Finally delided my 6700k

Bought a delid tool like 3 months ago but couldn't work up the nerves to do it. I have kinda shaky hands so it was still quite a challenge. I figured it's now or never, the weather is getting warmer and the CPU might get a bit hot during summer.

I haven't done any real tests yet, but I played some World of Warcraft earlier today and the CPU reached 84c (Before Delid). After Delid it reached 61c while playing WoW. So it seems to run more than 20c cooler (In WoW atleast). I think the IC Diamond made the GPU run a little cooler as well.

The stock thermal paste was not IC Diamond, cause I cleaned up the GPU core and it was shiny as a mirror. When I tried to put some IC diamond on the GPU it didn't want to stick to the die. So I had to clean up the mess and try again, but that made the GPU die all scratchy :/ Oh well, can't be helped I guess.

(I did use liquid ultra for the Delid)

That tells me IC Diamond was not the stock TIM, or else it would have got scratched when I cleaned up the original stuff. My job at applying the IC diamond was rather messy so that could probably be done better and maybe gain another degree or two.

I don't have any real intentions to overclock, just wanted it to run cooler and quieter. Fans used to ramp up just from watching Youtube videos.

Hopefully I don't have to do this again, sucks having unsteady hands.

Update: It reached 75c in Prime95 (Large FFTs) Was 93c before Delid. Didn't want to run Small FFTs before Delid cause I think it would reach 100c. Was also automatic fan speed, I won't bother to use 100% fans cause would never use that normally, way too noisy. Good enough I guess.

 

Thermal compound's point and purpose is to fill in the scratches and gaps, so I'm sure it's fine. Those temps in WoW you mentioned are, like... wow.

 

They should be superficial scratches, generally if you dab rather than wipe with IC diamond you can reduce the scratching.

 

Hmm tested playing Rise of the Tomb Raider and the CPU max temp was 10-12c lower than before delid, but the average temperature was only 2-3c lower. I don't know, strange. When playing WoW the difference is much greater, but then again WoW only really uses one CPU core (and that core used to get very hot) and the GPU usage usually hovers at around 40% while Rise of the Tomb Raider uses 95-100% of the GPU most of the time.

It seems like the drop in temperature is much less when the GPU is being heavily used. Does the fact that the CPU and GPU heatsinks are connected somehow spread out the heat, so if the GPU gets hotter the CPU does as well?

Just ran Prime95 Small FFTs (which it says makes it run hottest) and it only reached 68c, with max fans this time. Prime95 Large FFTs reached roughly 66c with fans set to max. So it does seem to make a big difference when only the CPU is being used.

 

Heatsink design depends on the model, something you have not mentioned

 

Oh yea, it's a p775dm3. The improvements in CPU temperature from Deliding is a lot less when playing games that stress the GPU.

When running things like p95 that doesnt use the GPU at all or games like WoW that aren't very GPU dependent the temperature improvement from the Delid seem much greater. (Closer to 20c)

Perhaps running fans on Auto can't get rid of the combined heat generated by both the CPU and GPU and everything heats up since the heatsinks for both CPU and GPU are connected by heatpipes. I guess it's kinda obvious that the cooling gets worse when the GPU is stressed as well.

 

set your fans to overclock. You'll see a difference immediately. Automatic fan curve isn't great takes a lot longer to ramp up for cooling.

 

also unfortunately it is a shared heatsink which is a real shame for the model. Before my Delid I struggled with high CPU temps while playing games on Ultra. The gpu never seemed to have an issue but now I'm seeing cooler CPU with overclock setting on fans I don't go above 75 degrees

 

I'm really tempted to try this mod

http://forum.notebookreview.com/thr...ctive-cooling-mod-for-p775dm2-p775dm3.803626/

 

Did some more tests to get more accurate numbers how much temperatures improved after Delid (using liquid ultra) and replacing the stock thermal paste with IC Diamond.

The biggest change was in Prime95.

