Hy all,
I have the above model, and I can't stand it anymore(when I play games, and using a cooling pad).
1) I've tried to change the stock thermal compound with Arctic MX-4..and cpu hits 90°C.
2) I did a repaste again, yesterday,same results. I belive now the problem is that the die doesn't make a very good contact with the heatsink.
My ideea is to use a new thermal compound Arctic Silver S5 and maybe copper thermal pads or normal thermal pads (for die and mobo)..don't know what thinckness to choose.
If anyone has any idea please say.I'm waiting suggestions....
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John Ratsey Moderately inquisitive Super Moderator
I believe the construction is the same as the Z5A illustrated here in which case the heat sink covers both the CPU and GPU so there's the risk that it doesn't make good contact with one of them.
You can check this by carefully cleaning everything then putting a very thin layer of paste on both the CPU and GPU then temporarily fixing the heat sink in place before lifting it off again and checking the amount of paste that has transferred onto the heat sink. If this isn't equal then you may be able to improve it by some careful bending. Alternatively, copper shims are an alternative to a thermal pad to improve contact. Thermal paste is most efficient when it is a very thin layer.
John
NP700Z5C S02-UB temps issue and throttling
Discussion in 'Samsung' started by danimischiu, Aug 7, 2014.