They are in a place that wont impact anything too![]()
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Meaker@Sager Company Representative
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See lapping of my Bitspower IHS Maybe yoo have the Kaby version.Donald@Paladin44 likes this.
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Hmmm I'm rather new to all this, I need to read up on how to properly do lapping
Sent from my XT1585 using TapatalkPapusan likes this. -
Did you also lap the bottom of the IHS, to get a better/flatter surface for the CPU? By better I mean removing the silver coating. If so how did you do that?
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I have both a Skylake and Kabylake IHS and neither one had those holes. I think @Meaker@Sager is right. It's probably easier to manufacture or something like that. Everything else looks right.
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Meaker@Sager Company Representative
Plus you could hurt the contact/crush the core by changing the levels on the CPU contact side.
Papusan and Donald@Paladin44 like this. -
Is already thight enough against cpu die, if you skip the glue.Stress Tech and Donald@Paladin44 like this.
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What would you recommend, glue or no glue?
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I don't use glue. I like it best this way. But it's up to yoo.Donald@Paladin44 likes this.
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So you haven't had any issues not using glue? I would assume with this IHS it's probably a snug fit since it's thicker then the stock IHS
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Meaker@Sager Company Representative
If you can get away with no glue then it's fine but it does make installation tricky.
Papusan likes this. -
Yeah I could see that lol
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Bitspower or the orginal lid, doesn't matter. I don't use glue. Just be careful when you fastening the clamp.
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So I'm currently lapping the bitspower IHS, how can you tell if it's flat and even though? I taped the sand paper to the glass and i applied little to no pressure to the IHS, just moving it back and forth 10 time then rotating it and so on. I've done 200 grit and started on 400, then I'll do 800, and lastly 1200. But I want to ensure that it is even before moving on
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No point in abuse your IHS with 200, 400 or 1000 grit sand paper. You only eat off the copper. And the IHS flatness can be uneven. 1500, then 2000 grits is enough. And not moving it back and forth. See my post regarding lapping. There you can see the flatness progress!!hmscott and Donald@Paladin44 like this.
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So I saw your post and it was exactly what mine looked like while I was sanding. What motion would you recommend then everything I read was back and forth motion.
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Circles and or figure eights from left to right and opposite... For each 8 round, turn the lid 1/4 and continue. You can use waterproof pen on the lid. So that yoo can see that yo hone correct for flatness. Flat is not the same as lopsided. Once you've made a mistake, everything will be wrong. Especially if yoo use very coarse sandpaper (200 grit) in the beginning.hmscott, Donald@Paladin44 and TBoneSan like this.
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Ah ok. Thanks for the info. I did with the pen, everything was coming off evenly with the exception of the very corners. The center, sides everything was coming off evenly but the corners. I can see how that could make it lopsided
Sent from my XT1585 using Tapatalkhmscott, Donald@Paladin44 and Papusan like this. -
Anyone recommend a good roller bag to fit this beast? Gonna travel this august for around a month and need something to keep this bad boy safe during the trip.
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So lapping and installation of the IHS complete with no issues. But I do have a question, since I have owned this laptop I have not successfully completed a single stress test on 3dmark. I always end up getting 95-96% instead of the required 97% required to "pass". I am not hitting thermal throttling or anything like that max temps in the CPU is roughly 70 with the GPUs hitting a Max of 80 degrees. I have done everything from stock clocks to adjust the clocks volts etc up and down with no luck.
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Stress Tech Notebook Evangelist
I don't know about a roller bags just yet. But I have been looking at backpacks, and I think the Everki EKP120 Titan Checkpoint Notebook backpack is definitely on my buy listDonald@Paladin44 likes this. -
I usually go with backpacks but I'm carrying my camera gear on this trip with me and I have a backpack for that. I'll search around if I find anything good I'll let you guys know.dm477, Donald@Paladin44 and Stress Tech like this.
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I have got t his bag from Samsonite, and it accommodates a Billingham insert (w/ D810, 24mm 1.8g, 58mm 1.4g, and 85mm 1.8g) in the rear pocket, KM1 and its two (240W) power bricks, an iPad Air 2, Kindle, and a mouse and pad. My wallet, passport, and other bits and bobs go in the front zipper.
The other configuration that I have found to be quite useful involves carrying few days' worth of clothing in the rear pocket if I carry my camera gear in the Hadley Pro. I just attach Hadley Pro to the telescopic arm of the Samsonite. It makes for a nice compact kit and stays in place and you never have to check in anything as everything is well within's airlines' cabin baggage policy (at least for European variety anyway)Stress Tech likes this. -
That bag looks perfect and the local Samsonite store has it in Stock. Thanks for the recommendation!dm477 likes this.
