*** Official Clevo X170SM-G/Sager NP9670M Owner's Lounge ***

I had some squishy polyurethane foam that I repurposed for this project, it needs to be very compressible, so that it in no way interferes with heatisnk mounting.
Very similar to what was linked here by @Falkentyne
https://www.amazon.com/Duck-Replacement-Conditioner-24-Inch-1285234/dp/B002GKC2US/

That's not duct tape but Kapton tape. Look at the previous post about CPU masking, where gold pin contacts are masked off. The foam pic is from my direct die mod, hence extra kapton tape around the socket for protection.

 

Yeah, you hit the top 73% of tested 10900K fell within our 5.0GHz bin or greater

As I mentioned in my previous post. The chances is great to get 5.0 on retail. I’ll bin my own chips. Worse than 5.0 means I returning it. Worst case sell it used (for other countries with less options).

 

Not gonna argue with those results and price.

Watch I’ll get the 4.9GHZ dud.

 

It'll likely do 5Ghz. But, if you do lose the silicon lottery, it will just require more voltage for that 5Ghz. And we have yet to see whether X170 has 'real' vcore readout or SP value, like the desktop boards to be able to compare chips. @Falkentyne

 

nah for sure you will get a 5.1 ghz! but it will run at 100c all cores lmao.

 

I do better when the odds aren’t in my favor.

I’d probably be ok with that. Someone would want to buy it.

 

The Core i9-10900K comes with more cores than the 9900K, overclocks better, has a stronger memory controller, runs cooler, and it’s priced handsomely. There is everything to like about these chips.
https://www.tomshardware.com/features/overclocking-intel-core-i9-10900k

At 1.45v for 5-5.1 GHz, that’s a full 100mv more than what I use at 5.4 GHz (1.35v) on my CPU that loves to eat voltage. Is this to trick reviewers, or to confuse the public? You decide.

4 core 6700K benching at 4.8/4.9GHz. If I remember it correctly I run my 6700K mostly on 4.8GHz.

8700K was also hot but some of us could still bench at 5.3 with 100% more cores.

Then we had 9900K benching at 5.2GHz. And the newcomer 10900K should run colder core for core. Don’t cry it will be too hot before you have tried

 

Not talking about warranty.

Talking about this.

https://tuningplan.intel.com/terms-and-conditions
https://tuningplan.intel.com/purchase-a-plan
https://tuningplan.intel.com/faq

They do not mention delidding or anything anywhere here. If it's not mentioned, then they can't refuse it if it's not prohibited in the terms. As long as you have the original IHS and it is readable...

Someone prove me wrong please.

 

seems like this one is a production unit

 

The Performance Tuning Protection Plan is an optional support plan which provides specific benefits in addition to Intel’s standard processor warranty.

Does delidding mean overclocking?


Q): Are using Overclocking and enabling Intel® XMP, which is a type of memory overclocking, and using it beyond the given specifications covered under warranty?

Altering the frequency and/or voltage outside of Intel specifications may void the processor warranty. Examples: Overclocking and enabling Intel® XMP, which is a type of memory overclocking, and using it beyond the given specifications may void the processor warranty. If an overclocked processor was enrolled in the Performance Tuning Protection Plan (PTPP), the protection plan will cover processor replacement only, not memory replacement.
https://www.intel.com/content/www/us/en/support/articles/000005494/processors.html

 

Maybe @Johnksss or @iunlock can answer, but AFAIK it's not covered. You could shoot them an email and ask, that way we have an official stance

 

Delidding is physical damage
https://community.intel.com/t5/Processors/Official-Stance-on-Delid/td-p/545452?profile.language=en

Regarding our Performance Tuning Protection Plan, it will not cover physical damage and it is intended to cover processors that were overclocked.

 

Is someone know what is the final change for the X170?

 

The final unit seems to not improve CPU Cooling capacities. But seems the GPU temps decreased about 5c.
The BEST would be Dual Titanium-Based Vapor Chambers: 1 for CPU, and 1 for GPU. This means 500-600W in total, so we can free overclock both at maximum speed. Instead we have unified copper with several heatsinks, which is not bad at all.

