Thermal Grizzly Kryonaut

Good idea that I didn't splash on it.. The GC Extreme I had on my P771ZM has pumped out so will have to repaste.. Will use IC Diamond, it might mark my heatsink but seems to be more resistant..

Btw guys, if we use a 50-50 mix of IC Diamond and Gelid GC extreme what do you think will happen? Tempted to try this!!

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Its unlikely to even mix. I wouldn't recommend it.

Yeah I don't like IC Diamond because it marred the die on my 4940MX literally almost 3/4 of the chip has a line in the silicon... But it does work well and it lasts a lot longer than others in these low pressure mounts.

 

Just as I expected bro. Either Liquid metal or ICD. Anything other than these two are not something you should use if you want the very best.
See http://forum.notebookreview.com/threads/thermal-grizzly-kryonaut.790919/page-9#post-10256889

 

Really weird. The last repaste i did with Kryonaut was more than a moth back and the temps are still the same.

Just this did this one @ 4.5Ghz for @Phoenix : (Only thing different is that the Ambients are about 5C higher , SF vs LA, also no cooler under the system right now )



Not sure what going on with you guys, but Kryonaut has held great for me and for another friends P870DM-G. Way better than ICD. On my first 980, ICS instantly scratched the hell out of the core as well.
Not hating on ICD or anything, but i got a drop of 3-5C going to GCE.

Also these laptop heatsinks require way more quantity than normal. I mean i used to use 1/4th of pea on my desktop, which i felt was way too much. here i use like 3/4th to full pea size quantity.

btw. got the power readout back. HWInfo was derping around.

 

I think the reason is not that ICD is better, but the fact that it makes better contact with the heatsink due to how thick it is.

 

Doubt it. If the heatsink is thicker, (and by that i think you mean the heatpipes) the heat transfer will be faster. ICD is thicker for sure and i have a feeling that the heatsinks not being flat is the reason why it isnt working much better for you guys. But considering that, the original drop i had from ICD to GCE to Kryonaut was on my old heatsink which was warped to hell and back. I think you guys need to check if the heatsink is sitting flat across the IHS and not elevated on one end.





The bottom part is where the heat pipes go towards the left to wards the fins, there is this tiny ridge that sometimes prevents the heatsink from sitting flat and elevates it a bit. (also the pads might be too thick etc etc).
If the heatsink is sitting flat with the IHS the heat spread will be even and not concentrated over a certain section. I initially thought why is the fin side raised a bit and then bent it down, only to realize later that it is supposed to be like that so that the heat pipes dont come in contact with that ridge on the bottom left.

 

Clevo just needs to force Foxconn to have better QA.

 

It has been found that ICD work best when heatsink not lie perfectly flat on IHS. Thin/softer paste will struggle. Remember you also run same clock but with lower voltage than @Phoenix in the test. Package power is about 12w lower than what He use and this will also have an effect.

 

They for sure do. I have 2 CPU heat sinks and 2 GPU heat sinks , and mind you the GPU heat sinks are not cheap. Neither one of them is properly flat.
I had to do a good bit of lapping to get the IHS and CPU heat sink to sit flat.

Havent fiddled yet with the new GPU heat sink,but im going to add copper shims and use thermal paste instead of thermal pads for some of the components (Power phases/MOSFETS) to minimize the effective distance and increase the heat transfer. Will probably make a thread, if it all works out well.

 

Ah i didnt notice that. But i thought he was running a lower voltage than mine since his is a Silicon Lottery binned processor.

But yeah completely agree on the Thick/Thin paste thing, Clevo/Foxconn need to get their **** together and make better heat sinks or at least improve their QA.

 

Yeah. I mean @Phoenix is using his second Heatsink now, with about same result. It's not going better to buy even an extra. You need to use correct paste compared to what heatsink you have. A completely good contact between heatsink and IHS give you better room to select different paste.

Edit: Also put on a bit extra paste where the contact between heatsink vs IHS is bad is a good thing to do. Not put to much over the whole IHS.
BTW. Silicon lottery procesors is benched with relatively high voltage. And also tested on desktop.

 

Ah yeah i remember the desktop part, didn't think they were using super high voltages.

 

Fastest way to bin chips. High voltage, test the multis it can handle.

 

But to be honest, 1.424 V isn't all that bad for 4.8Ghz give or take 10-15mV, the requirement for lower frequencies cant be that bad.

