P650RS-G REPASTE WITH LIQUID METAL JOB

Hi everyone just posting about the repaste of my p650rs-g(specs in my sig). I will post pictures along the way.

Any help or suggestions will be welcomed.

The process/recommendations can also be discussed in the thread.

I am trying tí ve so careful with this as don't want any spillage of the LM on my components(especially CPU AND GPU) as that could short circuit and not ready to just throw away or RMA because of any mistake.

I am also using electrical tape to cover the cpu and gpu just in case of any spillages.

Wish me luck and hopefully this can serve as a guide to others trying to under this surgery with their notebooks.

I have also looked at previous applications of LM both in desktops and notebooks to get a better understanding of the process. I am going to use the tiniest amount and use the supplied cotton swabs to spread it out. Here goes

Both CPU and GPU wiped clean with arcticlean.

GPU covered in electric tape, going to do CPU next

CPU and GPU covered in electric tape.

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@Prema @Meaker@Sager @anyonewhocanhelp is LM meant to be applied to the copper base of the heatsink as well?

 

Yes you can apply a coat to the copper base, but it has to be a very thin coat. Just enough to 'tin' it over. You want far less than you would on the CPU or GPU. I believe this is done to make the copper more resistant to absorbing any LM on the silicon, since it will instead absorb what you coated on. So you want as thin a layer as possible there.

I also recommend a highly compressible foam barrier 'dam' surrounding the silicon, to ensure that absolutely no LM winds up somehow escaping the silicon if the laptop is kept vertically in a backpack or jostled around roughly somehow, if you travel around with it. Free insurance is good.

 

Right well I don't have the a foam for now so that's out of the question but I will try as much as possible to do the thin layer on the copper base. The thing is my heat sink has no guidelines as to wear it meets the die so I will have to do a rough estimate which I don't like

As you can see there are no guidelines on the copper base

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Right just done my first application on the dies but still not sure if I should apply it to the copper base



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Liquid metal applied to the copper base. I just used my discretion to guess where it sits on the die. Hope am right .

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You know the easiest thing to do is often the smartest thing.

If you had applied BASIC thermal compound to the silicon first (like old cheap paste, even crappy stuff like Ceramique or MX-4), attached the heatsink and then removed it (after doing the normal proper application to attach it and have it spread), you would have seen the pattern on the heatsink surface so you would know exactly where to apply it.

And highly compressible foam is just packing foam. It's available anywhere. You should have it at your local hardware store or crafts / hobby shop.

 

You should only be applying a thin layer on both sides.

 

I mean on the heatsink you want it to 'barely' be there.
Like, a type of coat that would be 'too thin' on the CPU (meaning: it's barely even there). Best example I can think of is using remnants from the Q-tip to put on the heatsink.
Having it 'barely' there on the CPU is too little.

 

If having it barely there on the CPU is not working then the contact is not quite right.

 

The contact is never quite right on most laptops anyway due to much lower static pressure. Mr Fox and I both applied the correct amount to our CPU's and have excellent results. Using too little is as bad as using too much.

 

Your first application will need a little more than that. Some of the galium in the LM is consumed in alloying with the copper. If you find temps start to rise you'll need to add a bit more (which is no problem. You don't have to clean off the LM each time like you do with paste)

It's all about fit. Bad fit means gaps and the choice between uncooled hotspots on the die, or liquid pools that you'll always be worrying about. That said I put LM on my older P170EM over a year ago, and that has a concave heat plate (gap above centre of die) and it's been in backpacks and on planes and the like, and not a drop escaped. I even had yuge pools of the stuff under my 980Ms when the fit was bad and never had any escape.

I did once drop a heatsink from a height of a few mm flicking miniscule flecks of conductonaut under a nearby memory chip... lucky all it did was code 43 in device manager and I was able to find the problem and blow it out with copious amounts of compressed air and isopropyl

 

Liquid metal is the heroin of enthusiast builds. And in some dosages, can be quite heart-stopping.

 

In terms of thermals too much makes little difference. Too little can of course have a huge impact.

 

Well, I just finished repasting the Eurocom Q6 with LM.

For the CPU, I'm seeing temp drops of up to ~20-25 degrees Celsius, and on the GPU, almost none compared to the stock paste.
I'll definitely be re-running the benchmarks and what not to see if there's any tangible performance improvement.

 

I might want to issue a warning concerning LM on the P955ER: It may not be enough to keep the system running cool under load.

 

What do you mean by that?

 

For gaming, you'll get away with the better cooling that LM provides. The 20 degree drop is appreciable.
Combined stress tests (especially on the CPU) are another story: You will still thermal throttle, with the core hitting ~97 degrees Celsius with Prime95 and AIDA64's combined FPU+CPU stress tests.