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Try FN F1 to hit max speed on the fans.
You should also attempt to lock the GPU down to 0.95v or lower.
Maybe even take a second look at the paste / lapping job on the GPU side.Georgel likes this. -
I do run the tests with the fans maxed, I will see about lowering the voltage. As far as the paste and lapping, the paste looked good, nice and even and not too thick, but the temps are not the issue I don't believe, they are not getting hot enough to throttle at all. I will recheck the paste and then see how low I can get the voltage. Thanks
Sent from my XT1585 using Tapatalkhmscott likes this. -
Did you check the thermal pads too? -
Yeah I checked them to a picture on here of the recommended size and location. I'm missing one or two but the rest look good. I ordered more pads too
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Meaker@Sager Company Representative
Where are the pads missing?
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Missing pad is not good, the component could have a much shorter lifespan if you don't cover them.
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Meaker@Sager Company Representative
If it's over the VRM then that could cause shutdowns at low core temps as the VRMs over heat.
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The blue color I have added, green is there just on the card, and red was missing. I have ordered new pads. In the stress test for 3dmark it doesn't shut down, no blue screens or errors. My frame rate just doesn't stay with in the 3dmarks required area, my fps fluctuate too much
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Meaker@Sager Company Representative
Were any left on the card in your pic?
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Yeah the ones I colored green were on the card
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Meaker@Sager Company Representative
Have you tried running with each card in the primary slot without the other and run the same stress test?
Donald@Paladin44 likes this. -
Do you mean remove one at a time and run the test? No I didn't even think about that, that would give me an idea if one card is performing better or worse... I'll give that a shot
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Your heatsink paste spread looks like it has bad contact with the die(s).
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This was old, this was first time I opened her, unfortunately I didn't take any new pictures after I lapped the IHS besides the IHS
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When I opened her to replace the pads, I'll check how the new thermal paste looks, if it's still bad what would you recommend? I have some copper shims of various thickness but I do not know what else could be done on that part
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Try mount with no thermal pads and see what happen? -
Are you thinking the pads are too high, making a bad connection between the die and the heatsink? I mean I can look at it but I'm not sure what I can actually figure out from that test.
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Ok so I ran the test again, 3d mark fire strike ultra 4k stress test. 95.8% (need 97% to be considered a pass) I was at stock clocks for CPU and GPUs and at the end of the test I was at CPU 63C GPUs 83C and 82C. I turned off SLI and passed first try all stock clocks CPU 62C GPUs 65C and 59C. So with SLI on I can not pass but off I pass fine, I guess it is the heat even though my GPUs are not thermal throttling?
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What I think might be happening that you continually fail the stress test, is because of pascal's temperature scaling. So the card might work fine but in the long run 3dmark considers the drop in performance to be too much.
Have you removed the plastic baffle blocking airflow to the middle fan from the bottom cover? Use a cooling pad and/or elevate the back of your laptop? What is your ambient temperature? -
Yeah I am thinking the same thing, I have not removed the bottom plastic piece yet (does that make a big difference, I know more air more cooling but is it a decent improvement?), I have the back elevated and I always use a cooling pad. The ambient is 72F I think that's around 22C.
One more thing, are those temperatures pretty normal. Single GPU low 60's C under load and in SLI GPUs low 80's C under load?
Sent from my XT1585 using Tapatalk -
Single GPU 60c is fine, with two cards the heat output is almost 2x (480w limit total system power consumption).
You should definitely open up the bottom plastic piece. Also consider putting tape between the fan and the fins, so you create a seal. Just a small strip of tape on top is enough to test.
Credit to @Ted@HIDevolution and @Phoenix
Skip to 5:00, you don't necessarily have to remove that much material, but just enough so that the middle fan is unobstructed.
Papusan and Spartan@HIDevolution like this. -
Oh wow that was extremely easy and there is a ton of hidden vents, that will definitely help. As far as the fans go, I'm not sure where the tape should go for sure though? I really appreciate all the help !
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Tape should cover the gap between fan and fins.
fan -> gap -> finsStress Tech likes this. -
So where the red lines are?
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Meaker@Sager Company Representative
Note it does have small rubber bumpers to do that job.
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Discussion in 'Sager/Clevo Reviews & Owners' Lounges' started by Spartan@HIDevolution, Jan 5, 2017.