 

Those chips who can manage 4.8 GHz use about this volttage. The benefits of Silicon chips is that you know what you get!! You don't NEED to have good luck in your own chips lottery

Edit: Last time Silicon lottery binned 4.8 GHz was the number 18% of tested chips. Now I see this number has go down to 17%

 

My 4790K does 4.8 @ 1.34v and its considered average. I'd never shove 1.4v to the chip, not to mention my H100i couldn't handle that kind of heat.

 

Most of the 6700k's can do 4.8Ghz easily.

Lol true, but these seem to run way cooler. @ 5.1Ghz under a H110i GTX my processor needed 1.475V and max temps after 30 mins of small fft Prime95 were 70-73C. Even if the average processor takes about 1.45V for 4.8-4.9ghz, the temps wont exceed 70C under a good AIO i think.
When i had my 3930k under the H100i few years back, i could only do 4.5 ghz tops before i crossed the high 70's. Under the custom water loop, i was running it @ 5Ghz 24/7. I hope one day we get effective water cooling solutions for laptops.
And before @Papusan post links about the Asus, i mean for system with a desktop processor in it. BGA's dont need water cooling for what they do IMO.

 

There shouldn't be a problem to design and create better heatsink and better fans than what's used today. You don't NEED to use water in laptops. Better QC and better products isn't a problem if they need to do that. BGA should use water dock. Next generation BGA machines will be thinner than APPLEBook's

 

But then they'll be more jumping! :-(

 

Last reminder that if you don't want ICD to scratch the die, simply soak it and gently wipe off with Q-tips or whatever you use. If you use an alcohol-soaked cloth and scrub it, the diamonds are GOING to scratch your dies. It does NOT have to scratch anything.

 

Did that, even soaked it in arctic silver cleaning solution first, and then gently used QTips, one lump left a nasty scratch. I guess its just bad luck on my part i guess. But id rather just use something that doesn't require so much effort to remove.

 

The marred die was not done by me.......

 

If not all comes off easy, then soak what's left being stuck again for a little. It does take a little bit of time, I agree, but it's easily possible to get it off and have a mirror polished die.

If you rather use something else that's cool, I just want people to know it can safely be removed.

 

Agreed! I never had Problems removing ICD in the past. Like @D2 Ultima mentioned, just let alcohol/Arctic Cleaner Remover soak/soften up the ICD and you're good to go. I used "Tempo" handkerchiefs for the extra softness!

 

1- Can I use this one on bare die like in the AW?
2- Can I use it on GPU as well as CPU?
3- How to know the right thickness?

 

1- But why not use liquid ultra instead if your heatsink is flat and fits nicely on the die? Liquid Ultra is still a better choice.
2- Yes.
3- There are pressure sensitive tape you can buy or you can use an ordinary paste and see how it covers the die.

 

Thanks for this thread, I was having crazy GPU temps after applying new paste to my CPU and GPU, now I know why. Crappy heatsink connection with thin paste.

Lapping is perhaps to much of a risk for me so I'm gonna try ICD since it's thicker for a better contact.

Given the paste is of different thickness to traditional stuff, how do I know how much extra to apply? I plan to use the X method for the CPU IHS and a thin line for the GPU as it's rectangle and no IHS.. Just not sure what amount will be correct.

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just a little bit thicker than the below image:

 

What mobile GPU exists with a rectangle die? I have seen squares for them all.

 

I own Dell Inspiron 17r 7720SE with a Geforce 650m. There's no IHS on it and it's rectangle. I can get a picture when I take it apart for a new paste!

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Really? This is the 650M.

https://www.techpowerup.com/gpudb/547/geforce-gt-650m

And what machine ships with an IHS on the CPU with that crappy of a graphics chip?

 

I was mistaken sorry, it's the CPU that's the rectangle. I wasn't aware that mobile CPUs sometimes didn't have a IHS. Crappy it may be but it's all I can afford!

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I wasn't meaning to say you have a crappy machine, I was just confused about what CPU would have an IHS and come with that GPU.

Anyway, best way to do the thermal paste on the GPU is the pea method in the center, the CPU do a line about 3/4 across the middle of the die. An X on the GPU would be way too much paste.

 

It's ot but just thought I'd update to say my liquid diamond paste arrived today and I applied it to my CPU and GPU. When removing my heatsink I could see the generic white paste i used made good contact on my CPU but not GPU. This corresponded with my results afterwards.

Peak CPU temps were more or less the same, with idle 2 or 3 degrees c less.

Peak GPU temps were a massive 27 degrees c lower topping out at 65c in heaven compared to 92c before. Clearly the old paste was making no contact at all.

I wouldn't be surprised if applying a thinner (but better like in the op)paste to the CPU and leaving the thicker liquid diamond to the GPU would give the best performance. The heatsink is such a crappy design in my laptop compared to desktop ones I've worked with. I think it's a foxcon.