With default fan profile peak core temperature dropped by roughly 19 degrees (93 to 74), average temperature dropped by 14 degrees (83 to 69). With max fan speed peak temperature was 66 and average 59.

Gaming results were... less Impressive.

Witcher 3, 9 degrees lower peak temperature ( 86 to 77, 70 with max fan speed), but average temperature was just 4 degrees lower ( 69 to 65, 55 with max fan speed). However peak GPU temperature got 8 degrees lower as well just from changing thermal paste to IC Diamond ( 79 to 71, 62 with max fan speed)
Rise of the Tomb Raider, 13 degrees lower peak temperature (86 to 73, 63 with max fan speed) and average 4 degrees lower ( 65 to 61, 50 with max fan speed). GPU temperature got 7 degrees lower ( 77 to 70, 60 with max fan speed).

The GPU (1070) might be running a bit faster with the better thermal paste as well, or perhaps it's just my imagination.

Running fans on max speed seems to make a bigger difference than the delid when gaming. Then again I rarely ran the fans on max speed while playing games before I did the delid so haven't got much to compare against. Perhaps max fan speed wasn't as effective before delidding.

I had hoped for bigger improvements when playing games, but well it is what it is. It wasn't quite the miracle I thought it would be. I guess the cooling in a P775dm3 simply can't handle getting rid of all the heat from both the GPU and CPU at the same time (and when is only the CPU used?, other than in CPU stress tests). I suppose it does a decent job with fans set to max, but that's too noisy.

 

good job, welcome to the delid club

 

Yeah big loads like prime will benefit the most from good thermal contact Nice job.

Also in gaming the GPU is the big output of heat compared to the cpu.

 

What tool you using for delid CPU?

 

I used a razer blade and patience

 

Rockit88

 

Psh, easy mode people

But yes that would be more sensible

 

haha ive performed razor, vice and rockit88 methods and i definitely prefer the latter

Sent from my HUAWEI NXT-AL10 using Tapatalk

 

When i first start doing it i killed a 6700K with the razor technique, my wallet went all "ouch" and stuff...

 

i know the feeling! i killed 2 cpus when starting off, luckily my gf convinced me to try with cheapass celerons first, so when things finally got interesting at no. 4 (4790k), it survived (no. 3 being another celeron which survived as well, haha)

Sent from my HUAWEI NXT-AL10 using Tapatalk

 

I should maybe put a disclaimer in my signature of *safer methods may be applicable*

 

Well one year later and my temperatures are back to what they used to be before the delid. What the reason is I don't know, perhaps the fans are clogged, but I don't think so, cause the GPU doesn't get any hotter than before. Just after delid (and for most of the year, not sure when it went bad) it reached 75c in Prime95, now it reaches 95c... Was probably good for over half a year at least. But now it's terrible. I wouldn't say it's necessarily worse than before, it's roughly as bad. Maybe I should have used more liquid metal, but I was afraid it might end up in places it doesn't belong.

Part of the reason it got hotter was cause I had to reduce the undervolt, for a while when it was new it could handle -170mV. But that didn't last. However it certainly didn't get 20c hotter because of 20mV less undervolt.

I guess I'll have to redo it, hated doing it the first time. When dealing with these sort of fiddly stuff my hands get quite shaky, fear dropping the CPU sideways into the socket ruining it or something.

 

no worries there, i actually renew my LM application about every 3-6 months and i notice a temp difference after every new application.

 

Thanks for giving me a reason to never use LM.

 

Well when laptops reach these stupid temperatures there isn't much choice, unless you want them to overheat.

I wonder one thing, when other people have delided CPUs they often use nail polish to protect stuff they don't want to short out. Could you just protect them with the silicone you use to reattach the heatspreader?

Of course if the silicone is conductive that won't be a good idea, obviously. But I doubt it is, would obviously check that first.

 

It has the potential to be higher than the die and cause contact issues while nail varnish is a thin layer.

