NP9150 from XoticPC with AMD 7970M and 2610QM:
Okay, so I just did some tests with the stock "paste", then repasted with IC diamond and here are my results. Note that I repasted, then immediately ran the benchmarks without allowing for cure time. I'll rerun later tonight and tomorrow to see if that changes things. These were taken on a Targus Lap Chill Mat.
Ambient temp: 25C constant
Furmark (10 min) :
stock paste : 88C
IC diamond : 83-84C*
3Dmark 2011 - Performance benchmark only:
stock paste : 75C
IC diamond : 73C
*The IC diamond went up to 84C, then back down to 83C for the last 2 minutes. Also, the fan was a full step lower than with the stock paste.
I say "paste" because the stock was a large square of what felt like clay. Also, my heatsink had lots of little scratches on it. Wish I had gotten a pic.
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So the IC diamond isnt much of an improvement?
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give it some run in time and repost all the temps. there does seem to be some overpasting going on which may explain some of the high temps.
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Last I checked all thermal pastes are worse heat conductors than metal. You only want enough paste to fill in the micro air pockets where the metal is not smooth enough for the heat sink and chip to make contact. On a similar note some people use to polish their chips and heat sinks to a mirror shine to get greater metal on metal contact.
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Scott-PWNPC Company Representative
As far as pasting goes I think constant and air free is more important than less paste. If it's not even it will be a lot worse than having to much paste as there is a chance that there could be gaps. You need to have a really thin nozzle and only do one line, never lap the paste back over itself or let it get thicker in one place than another. -
Maybe this helps. I repasted GPU with IC7 two times and one time I repasted CPU.
Lets talk GPU as the CPU never exceeds 62c anyways.
After dissasembly I scraped off the stock paste which was sticking on the heatsink. There was NONE on the GPU itself after taking the heat-sink off = no residue. The stock paste was 0.5 mm thick = thickness between 'contact surfaces' of heatsink and the GPU core. SAGER WAT!!!
During my first repaste I used pea-sized IC7 ball in the middle of the GPU. During my second repaste I looked how the first GPU repaste settled in. There was almost no IC7 on/between the heatsink and GPU, only VERY thin layer which broke between the GPU core and the heatsing in a form of a mosaique when pulled apart = good contact. The rest of IC7 created 1 mm thick 'thin snake' around the GPU core.
Tightened the 4 screws to the max and ran MSI Combustor Burn-in for a few minutes a few times meaning to make the paste warm ASAP so the heatsink flexible screw-in part does not lose its pressuring ablityand of course that my 92% carats are free of the bonding compound.
Temps are 82c after Crysis 2 all maxed (11+hi rez) for an hour. I have my laptop on 2 thick marker pens 2 cm from table (which lowered my temps by exactly 11 c on GPU.
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My first advice would be try to spread the paste out quickly in a very thin layer on the chip before putting on the heat sink. If you use a glob it may not spread evenly when you apply the heatsink. Do NOT use your bare finger. Your body oil will ruin the paste job. I used to use a little sandwich bag over my finger. I expect latex gloves would work if you have one.
If you put the heatsink on and you get much paste at all squeezing out the sides then you probably used too much. -
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yep, i used to spread it thinly myself before, then tried the ball or line method and had much better results with it. One thing to keep in mind is that heatsink screws are numbered on Clevo laptops and it helps to spread the compound evenly if you screw them back in the numbered order.
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DO NOT SPREAD ANY TIM! Doesn't matter if it's ICD7 or ProLimaTech, as I think those are the only two to be considered...
Spreading creates air bubbles, which is what causes the high temperatures. Pea size bead or a cross method is the best method. Heat and twisting will not get rid of the air bubbles, may actually make it worse.
This video shows even with hard to spread like ICD7 is best with pea dot method. Though it won't spread that well, but with heat and pressure of a heatsink, SUPERIOR to spreading method.
<param name="movie" value="http://www.youtube.com/v/EyXLu1Ms-q4?version=3&hl=en_US"></param><param name="allowFullScreen" value="true"></param><param name="allowscriptaccess" value="always"></param><embed src="http://www.youtube.com/v/EyXLu1Ms-q4?version=3&hl=en_US" type="application/x-shockwave-flash" width='420' height="315" allowscriptaccess="always" allowfullscreen="true"></embed></object>Last edited by a moderator: May 6, 2015 -
Artic Silver and Tuniq have been 2 of the better Thermal compounds. Arctic Silver recommends spreading or a line depending on what you are putting it on. Tuniq recommends spreading and provides a spreader with the kit. I think all you can really say is follow the manufacturer's instructions.
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Is there any other ways to cool down the GPU, CPU, and hard drive?
Preferably mobile/cheap means of cooling. -
Raising the back of the laptop or laptop cooler. Both work.
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I imagine looking at the temps, they belong to the GPU, the processor operates under 65C typically.
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I read somewhere that You may warm up a bit IC Diamond before aplaying (tube in warm wather)
don't know if this help
Stock paste versus IC diamond: With data
Discussion in 'Sager and Clevo' started by TokamakH3, Jun 21, 2012.