*** Official Clevo X170SM-G/Sager NP9670M Owner's Lounge ***

Clevo 2080@150w. Rehashed Super@200w.

 

One step forward, and two steps back.

 

Core i9-10900F@65w chips running 224W. Clevo left 140w from that unified heatsink for the Cpu. Saved by Nvidia’s new Dynamic Boost.

https://hothardware.com/news/intel-comet-lake-s-processors-heavy-duty-cooling-5ghz

 

Now that a spicy piece of silicon. Btw, doing any mods to the IHS will suck, since it will affect GPU contact and vice versa.

 

GN talked about the ES 10990K doing about 5.2Ghz -ish, pretty sure they mentioned that the die has been brought closer to the carrier pcb. So Intel effectively pre-lapped the next lineup.

 

The IHS is a bit thinner too by the sounds of things.

 

Anything to get that hot boy under control.

 

Thermal pad manipulation can help with this.

 

You'll need to shim the GPU as well then.

 

When you are playing with 0.5mm each side some gentle persuasion can be on the cards too

 

The fewer thermal interfaces, the better. And this will be even more crucial with 10th gen.

 

I'm talking a gentle bend to get the contact back.

 

Emphasis on gentle, since it a unified heatsink. We'll just have to wait and see how the heatsink/ilm lottery is this time around.

 

Where this a will there is a way usually, it would only be for very minor adjustments.

 

I went back from Arctic 1mm pads on the gpu memory to GP-EX 0.5mm, since contact still wasn't great after 'persuading' them in. I initially mentioned that the 0.5mm pads had poor contact on the vram towards the power delivery.

So then I heated the VC up and gently massaged the new pads into place, going through all sides and components. I did this a couple times, so that the pads would heat up/cool down and settle.
I should mention, this was paired with removing old LM from both VC and GPU and applying a fresh coat. Afterwards I checked the contact with both flashlight and a piece of paper, to see whether any gaps were still present, it was immaculate.

Today I checked the contact again to see if anything changed after a good amount of thermal cycles, and it was still perfect. So I can recommend this method to fix the minor gap issues.

 

Intel’s 11th Gen Rocket Lake-S Desktop CPUs Will Be Compatible With Z490 LGA 1200 Socket Motherboards – Will Be Updated To PCIe Gen 4.0 This Year
The Intel 11th Generation Rocket Lake-S Desktop CPU lineup has been confirmed many times in various leaks but as the launch of the Z490 platform closes in, we are getting more info on what to expect from the upcoming family. First of all, the Z490 motherboards have been confirmed to get support for Intel's 10th Generation Desktop CPUs and future processors. We don't know what the future processors refer to but there's no doubt that our sources are talking about Rocket Lake-S over here.

All should expect Rocket chips will be compatible with the upcoming Z490 series of motherboards. The today question will be... Will Clevo make it PCIe Gen 4.0 ready? Or will they force the people over on a possible Z590 motherboard? Aka force them over on new laptop if they want PCIe Gen 4.0

 

Also where are those 4x PCI-E 4.0 lanes? If it's just the GPU no one really would care.

 

Intel is ready with PCIexpress 4.0 drives. Only AMD can use this tech.

 

Yeah but you have to wonder in a notebook is a 4x power hungry link and drive worth it over a PCI-E 3.0 one?

 

It will come before or later. A fast next-gen Optane SSD for OS is something @ole!!! have asked for a long time.

You mean they should skip add in support? This would of course lower MB costs.

 

I'm talking total system power budgets in mind, and optane is all about response speed, not raw bandwidth so 3.0 should still be fine for it.

 

Once Intel is out with PCIe Gen 4.0 support I think we will see speed up (more efficient drives) from all ssd manufacturers. None knows what they will offer middle next year. I prefer that new tech being added. And Intel have soon no choices not follow same paths... AMD's B550 motherboards will bring PCIe 4.0 to the masses, $99 Ryzen 3 CPU in tow

I'm sure a fast next gen Optane disk will deliver both raw bandwidth and snappiness. Not give the high end models PCIe Gen 4.0 support when this will be the next big is flawed thinking. Only to save on MB costs.

Of course, give the model redesign after a year is a nice way to try force you over on the next. New features sell as hot cakes, as we know.

 

Debating hard whether to continue with DTR or go with full desktop this year. AMD has made it seriously tempting now. If only Clevo can give us desktop Ryzen 3 or 4 in another model...

 

we will need next gen ssd controller to be more power efficient. 2nd gen optane is already pretty decent from what ive heard, along with QLC flash. a node shrink on new SSD controller is 100% required to fully take advantage of PCIE 4.0 x4

 

It'll be a lot cheaper building a powerful desktop and you won't have to worry about any cancerous firmware. You can always wait until Q2 when the X170 drops to make up your mind.