I was just thinking about NVIDIA, they already made a TU102 chip for laptop, the 24GB GDDR6 Quadro RTX 6000 @250W. So they can easily release the RTX 2080Ti for laptops if they want. So we can maybe see a GA102 mobile?

 

Ok so you can put liquid metal on top of the IHS but not remove the IHS. :/

 

Nothing concrete but the most common rumor I heard was the fans were getting improved. Changing the heat pipes at this stage would put the release date back months. So I wouldn't be surprised if the leaked videos and benchmarks are close to what we get as a customer. Some users on here have done some pretty insane mods on laptops before so maybe someone will do that same again? The bottom looks open enough that a laptop cooler would help move some air inside this thing. Depending how hot the end result is I'm probably going to make some kind of laptop cooling pad. But only if it's needed. Hopefully we have enough control on the bios level to tweak the setting to get these things running nice and efficiently.

 

Thank you, so I know enough for ordre it

 

That's the exact same AC foam I use for creating borders, dams and cushioned standoffs. It works great.

 

What ever happened to the improved vapor chamber design that was supposed to add something like 1.5 lbs to the weight of the X170?
Did I miss something?

 

When exactly did that start? I’m guessing someone suggested it as a possible reason for the delay and someone ran with it as fact. Like I mentioned before something like that would take months to not only design but mass produce. So at this point it likely just wasn’t in the cards they were gonna do such a drastic change.

 

If Clevo does improve the heatsink design, it'll be in the next revision of the chassis rather than this one.

 

Ready for Rocket

 

Do some people actually put a foam around the cpu? Wow ... picking the right foam can be tricky because you need a really soft one to assure that it does not affect the contact of the heatsink. Not to mention that I dont believe that a foam has good thermal conductivity.

My method is to make sure that the liquied metal does not spill out is to put heat resistant kapton team around the cpu die. next is to apply Thermal Grizzly COnductonaut on the die. Final step is to put Thermal Grizzly Kryonaut around the die. Kryonaut is hard and will not spread well enough to affect the TGC put on the die and it will create a wall around the TGC area guaranteeing that no metal could spill out. Not to mention that TGK will also transfer some heat to the heatsink from the cpu.
Yes, after a few days the Kryonaut will harden, however it will still serve its purpose and it will create a wall around the metal area and even in hardened form it still has better thermal conductivity then a foam and I do not have to worry about a foam not allowing the heatsink to reach maximum contact.

I used the same method with the 9900KS used in my P775TM. I put kapton tape around the IHS surface completely shielding the socket and then I put Kryonaut (or maybe it was MX2 this time, I forgot) around the are where liquid metal was used.
When the heatsink was put on a wall was formed so I did not have to worry about spillage.
After a few days the paste hardened so when I removed the kapton tape for a cpu swap then there was no spilling so I did not have to worry about parts of the paste dropping into the socket .

Here is a picture:


I forgot to take a picture when I swapped cpu after 2 months of usage but as I said there was a hardened wall made out of thermal paste around the ihs blocking all metal spillage and since it was hardened I did not had to worry about it spilling into the socked when I removed the kapton tape.
This was the best method for me because in my opinion this is the safest way to use metal on cpu and this method gave me the lowest temps between cores during usage.
You need to be more careful with a foam because that does not conduct heat as well as paste, it can lower the heatsink contact and if too much metal is used and some gets stuck in its side then it might drop off onto the motherboard when the foam is removed.

 

So the normal thermal paste was put over the kapton tape it looks like the way it was described


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Yes, it was put over the kapton tape. That was the point of the kapton tape, I made a new surface around the ihs to cover the socket.
I made sure that there is no gap between the ihs and kapton tape so no paste could spill inside.
I now remembered that I used mx2 instead of kryonaut with the Clevo because mx2 is softer and kapton tape is hard so the paste could not force itself between the kapton tape and ihs when the heatsink is put on.
The only thing I had to watch out is to make sure that there is absolutely no gap between the ihs and tape.