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It's ot but just thought I'd update to say my liquid diamond paste arrived today and I applied it to my CPU and GPU. When removing my heatsink I could see the generic white paste i used made good contact on my CPU but not GPU. This corresponded with my results afterwards.

Peak CPU temps were more or less the same, with idle 2 or 3 degrees c less.

Peak GPU temps were a massive 27 degrees c lower topping out at 65c in heaven compared to 92c before. Clearly the old paste was making no contact at all.

I wouldn't be surprised if applying a thinner (but better like in the op)paste to the CPU and leaving the thicker liquid diamond to the GPU would give the best performance. The heatsink is such a crappy design in my laptop compared to desktop ones I've worked with. I think it's a foxcon.

PS I found the liquid diamond hard to apply. I knew it would be more viscous than normal but the damn stuff wouldn't stick to the chips so my applications were far from perfect but it's a great improvement. Thanks for the help. I can enjoy gaming again now!

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Soak the tube in warm water for 10 mins and it should be easier to work with after that.

 

Great idea, thanks.

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Yup, I do that too and it works like a charm then!

 

Hi guys,

I'm on the verge to buy the clevo p650re6 and my reseller offers artic mx-4 with it. After reading somewhat i've found out that that stuff pumps out real quick on lapops. Would you guys reccommend thermal grizzly kryonaut? or is gc-extreme or ic diamond better(id like to avoid that stuff) durability wise?

Im not really focussing on overclocking but rather a stable system that i can paste once and forget for years.

Inside:

 

Go for IC Diamond if you are looking for longevity.

 

Would you say kryonaut pumps out quick then? Is it so much better compared to kryonaut?

 

If the heat sink sits nice & flat & close on the GPU core then you shouldn't get any "pump out" - Clevo heatsinks are a bit notorious for not being flat though! Kryonaut is thin, so I would imagine it would pump out like MX4 on heatsinks that aren't flat. My Kryonaut is working perfectly on my laptop now for 6 months - but my heatsink is as flat as a pancake!

 

For me Kyronaut has been way better than ICD. But for a few people here , it pumped out after a month or so. I used it for about 3 months and still had the same temperatures as the day i switched to it. Currently im on CLU, but if i have to go back to a normal paste i only prefer Kryonaut or GCE.

 

lmao diamonds vs silver/carbon.....obviously icd is better

 

I've used Gelid and IC Diamond and IC Diamond has always lasted longer... It's just thicker and it really helps..

7

True that

 

I think part of the difference is Clevo typically uses a thin one piece copper heat plate on their newer systems. That is probably easier and cheaper to manufacture. Unfortunately, it bends too easily and doesn't hold its shape well. Some come from the factory deformed. If it is shaped correctly, this design works extremely well. When it is not shaped correctly, it is truly horrible. The problem is that it is inconsistent. It's usually awesome or terrible with not much in between. It's a heat sink lottery, LOL. Alienware typically uses an aluminum block with a very thick, but small copper heat plate that the heat pipes are soldered to, mounted into the aluminum block used for mounting and the surface areas not in contact with the die. The copper heat plate thickness and coupled with the fact that it is only big enough to cover the CPU or GPU die lends to better fit and resistance to being deformed or getting bent. I'm not impressed with what they are doing today with BGA turdbooks, but Alienware has always done an exemplary job with laptop cooling systems, even when some other things were not necessarily up to snuff.

 

How do I purchase a tube of Thermal Grizzly Kryonaut for international shipping, preferably at a reasonable price for the whole package (US$15-20 sounds good)? I'm going to purchase copper shims, lap 'em, lap my heatsink, and use Kryonaut instead of CLU which hasn't given me good results on my notebook.

 

Amazon/Ebay. Remember you can have it in different syringe size.

 

Switched back to Kyonaut yesterday. IC diamond 7 left a nice stain on the CPU die after removing it. The ****ty thing is that my heatsink isnt perfectly flat. I have a 6c core temp difference and this might cause pump out issues in the future. Need to monitor it. Hopefuly the stain on my CPU die isnt a deep scratch in the coating exposing the actual CPU :S.

 

Hi, i have got a tub of kryonaut 1g how many repaste can i use for cpu and gpu??? And how long before i should repaste again?

You guys mentioned about using the arctic cleaning solution but can i just use alcohol swaps? I have some lying around. Its those you get from pharmacies.

Would you guys recommend replacing the thermal pads? Ive got a gelid gp extreme 1mm. If i dont need it i still can return it before the end of the month