GPU paste re-apply = +20*C

Just redid the paste on my GPU with AS5 and my temps are terrible now. The MemIO is idling at 73. Has anyone else had this happen with their w87? It's not my first time around the block, and I'm really surprised by this.

 

Something is really wrong. What were your temps before applying as5?

The heatsink is probably not making good contact with the gpu die. Remove the heatsink again and check if is coated with as5

 

It wasn't, I took it apart again and checked the contact: It was about 40%. I see what guys mean about the video card cage now, it keeps the heatsink up too high to make proper contact. I did the best I could to bend the cage back on every side, globbed on some more AS5 and pushed the heatsink down while the screws went back in. Now my temps are better than stock was, but I would still like to find a better solution to the cage interference.

 

I'm trying to learn a bit. I'm not as familiar with laptops. Thanks in advance.

Was there a thermal pad originally that was intended to "fill in" the excess space between the GPU cage and heatsink?

What was your final temp improvement over stock?

 

Same thing happened to me, i removed the stock thermal paste and found out that resellers use a thicker thermal "pad" or apply the thermal paste on the heatsink instead so it covers the whole chip (including the black tape around the die), I bought a copper shim about .75mm thick and used that to fill in the gap, my max temps are 80C (MemIO) now. my temps used to be 75C-85C but my MemIO was 100C-105C. This is running 5 minutes on furmark

Bending the case does help but i talked to RJTech and by bending the case it voids the warranty, not sure if the same applies to other resellers

 

Yea same problem here. They use these thick pads to connect the GPU core and the heatsink. This means if you remove the pads there will be too much distance between the GPU heatsink and GPU core, which can't be closed by just using AS5.

 

This is exactly why I am back to using the GTX 285M. I got sick and tired of the poor contact between the 5870 and its own heatsink. Even after filling the cage down, shining a torch through after fixing the GPU to the heatsink before putting it back in, you could clearly see a small gap between the DIE and the sink.

 

I'm going to swap out the pads with 1mm and .5mm ones, that's the culprit, I'm certain. I have the cage bent right out of the way, and it's still not making contact 100% on the side closest to the pads.

It will take a couple weeks for my order to get to me, I'll update once it's done.

 

You could use a copper shim 2cmX2cmX.75mm, i just installed it an my idle temps are 50C, i ran a 5min furmark and my temp never went to 82C after 5 minutes

 

Where did you get the copper shim?

How did you determine the gap dimesions?
It seems like since thermal pads are designed to flatten, going -0.25mm on the shim is a good idea.

But what if thermal pads were 1.5 - 2.0mm? You still may have a gap that can be filled with a thicker (or stacked) shim.

 

I didn't measure it myself someone else did and used the same .75mm copper shim, someone else used a .44shim and had good results, maybe his thermal pads were thinner.

http://forum.notebookreview.com/msi/482836-thermal-past-upgrade-worth-12.html#post6324118

These are my temps after running Furmark for 5 minutes

http://img294.imageshack.us/f/74741515.png/

 

Sorry for sort of hijacking the thread, but all this is applicable, right?

Thanks for the link Huuy. I'm gonna go for the shim method soon.

I have some calipers or even a gap gauge I will use to try to determine the thickness of the stock thermal pad or the actual gap itself.

I'm thinking that even if the gap is 0.9mm and you use a 1mm shim, it will still ensure contact, as long as it doesn't create other clearance problems like reassembiling the cover.

btw - here is a current and similar thread I have posted in with questions on shims, etc. http://forum.notebookreview.com/sager-clevo/512683-good-place-buy-thermal-pads-uk.html

 

Just be careful not to get a shim too thick it might crack the die or the memory will lose contact of the pads, some other people did the method of bending the case then using paperclips to add pressure on the screws which resulted in a dead GPU.

My 5870m died once, it was either from bending the case or some AS5 got on the chip, I have used IC Diamond since then lol. Good thing my warranty didn't expire.

 

I just built up a layer of ic diamond paste about a 1mm thick, with a small flat head screwdriver. I used the screwdriver to press on small amounts at a time, smoothed it out a little bit then let gravity smooth the rest for a about a day.
It worked out vary well for me, after trying all above methods without success.
it worked so well i did to the cpu also. My temps idle at 50c and very rarely go above 80c for both cpu an gpu.