 

Squishy polyurethane foam creates a seal from top to bottom, around the socket to the heatsink. So you wall everything off from any conductive balls of liquid doom
Side note, I've used LM for about a year and a half without the foam, and yet to experience any spill. *knocks on wood*
It's just some free insurance, but you gotta remember that you don't need much LM in the first place and surface tension will hold it in place.

 

Did anyone else notice besides me that there are more chokes around the CPU on the X170 motherboard than on the p775 and p870 motherboard ?
This means that theoritically we should be able to see more cleaner and stable voltages during overclocking or undervolting resulting in less bsod.

 

10th gen offer 125W chips. I mean Clevo only officially supported 9900K on the older Clevo’s. (KS was 127w). Intel will of course recommend better power delivery on chips with PL2 at 250w and higher amps vs. 9th gen chips.

 

X170 Production unit unboxing, overview and assembly.

 

Uh Oh. I'm used to those spring screws being locked in place. Glad I know they can come out so I don't lose them.

And did his machine not have thermal pads? He may want to go back and fix that.

 

With the Area-51m it would go up in smoke in Seconds Maybe we wouldn’t even see one sec after power it up before the room was filled of smoke.

 

The el cheapo pads were stuck to the heatsink.

 

With the new black shiny thin fancy passive heatspreader below DGFF in Dellbook R2, the cooling is so damn good that you don’t need it But the thermal cap and powered down vBios will come hunting you. Dell and Win update knows where your machines are.

 

Do you really think there would be smoke or just Instantaneous combustion?

I hope so. Cheap pads are better than no pads.

 

At least you would have to call support to ask for new hardware

 

Ok sir, sir, is your computer plugged in? This very much common mistake.

It’s on fiiiiiiire!

 

Thermal pads are on the heatsink, not the machine out of the box from the factory.

 

It Dell support number stil 911?

 

Yes any thick normal paste works as a dam. I think I have like 20 grams of Arctic Ceramique I bought 15 years ago that still works for that.

 

Unboxing video with the extras given by Clevo;

 

lol I love that movie

Also the way and amount of thermal paste that was applied in that last video is lol as well. I dont think he put enough on...It was a good video though, thanks to who ever did that unboxing.

 

Enough paste but not a good application on the Cpu.

 

Ah yes, the ancient question of how much is enough

 

The problem is the flimsy weak pressure from heatsink on die/IHS in laptops. Too much ain’t of the best

 

I thought the age old question was HOW to apply it? Like there is just some magic method that gets you 10 degrees cooler just because you use the right method of application.

 

All depends. With flimsy cheapo made mounting mechanism you need to be more careful.

 

I’ve never understood exactly the thermal pad argument. Why not just put them everywhere and transfer all heat we can to the case


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If you mean just putting all the thermals you can on the heatsink to touch to outside casing of a laptop then it has been done. The current macbook air alot of people do exactly that. But there are two things to remember there. The heatsink on that laptop does not have a fan attached to the heatsink and the entire laptop is made of aluminum. So any amount of extra cooling is gonna help that thing out a good bit.

And not all laptops are made out of aluminum. A fair amount of them are, but it's still common to see metal lids and decks, but plastic bottoms. You wouldn't want to be transferring heat to a plastic bottom. And even if the laptop does have an aluminum bottom it will make the bottom very hot. So might not be the best idea if you use your machine on your lap alot.

But, from what I've seen it does work. It's just not efficient. But, hey if you're trying to get every drop of performance out of your machine I say there isn't any harm in trying.

 

Getting closer to the X170 it seems

Titan V in the background

 

I can't wait! This is definitely the config I'll get:



I'll buy my own ram and ssds from my supplier and swap out that i5 in the near future, much cheaper than those prices pcspecialist is giving! I just hope the bios isn't castrated!