*** Official Clevo P870TM-R Owner's Lounge - Phoenix 5 ***

I just finished putting the thing together last night, will make a write up when I get an chance to bench and do some real testing.

 

I take it you have modified that IHS as you go to account for the lower die size?

 

Its a custom cnc milled bartx ihs that I had made for sole purpose of a lapped 9900k but at 4.37mm height.

 

What height did you guestimate for the die and how close did you get?

 

This is a guestimate, as I did not invest in a micrometer. The 8086k is the same die height as the 8700k, ~0.42mm
My lapped 9900k is closer to 0.32mm from eyeballing it.

I'll make a longer post detailing everything. So far I have some very interesting improvements to share!

 

Please do, it's where I'd consider taking it just to try and cool the beast so seeing the actual results is interesting.

 

Check here bro.

 

You would think with the battle with AMD they would do a batch of low profile dies to get the most out of them. Maybe they would just crack from the solder.

 

Improvements with a shaved die are night and day on these thermally dense chips. But as you said, perhaps shrinking/expanding silicon encased in solder would put too much stress onto the die, eventually fatiguing it enough until it cracks.

 

I suppose if processors died that would be a huge hit to their reliability reputation.

 

@ole!!! how is your VC mod coming along, friend?

 

its delayed. I purchase through their website then I sent an email asking when shipment will be made because during check out page they specifically mentioned would only sell to companies etc. they replied with a new invoice including freight and shipping so I'm waiting for their refund on my first payment to go through and then pay the new invoice..

 

Hopefully it's just a small hiccup. That VC has an interesting journey ahead of it I'm sure

What's your plan on soldering it to the TM1 heatsink? And adding an extra heatpipe to unify with the larger VC?

 

It's always the issue working with niche and special order things, you learn to get patient with it.

 

True, but it's hard to wait for new toys!

 

I only have a single GPU so its the giant GPU heatsink that uses two fan, non vapor one.

but yea i plan to solder VC piece to bottom of TM1 CPU heatsink for extra height and try bare die. the extra heat pipe goes towards middle fan. I prioritize CPU and fan noise a lot more than GPU. (probably revert back to single fan GPU heatsink, or reduce fan depth because theres still some space can be reduced before hitting the actual spinning part.)

 

If I had the skills and tools, I'd totally solder the dual gpu vapor chamber to the tm1 heatsink with 2-3 thick heatpipes leading the heat from the cpu heatsink to the vc.

 

I dont think theres a good way to go about that also that would make disassembly much more difficult. joint heatsink is great for capacity but terrible for repair and maintenance.

 

Yup, I agree with you on that. Doing so would add a whole heap of things to the mix, I kinda hoped that just by soldering two thick heatipes, would leave enough flexibility needed for both gpu/cpu contact when they both are screwed in place. But again, could be a complete waste.

 

Soldering a vapor chamber is very difficult to do without destroying it.

 

yea thats why always good to have multiple pieces to try. i even have an extra 870tm heatsink just in case.

 

Good luck, I hope it does work out.

 

IPC or not. We are also seeing much higher frequencies over ivy bridge too.

a 5Ghz 8700K is like 60% faster than a 3960X sandy bridge isn’t it?

And the sandy bridge IPC was very similar to ivy bridge IPC.

thats 6 cores vs 6 cores.

 

I can already tell this is going to be good. And will keep me motivated whilst trying to tune that 3600mhz ram.

 

Different platforms but the difference is less per clock.

 

But then came the mitigations, luckily for P0 you can toggle them. Not so much for the R0 and the KS.

 

You mean the proper cache handling changes rather than taking short cuts?

 

I'm just glad that we can switch them off for benching and not get gimped scores.

 

Gimped or artificially inflated due to cutting corners?

 

I'm mostly using this machine for benching and testing atm, so I'll take higher scores even at a cost.

 

What point does the line get drawn though? What about modifying the exe? Lowering the accuracy of calculations so they are faster? Setting the benchmark to wire frame?

 

As long as it's within hwbot rules it's all good. It's not cheating. Do you consider tweaking an OS to get a higher score over the line as well?

 

In a way yes, everyone would be best off on the same software platform.

 

All is fair in love and war

 

how about an hwbot provided OS base that is not to be tinkered with? haha

Sent from my Huawei Mate 20 X EVR-AL00 using Tapatalk

 

It would be interesting and actually be about the HW in the name fully.

 

That's one of the reasons consoles can squeeze a very high percentage of processing power out of the hardware they're running.

 

This covers the entire TM1 base plate as far as I understand, so it should be able to spread the heat more evenly+faster and make better use of the 4th heatpipe plus the ekstra heatsink. I think I've mentioned that current 9th gen IHS is ~29x29mm and barely covers 3 heatpipes. So theoretically there are good gains to be made from that alone.

 

Do you know the screw size for CPU and GPU for the TM1 heatsink?

 

Not sure, but try and have a look here:
http://forum.notebookreview.com/threads/screw-of-gpu-p870dm-g.805230/#post-10533068

 

I found the GPU size there earlier. But I am not certain about the cpu screw size. I know the bottom panel screws fit the cpu heatsink mount but they are slightly longer.

 

It should be listed under parts list in the service manual.
https://mega.nz/#!PE1FVLAY!hA3fMtewFpdQcJHY3S9qTgi0P0so-Z_FnKP1KnsbLU0

 

I am about to order some thermal pads. Are the fujipoly 17mk worth it? What thickness should I go for to make it work ok? I’m kinda confused by thermalpad thickness.

And I’m considering replacing the pad underneath my GPU. How thick is that one? It looks very thick.

Should I go for like 1.5mm and 0.5mm? I’m not using shims, and only LM.

 

For the GPU and CPU VRM's? Fujipoly Extreme pads are the best, but are they worth the extra cash? Probably not.
I've used Gelid GP-Extreme 12W/mK and they are hard to beat in price to performance. I don't know the exact thickness the unified heatsink uses, probably best to reach out to a reseller about this. Ideally you want to use pads that are ie. 2mm instead of stacking 2x1mm pads.

The bottom thermalpad is for the gpu vrms and is 4-4.5mm I believe.

 

So, I keep going back and forward on wanting to buy thermal pads lol. My old used up and worn out 3 times reused thermal pads are literally doing extremely good. I feel like I’m going to waste my money. I read a thread on here and someone with a P775TM1 spent like $70 bucks on fujipoly thermalpads. And while they improved their own temps. My current temps are still slightly better with higher GPU clocks.

 

Read the Service manual. I expect you meant for Clevo P750TMx.

Bro Jackson Maybe @tps3443 should re-use the pads as poor Poopy?

You still don't know the temps on components outside the cores.

 

I have a whole bag of old Gelid pads that have smelted into one giant pile of puddy. I wonder if they can be reused? hehe

 

I don't think that's how it works

 

I really don’t think it matters honestly. You could probably mush them all in to shape like all of mine are and get great temps.

 

Density probably matters, as you change it by compressing it with a different pressure. But I'm not sure.