 

Well I redid the Delid the results were not as good this time. Last time I got 75c in Prime 95 this time 81+. However, last time I had 170mV undervolt this time only 150mV. I actually don't Think there was anything wrong with the Delid, it looked fine. Redoing it probably did nothing. I Don't Think I'll bother to redo the Delid again, next time I'll just replace the IC Diamond. I also tried Gelid Extreme, since IC Diamond is such a pain to use. Gelid performed terrible. But it was probably my fault. I don't Think I applied it correctly, didn't use the spatula (I tried but I have too unsteady hands, I couldn't spread it evenly). So I just used the "rice grain" method, but I used too little.

With Gelid (applied poorly) the temps shot up to over 80c nearly instantly (when running prime 95) so I thought screw it and replaced it with IC Diamond, which stayed at around 81c after 20 min. My poor application of Gelid would probably have reached 90c, but I doubt it would have performed as well even if I had used enough.

The temperatures are better than they were, but not as good as last time. If only there were Ryzen laptops with nVidia GPUs so you wouldn't have to deal with this delidding crap. AMD GPUs aren't good enough.

(Hmm something randomly capitalizes letters. Happens everywhere, annoying)

 

Did you re-lid it or just leave it loose?

 

I did relid it, cause I move the laptop quite often. I don't want it to be able to shake lose or something if I bump into something with the laptop.

However I smeared a very thin layer of silicone. thin enough that it was pretty much see through. Did the same thing last time.

 

as long as the LM is confined to below the IHS, the CPU clamp is more than enough to keep it in place without any leakage, even with lots of moving the machine. the more delicate matter is using LM on top of the IHS, thats where a foam dam comes in very handy

 

Of course you didn’t see anything wrong with the Delidde. The lid is not 100% pure copper (the outside is covered with nickel alloy). Hence the Liquid metal won’t suck into the copper in same way as a copper sandwich. And the fits between lid and die is always good.

Bad fits between the copper heatsink and the IHS or BGA die if you have this mess is liquid metals worst friend. And too little Liquid metal means some will suck into copper heatsink and the degradation will start faster than normal.

I used same LM application near 4 years in my AW17 without much temp degradation. Fix the underlying problems and it will stay put for years. .

 

Got any tips how to apply IC Diamond properly? That's probably my main issue why it didn't turn out as well as last time.

I've read heating it up in hot water (in a plastic bag, water outside the bag obviously) helps, but it's still difficult to use. You squeeze some TIM out and try to stick it to the heatspreader and it just stays stuck on the freeking tube. I probably didn't use quite enough IC Diamond cause I just couldn't get it to stay on the CPU. So I just figured that will have to do and stuck the heatsink back on hoping for the best.

 

The plastic bag tricks as you said aka heat it up and spread it out evenly on IHS. Another good options is to try Phobya NanoGrease Extreme who has similar viscosity. But a bit thinner. I would try it if you have problems with ICD. With ok heatsink the results should be equal or better.

 

You don't spread ICD7. Period. Make a ball in the center, and the pressure of the heatsink + the thermal warming of the CPU will spread it for you. It's OK to use extra TIM in the ball, since the thermal performance is unaffected by a thick layer.

If you want to make a line, you can do that too, 3/4 the length of the die. (Good for BGA CPU which is a rectangle)

 

A re-lid removes a lot of the benefit due to raising the lid back up away from the core.

 

I expect der8auer know a bit about how to spread thermal paste https://overclocking.guide/thermal-...d-with-air-cooling-and-liquid-nitrogen-ln2/4/

 

I've never had issue with a paste like IC diamond or thermal grizzly spreading properly. DB seems quite old school but putting that amount of effort in is simply not needed.

 

In todays TRIPOD heatsink world I would put some more work in the application of thermal paste than just put a small pea size blub on the Cpu die and just screw down. The flimsy heatsink attachment arm or call it legs doesn’t provide good enough pressure to spread the thickest thermal paste properly. This is not the only horrible thermal results I have seen.

 

I always assist with pressure on the heatsink when screwing it down which helps ensure good spread, it means even on my little tripod heatsink in my 13" it's always excellent.