P30 is there a TIM between the CPU and the HEATSINK

Hi.

I need the clean the fans and heatsink on my P30 and i want to do a good job and re-apply some better AS5 paste.

But i have heard that some cpu`s have a TIM pad and if you remove it there might be a gap between the CPU and heatsink.

If it`s copper to copper it will be great, but it`s a waste of time using AS5 if it has a TIM!!

So does anybody know if the P30 uses one!!!!!!

Thanks

John.

 

Well, I stripped my P30 down last night, motherboard out screen removed everything.

Silver looking pasted between the CPU and HEATSINK , So no TIM PAD!

I used ZALMAM ZM-STG1 themal compound.

Everything went together fine, It now works great!!

 

I thought TIM stood for Thermal Interface Material (not specifically a Thermal Pad).

I expect it will use thermal paste as it's more efficient at removing heat, which is especially required in notebooks (I heard the mobile P4s ran hot), but I'm only guessing.

Anyway, these links may help. This link is to a dissasembly guide for the P30, and there is a 33-way TIM comparison here.

Edit: took too long writing my answer (only original post when started reply). It's good to hear it went well, has it made much of a difference to temperatures?

 

Hi.

Year, I realized after i posted about the TIM error, I did used the guide that you linked below to dissemble my P30.

I had seen that TIM review before, But i will have another look now.

Thankyou.