 

Anyone know of a good place to get thermal pads in the US?

I need to get some new thermal pads for my GPU heatsink as it currently only has 4 pads on each side, which was fine for the stock GPU, but the replacement GPU has 8 memory chips on each side and the 4 pads only cover about 1/2 of each memory chip.

Any info is appreciated.

 

FrozenCPU. The Fujipoly brand is the best they carry.

 

Which type would I need, the MOSFET type? How do I figure out what thickness I need?

 

No, just get the standard 1/4 sheets. Different parts need different thicknesses, so I ordered one each of the 0.5mm, 1mm and 1.5mm pads.

 

I'm just going to be using it for the memory on my graphics card. Do you have any idea what height one would need for that?

 

Depends on how high the pads on your VRMs are. Those are the problem pads, not so much the ones on the memory.

 

Thanks for the info on FrozenCPU & the Fujipoly thermal pads. Frozen got the stuff to me with the cheapest shipping, which was very reasonable, in just 3 days, including a weekend. I replaced the thermal pads on my GPU memory with FP and the temps have dropped 10°C across the board.

 

Paralel, I'm impressed with your progress in building and optimizing your M570RU. 3DM06 over 12k is awesome!

The -10°C on the GPU with the thermal pads is great too. I realize you updated your GPU and we don't have the same, but what thickness(es) did you end up using for your GPU thermal pad?

Did you replace the chipset (NB) pad too?

I've been busy building a desktop for my dad, but still trying to optimize my new M57 too. Thanks.

 

Thanks, I'm not quite done with it yet though I should have final benchmarks done by early next week. I'm really hoping to get it close to 13K.

I used 1mm pads, which, unbeknownst to me at the time, were actually quite a bit thinner than the stock pads. In comparison the stock pads were most 1.5mm. Luckily the 1mm FP still worked with no gap between the heatsink and the RAM chips.

I replaced the pad on the NB with AS5, not realizing that there was now a gap between the heatsink and the NB. After realizing that I bent each of the arms where the retaining screws are anchored up slightly so the heatsink once again made contact with the NB using the AS5.

I just set my dad up with a dual processor Apple. I've re-installed his XP system at least 10 times. I figured the Apple should be a little more impervious to malware. He just can't seem to resist those "Click to install this program and you will win the lottery" pop-ups

 

So I ordered a 5870 and heatsink from babyhemi for my w870cu and am just wondering what I'm in for. I've read this thread and I'm still not 100% what I should do. lol

I really don't want to mess with a shim - sounds a little too complex for me! I have some Diamond 7, which one guy mentioned. I hate working with that stuff though. I'll probably order a thermal pad. Should I go with a 1.5mm one? And this is probably the dumbest question I've asked all day, but do you still need to use thermal paste when using a thermal pad? I probably could've figured this out if it was already installed in my laptop, but since I'm ordering from a 3rd party I won't get to see what the factory does!

 

If you think you might have a gap then go for the 1.5mm, they can compress up to 50%+ if need be. No, you use thermal paste or a thermal pad, but not both.

 

Using a copper shim is the easiest, I bought one on Ebay applied IC Diamond on the heatsink then applied the copper shim, then i put the IC diamond on the GPU Die. Although buying pads are nice to keep the memory cooler since the stock thermal pads are probably garbage just like the stock paste.

 

What pad goes on the memory?!?

 

Not sure about the 8800M GTX, i was referring to the 5870M which has thermal pads on the heatsink and lay on top on the memory.

 

Paralel, if you're going to use 3DMark06, please hook your laptop up to an external monitor and run it at 1280x1024 so you get a score that is comparable to other peoples

 

Why would I need to use an external monitor? My 1920x1200 display can handle that resolution.

Here they are, done @ 1280x1024:



I don't really see the point of using the benchmark at a 4:3 resolution on a 16:10 system.

 

I see where you're coming from, but with 06, 1280x1024 is THE resolution for comparison.

You can do a full HD run to show the non cpu bottlenecked potential, but for comparison everyone uses 1280x1024 as it is the default res (and only res available on the free version)

I had assumesd that you only had a 1280x800 display and that was your reason for running at that res - apparently I was wrong...

Nice score tho, I'll have to up my game now...