 

I guess you mean Q3 but I agree that it is best to wait for the X170, should be an interesting laptop as long as you do not expect desktop performance.

For those who still expect that by some miracle they will get high end desktop performance out of a DTR I'll say that denial is not a river in Egypt. It becomes more and more obvious that the days where you could come relatively close are over.

 

But just the bus itself has overhead never mind the chips. I'd be more interest in fast response than raw bandwidth too.

 

https://www.hardwaretimes.com/clevo...sktop-cpu-nvidia-rtx-2080-super-in-17-laptop/

 

"up to 64GB of DDR4 memory running at 3600MHz+ across dual-sockets."

Perhaps the 3800/4000 SODIMMS might finally get to stretch their legs in laptops.

 

Finally some news. Now to sell a kidney to get this beauty

Edit: still no material in clevo's e-channel for companies

 

2 ram slots? Better for fast ram but downgrade for maximum amount ram.

 

Perhaps they did not know about the dimms under the keyboard?

 

Several things that do not make much sense - I also found 2 x 2.5" and 2 x m2 form factor drives in one description and 3 x m2 in the other. Big difference in maximum possible drive capacity with only 3 x M2 SSD slots vs the option with 2 x 2.5" that will allow for 2 x 8TB SSD's.

I also saw that it will only have up to 64GB RAM and two dimms which for an X-chassis is highly unlikely. Better to wait for more info to come out.

 

Just waiting for some benchmarks and temps now.

 

And today still no manuals, photos or any other material in Clevo's e-channel for companies! Weird.

When they released the TM1 (the P870 and the P775 and P751), they released info first (service manuals, high definition photos and so on) in the e-channel. Its weird that there is nothing yet

 

There are 4 SODIMM sockets in this one...

 

And it’s not a mini-ITX motherboard. That author must’ve wrote the article on 4/20.

 

We have a pretty good idea of what to expect from the specs and the capacity of X170s heatsink.

 

Hope Clevo has had time to overhaul the 340W heat sink and gave it better thermal specifications. Or this will come in next models as usual.

 

I think we both know the answer to that question

 

HeHe

 

They can have my concept of dual interconnected vaporchambers for free, hehe.

 

Um...
You guys may want to look through the MSI Bios with AMIBCP 5.02.0031 ....

https://download.msi.com/bos_exe/nb/E17G3IMS.106.zip

I'm keeping my mouth shut.
Didn't that Intel leaked document say:
"New Overclocking Controls"...

Why did MSI release a BIOS for download with an embargo still in effect?
BGA is simply bad binned LGA....which means...someone's going to be in trouble...

 

Hmm, not sure what's going on here.

 

Did you look at the bios with amibcp?

 

Ok since someone posted screenshots on reddit and the cat's out of the bag, I'm not breaking NDA by posting this.

 

XTU access is locked off from the looks of it?

 

More mess from Intel. Yeat another reason people should skip/avoid Comet lake this spring.

Intel wants to push 2.5Gbe out on its own mainstream platform first while competitors rely on 3rd party solutions. While Intel's efforts to put 2.5Gbe standard across mainstream are great, their may be a major problem associated with the controller itself which would affect network workload performance.

Intel 400-Series Chipsets Including Z490 With I225 2.5Gbe Have A Networking Bug, Fix To Be Issued In 2H 2020 wccftech.com | Today

A list of mitigations with current silicon of the I225-V controller are mentioned which simply advise users/OEMs to set the Foxville Controller link to operate at 1 Gb/s however, a proper hardware-level fix needs to be issued through an updated HW stepping which is stated to arrive in 2H 2020, close to the launch time frame of Rocket Lake-S CPUs. While Rocket Lake-S CPUs will be compatible with the Z490 platform, it looks like proper functionality would require users to get the revised Z490 motherboards with the latest HW stepping for the I225-V controller that fixes the IPG Variance networking issue.

It's also interesting that this slide had to be leaked by someone to make the public aware of the issue. If not, users would've bought the upcoming Z490 motherboards and could've faced issues that cannot be resolved by software-level fixes.

 

How pathetic, not to mention that 10G has been in use for ages. If 10G was considered problematic due to heat/power requirements and/or a lack of overall system speed they could at least have gone for 5G as an intermediate solution. 2.5G is too little too late which may be why Intel is pushing their chipsets while they still can.

 

Intel messed up PCIe Gen 4.0 support, Now this new mess for same platform. Comet lake is Dead End, as I mentioned in a post long time ago. Nothing seems to go Intel's way for the moment. All they have left is new flawed design, security problems on top of the old 14++++ arch.


AMD Ryzen 3 3300X continues its benchmark rampage by fending off both the Intel Core i3-10300 and Core i7-7700K in Fire Strike


And AMD chips can't be paired with high performance graphics. This spring's release looks quite empty.