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Actually it's about a year or longer. It's still a great maintenance time, it's just needing it that bothers me ) But you should be safe to keep it for a year if it can handle the temps. Of course, if your temps deteriorate, then... go heatspring )

 

It's not so much the temps as the fact that when the stuff dries, the only way to get it off is to sand/scrape it off. Desktop CPUs are ok because the IHS will absorb all the damage from the sanding, but sanding the bare die on a mobile CPU just seems like a terrible idea to me. Which is why I'll probably check it once a month just to see that it's still liquid.

 

If he cant get enough pressure on the CPU, there is no wonder it didnt fare well and it might not be good enough.
For me its better than a paste that is supposed to be better than the MX-4, so keeping the heatspring in is a no brainer.

BTW on the pluss side with the indium, it does get better over time, not worse like paste so if it is AS good right now, it will be better over time.

Add the fact that you dont have to open and close all the mobo connectors multiple times for the re-pasting, making a lot of wear on the connectors.
Add also the chance of forgetting something, like power, battery, wriststraps etc and then making a mess of it. Also that the metal paste could eat aluminum and spill will kill components.

 

Actually the issue is uneven pressure. When I checked the die contact with a pressure film, the top left and right corners barely registered above 30 PSI, but the entire bottom half of the die had well over 60 PSI.

So to be completely fair, if I look at the temps of individual cores with the indium foil, cores #3 and 4 (which I'm going to assume is in the bottom half) actually run about 10-15C cooler than cores #1 and 2. And for cores #3 and 4, the temps indeed show a 5C improvement over MX-4. However, because cores #1 and 2 still run hotter, the CPU as a whole runs hotter than with MX-4.

After debating lapping my heatsink or taking the risk with Liquid Ultra, I decided to go with Liquid Ultra. Thus far I'm quite happy, and let's hope it stays this way (knocks on wood furiously).

 

You can do it like me - level it using Kapton tape between the socket and the CPU Add couple of layers and screw the heat-sink than unscrew it and check the mark. Take in mind that once it burns-in it will make better contact, so don't put too much. Happy modding

 

By the way, if you guys are looking for this liquid metal stuff without wanting to buy it in large quantities you can get it off ebay in a syringe. It's the same stuff, just it comes not as a pad.

Coollaboratory Liquid Pro Thermal Compound Paste Grease Syringe Style New | eBay

 

Liquid Ultra comes in a syringe too. Can't remember the difference between Pro and Ultra at the moment, but Pro is supposed to give slightly better thermals, but dries up faster, and is much harder to clean off.

 

As for me, I can't wait to try HeatSpring on THIS Dell precision as well Current GPU top temp is at 72C during 3dmark (higher during furmark probably) and the CPU regularly touches 93-95C.

 

Fingers crossed Bro

BTW i can still pull 100W CPU power in the full 1024 test in T-stop.
This time i hit 88 degC on hottest core after test, taking 403 sec.
My guess is livingroom temp hitting apx 25 deg. But off course using my cooling tray.

 

Ok, so with heatspring applied to the CPU, the coldest core is now on average 65C-70C under non-prime95 workloads, and the hottest core is about 75C under the same scenario.
In prime, over time, the CPU will throttle down to about 2.9GHz and the temps will equalize across all cores at around 83C. The throttling is clearly not because of temps, it's because of the cpu 55W TDP limit. I can't wait to get this bios unlocked, I know it can be done, managed to get a dump, now all that needs to be done is find someone with the skills to edit it and repack it for flashing.

This is, of course ENORMOUSLY better than with the previous paste (MX-4), which maxed out 95C immediately and stayed there while the CPU throttled to all hell.
Unfortunately I don't think I can distribute the pressure better, this laptop only has 3 screws on the CPU heatsink, and they're not symmetrically distributed.

 

did any of you guys ever figure out where each core is located?

 

I think core 0 and core 2 is towards you away from the heatsink fins.
Core 0 beeing the left one 2 the right one.
Core 1 is then probably left top.
Core 3 is right top.

 

Depends on which CPU you're asking about.
Nehalem (thus i7-xxx?M) is this one:


If you have writing on the chip, use the orientation to figure which side is UP and use that as an indicator.

 

From my heatspring installation my description is where i got temperature response when pushing down on the 920XM.

 

Depends on MP initialization and how APIC ID's are allotted.

 

This is not that hard. There are core shots for pretty much every CPU in existence available on the net, like the one I posted for the nehalem core, which clearly show where the cores are positioned. Usually in a straight line, sometimes parallel in a rectangle. The most important parts to cool of a nehalem die are in the middle, not the extremities, although of course you should spend effort to cool all of it.

 

Oh sweet beautiful mary, look at these temps. By the end of the test one core had maxed 74C, the rest 71C.
The TIM is well bonded to the heatsink now, doesn't fall even if shaken.

I want another group buy

 

Fantastic, congrats Sangemaru.
I havent opened mine since mounting it first time. Still running fantastic cooling.

Also for my GPU it works great. The temp difference is as much as 5-6 deg between primary and secondary card when gaming hard. (i only have the secondary card with heatspring)

 

Doesnt this still mean that if our is parallel in a rectangle that it would be two up and two down since parallel with 4 cores in fact would be two and two? That would explain what i found.

 

I'm up for the group buy if another one ever gets organized. In the interim, Liquid Ultra fills in very very nicely