

yea just clock it back to stocks

 

If he's indicating the Extreme (965/975) can only, then that is multiplier OC'ing via BIOS which would rock. If it's the case the Extreme chips can BIOS OC, then I'd hunt down a uber cheap 965.

I can't really see the BIOS allowing FSB pumping to OC the non Extreme chips. You will have to hunt down and get SetFSB working or similar ilk.

 

does any1 have their d900f with a 920 or 950??? if they could try a setfsb overclock that would be great!

 

I belive that Intel has neglected fsb in Core I7.

 

Yeah no fsb in core I7, but you can still just pump the base clock. You need to mess around with everything else too tho, unless it is a small oc. Does anyone with the D900f could check what can be tweaked in the bios?

 

justin told me for 920 and 950 bios is locked...

 

Well, it technically doesn't use an FSB, but still uses a multiplier associated with memory frequency so pumping the memory achieves the same affect (Ala AMD FX chips and beyond).

And yeah, that makes sense the BIOS would be locked for the 920/940/950 chips, since they aren't the extreme chips. I've never met a notebook that allows memory frequency(FSB) to be increased to increase overall core speed via BIOS.

 

KY_BULLET. You should remove the IHS and overclock that thing. Break records without breaking a sweat.

 

Thats what keeps the processor cool. Or am i wrong...Hell i dont know much about these things. But, I'm learning...

EDIT: If there is a way to OC it i will do it...But, I don't have much expierence at doing it throught the bios,I won't try anything unless i know for sure what i'm doing... I have used Clockgen in the past sucessfully.

 

Why exactly are the bios locked on laptops? I mean, I can understand my M860TU bios being locked since its super compact and would be dangerous to let young crazy kids mess with bios, but the big rigs like the D900f can take an overclock, no? On my i7 desktop, the bios let you do whatever you like, even set voltage to like 2.5 and melt the crap out of it.

 

You pretty much answered your own question, L4d_Gr00pie.

The IHS is there to prevent the delicate acryllic dies from cracking from the sheer mass and pressure from the heatsinks resting ontop of them. This is the case for desktops. But because the D900F does not have a massive heatsink to crush the die, and that the heatsink is bolted on and not clipped on, it is perfectly safe to have an i7 operate without the IHS. However, the process of removing the IHS from the i7 is a whole different story.

I used to pop off IHS's from old Pentium 4's and Xeons. The IHS is soldered on and it takes very acute skills with razor blades and a heat gun to remove it. However, you're looking at a payoff of ~5*C lower max temps.

 

maybe a good lap job on the ihs would achieve similar results in dropping temps instead of completely removing the ihs

 

The goal of lapping is to get a consistently flat surface on the IHS for maximum contact with the heatsink, and to removing the nickel plating to expose the copper underneath. IHS's are plated to prevent the copper from oxidizing. Unfortunately, it will never be as good as removing the IHS as the CPU die is already perfectly flat, and there would be no extra medium for heat to go through. Underneath the IHS is cruddy OEM thermal paste that bridges with the CPU die. Even with a perfect lap job, that would still be the bottleneck. The surface on the inside of the IHS is also nickel plated so the CPU die still won't get contact with copper. Heat transfering from the CPU die to the thermal paste to the IHS to more thermal paste and finally to the heatsink isn't as efficient as a straight CPU die to thermal paste to heatsink bond.