Repasting my 8652 and found this :(

My temps haven't been great on the laptop. Nothing way out of line, but I'd like to get them into the 80s while gaming.

I cleaned the fans of dust, no change. So I decided to repaste, and I'm a bit troubled about the state of my CPU die and heatsink.

They both seem to have some sort of scorch Mark or smudging on them.

Am I screwed?

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I think it will work fine, have seen something like that before, but its not looking good or as good as new. Repaste it and is the temp better or?

 

You haven't used IC Diamond on them by chance? Because that looks like abrasions to me, not burns.

 

You shouldn't worry about that. Scratches and abrasion is not a real threat for CPU/GPU dies, the real challenge is to keep the CPU/GPU die as polished and clean as possible to avoid surface irregularities and contamination (=> elements that don't have good thermal conductivity).

I do use IC7 and yes it can leave this kind of mark on the copper particularly.

 

I repasted with mx4, and initially temps were a bit better, but during stress test they still climbed too high. I'll let it cure for a few days and see how it performs.

Thanks

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Use something better like Gelid GC Extreme. In my case mx4 (it was very old) lasted about 3 months and then temps went really high. GC Extreme lasts longer and performs better. I recently did a repaste to my 6 months old paste job (GC Extreme), old paste looked good and basicly no gains temp wise.

 

My thoughts exactly, in which case they don't impose any major offset in temperature once compound has been reapplied. Good eye.

I don't think MX-4 requires any curing time.

 

Could you please tell us the method used to apply thermal paste ?
the 'pea' method, the credit card method where you spread the paste with a card...

I recommend the pea method with Gelid or IC7, (put a 0.5cm-1.cm diameter dot in the middle of the die) then let your computer run between 40-60°C for 2 hours, and you're good to go. This way I've had really good Thermal performance .

And meticulously apply alcohol and scrub with a soft tissue in order to de-contaminate the die.

 

Generally the pea method works well. Most of the methods, whether you make a line or an X with the thermal compound, all result in about the same temps (within 1 or 2 degrees C) of each other. But the pea is easy, and it works. When you are applying the heatsink back on it automatically spreads the paste out.

 

Pea method works well for square IHSes. The line is a little more appropriate for the small, rectangular ones.

Sometimes I think all this talk about whether to put a pea-sized dot, a line, multiple lines, an X, or invoke mad calligraphy skills when applying a TIM is little more than personal preference (if not paranoia).

 

I just use my particular method for consistency to be honest. Though I have given thought to calligraphy, I'm sure it would look great on my CPU right before I flatten it out with a heatsink.

 

I ran a line and it seems to have worked pretty good. No more thermal throttling while playing SWBF.

I did order some more premium paste, just in case.

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You will usually find the copper discolouring way more if it has had a reaction due to temperatures. You get a lot of hues like purple in there. Even then there is not much of an impact if any.