help after Aspire 5310 Processor replacement

Hello Everyone,

I have been reading previous threads for some time now and thanks to the Fantastic people here i have successfully replaced the processor in my Acer Aspire 5310 with a T5600! what a difference!
So a big thank you first of all.

However, I think it is overheating. Heres what i have done:
1) cleaned out the CPU fan (now its very clean, almost new)
2) put in the new T5600 with a pea sized amount of Arctic Silver

When i switch the laptop on the CPU fan spins for a second or two then goes off and doesnt ever come back on.
my laptop will freeze at random whilst using it e.g just surfing the net or checking mail (no bluescreen, just a complete lockup, the mouse cursor does not even move)

I used Speedfan and that says the CPU cores are at around 50 c at which seems quite high, yet my CPU fan does not spin at all.

I looked for a BIOS update (as the Phoenix bios is very limited) but i have the latest 1.5 so no luck there.

The only thing i havent tried is a complete reinstall (Im running XP on it BTW)

Has anyone got any experience with this as i would love to keep this new processor

Thank you for your time

 

50 degree is not high. consider high wil be 80 to 90, than tat is high. at tat temp, the fan it wil run slow.

 

The OP is saying that at 50 degrees the fan is not turning on, not that 50ºC is too much.

Anyway something is not right. Try to reconnected the fan. How did you clean it? Maybe you've damaged it in the process, or some wire got cut when you've connected/disconnected the fan..

 

Hi thanks for the replies. i just cleaned it with a paint brush + Hoover. All wires are intact. I might have to try a reinstall and see if that stops the freezing.... Oh i just thought of something too, when i was installing the processor i got heatsink paste on the processor (not the die part) but i cleaned it off with surgical spirit, Could that have any effect?
Thank you

 

Nah, I don't think a little paste off the die could cause this. Maybe you've applied too much paste? Though..I don't see how that could prevent the fan from starting. I can't think of anything else right now than reconnecting the fan.

By the way, now that I think of it, these random freezes used to occur to me when I upgraded to T7500. I was afraid that I got faulty processor(got it from ebay) but it got fixed somehow the next day or a few days after the upgrade and I think I didn't do anything about it...can't remember though so I'm not 100% sure. Or maybe I opened it up and reconnected all...I really can't remember it was an year ago.

 

Hmmm, I also got mine from Ebay lol...I think a reinstall couldn't hurt anything at this point. I have nothing to loose
Thanks for the help, I appreciate it.

 

The fan on my 5310 doesn`t switch on untill the temp is about 54c and switches off at 45c, so you may not have got it warm enough for the fan to start. I have also upgraded to the t5600 and undervolted it runs at 47c most of the time.

 

Im thinking the motherboard and the BIOS ware design (regarding CPU fan behavior) for a certain CPU. Now you've changed the CPU but the fan acts with the same thermal profile as before the CPU upgrade.

 

Hope this will be a new thread...otherwise tell me how to...thanks.

Trying to upgrade a 5310 acer aspire with i943GML on MB.AH302.001 and found that T5500 up to T7600 would work fine. But I wonder what happens with the frequency if it does not match the original 133mhz multiplied to 1600 1733 or 1866 etc... Can anybody tell me if the board will automatically adjust, if there is waste, if it is better to to go with a T5200 for safety or what shoudl be done/thought about this? And what about heat with the higher frequency models? The original CeleronM520 has 31w/45w max, the T7600 has 34w/53w heat power emissions. Anybody got some experience?
Many thanks in advance.

 

I think if you are serious about a pea sized drop of thermal compound then that is likely your problem. It helps to understand that it is not glue, separator, insulator or whatever. It should ideally form an infinitely thin layer between the (on a microscale) rough tops of the processor metal and the rough tops of the heatsink metal. It should also fill the 2 sets of valleys whereby it provides a second but inferior heat transfer route out.

In reality a grain of rice is more like the right amount, many engineers will then spread that grain sided blob fully across both surfaces with a flat piece of plastic and light pressure leaving the appearance of a 2 slightly greasy surfaces - then install Heatspreader /sink taking care that it is totally flat on the processor surface.

Where too much is applied you get a phenomenen often reported by enthusiasts of higher processor temperatures until the heatsink 'beds-in'.
In reality the spring pressure on the sink is squeezing the compound partially out the sizes to close the gap and improve the transfer. It can make a mess and rarely gets a micro thin as it should have been initially.

It is a precise business and a fiddle to get right the first 100 times Which is why most production envionments go for thermal film,shims, pads and the like which perform several degrees worse even after partially 'melting into' the valleys - but can be got on 100% by unskilled (ok less artistic) operators. at the design stage you can allow for the extra couple of degrees but not varied application techniques.

HTH