I've cleaned the exhaust and cooler. Put fresh AS5 to CPU and Video chip. Left rubbery thermal pads for the other chips unchanged.
I've monitored the temperatures of components by using CPUID HWMonitor (see attachement)
Temperatures of CPU and GPU are okay.
However, I'm worried about the extreme temperatures of TZ1_ (under load 65˚ C) and TZ5_(under load 75˚ C)
First of all, I've no idea which components are represented by TZ1_ and TZ5_. Anyone?
I'm intending to replace the rubbery thermal pads on some chips by high-end Fujipoly Ultra Extreme Thermal Pad.
Does anyone know the required thickness of the pads? Are 1 mm and 1.5 mm adequate?
Is it realistic to expect that the replacement of thermal pads help reduce the temperatures of TZ1_ and TZ5_?
Looking forward to your expert answers!
Thanks Judith
It seems that HWMonitor is unreliable for monitoring temperatures of components of the HP Compaq 8510P. Is HWMonitor faulty or is it due to faulty sensors of Compaq 8510P?
F.i. TZ5_ represents the percentage of max. FANspeed. It has nothing to do with a temperature measurement.
This information has been revealed in a posting by Destiny:
http://forum.notebookreview.com/hp-...de-hd2600-firegl-v-5600-a-50.html#post6012265
Could someone recommend me a utility which enables accurate temperature measurements for the Compaq 8510P?
In the meantime I've noticed some very informative threads regarding Fujipoly Thermal Pads:
http://forum.notebookreview.com/alienware-17-m17x/716702-fujipoly-extreme-thermal-pads.html
Fujipoly Extreme Thermal Pads anyone got an opinion? - [H]ard|Forum
Compaq 8510P - Temperatures TZ1_, TZ5_ much too high under load
Discussion in 'HP Business Class Notebooks' started by Judith1979, Mar 15, 2014.